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STP22NS25Z

STMicroelectronics

STP22NS25Z by STMicroelectronics

STP22NS25Z by STMicroelectronics is a robust N-channel FET designed for switching applications. It features a max drain current of 22 A, a breakdown voltage of 250 V, and operates at up to 150 °C. Ideal for high-power circuits with efficient thermal management.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,894 parts In-Stock

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3,894

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Vyrian

USA . 2,862 parts In-Stock

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2,862

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Anansix

USA . 2,350 parts In-Stock

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2,350

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Classic Components Corporation

USA . 795 parts In-Stock

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795

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Electronic Expediters

USA . 74 parts In-Stock

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Sunrise Surplus Inc.

USA . 30 parts In-Stock

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30

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IDEA Electronic Components Group

UK . 963 parts In-Stock

1+ parts

$1.682

100+ parts

-

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$1.514

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963

$1.682

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$1.514

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MKK Technologies

India . 848 parts In-Stock

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$3.162

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848

$3.162

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DigiPath Technology Company

USA . 848 parts In-Stock

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$3.162

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848

$3.162

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AZTECH Wire

Italy . 314 parts In-Stock

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$9.480

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314

$9.480

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Corphita

USA . 3,855 parts In-Stock

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3,855

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Alle Elektronik GmbH

Germany . 3,365 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,999 parts In-Stock

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Parana Technologies

USA . 443 parts In-Stock

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$2.011

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$2.011

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Kepictronics

USA . 147 parts In-Stock

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147

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Perfect Parts

USA . 80 parts In-Stock

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80

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unlock the power of innovation with the STP22NS25Z from STMicroelectronics, a leader in semiconductor excellence. This robust N-channel Power FET is engineered for seamless switching applications, delivering unmatched reliability and efficiency. With its superior performance in high-voltage environments, it ensures your designs are both powerful and dependable. Experience the quality that drives industries forward—choose STMicroelectronics for a competitive edge in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material offers durability and thermal stability, making the transistor reliable in various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally provide higher efficiency and faster switching speeds, making this transistor suitable for power management applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and provides additional protection against reverse voltage conditions.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is ideal for use in power electronics and control circuits.

Minimum DS Breakdown Voltage: 250 V

A high breakdown voltage enhances the product's ability to withstand voltage spikes, ensuring reliable performance in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, facilitating easier integration into designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability, making the transistor suitable for applications that require high reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation ensures the transistor is off by default, helping in power savings and improved efficiency when not switching.

Maximum Pulsed Drain Current (IDM): 88 A

A high pulsed drain current rating facilitates the handling of short-duration high-current pulses, beneficial for various power switching scenarios.

Avalanche Energy Rating (EAS): 350 mJ

A considerable avalanche energy rating allows the transistor to tolerate and recover from voltage transients, improving reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 22 A

The maximum drain current rating supports demanding applications that require significant current capabilities without thermal failure.

No. of Terminals: 3

With three terminals, this device offers straightforward integration while enabling efficient circuit configurations.

Maximum Power Dissipation (Abs): 135 W

The high power dissipation capability allows the device to manage significant power levels, supporting robust applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced thermal management and ease of installation, especially in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and low power consumption, contributing to energy-efficient designs.

Maximum Operating Temperature: 150 °C

A high operating temperature tolerance allows for reliability in demanding environments, reducing the risk of thermal failure.

Transistor Element Material: SILICON

Silicon material is a standard in FETs, offering good electrical properties and ensuring broad compatibility with existing designs.

Terminal Finish: MATTE TIN

Matte tin finishing improves solderability and corrosion resistance, which enhances the longevity of the product in various applications.

Maximum Drain Current (ID): 22 A

This repeated rating consolidates confidence in the maximum output capabilities of the FET for various applications.

Maximum Drain-Source On Resistance: 0.15 ohm

Low on-resistance minimizes conduction losses, which contributes to improved efficiency and performance in power applications.

Terminal Position: SINGLE

A single terminal position simplifies the PCB layout and reduces design complexity while still providing effective performance.

Technical Specifications

Power Field Effect Transistors (FET) STP22NS25Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP22NS25Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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