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STP20N60M2-EP

STMicroelectronics

STP20N60M2-EP by STMicroelectronics

STP20N60M2-EP by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 600V breakdown voltage, 52A max pulsed drain current, and operates from -55 °C to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,798 parts In-Stock

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8,798

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Digiode

USA . 4,692 parts In-Stock

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4,692

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Anansix

USA . 2,581 parts In-Stock

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2,581

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Cyclops Electronics Ltd

UK . 1,450 parts In-Stock

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1,450

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Chip Stock

USA . 210 parts In-Stock

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 314 parts In-Stock

1+ parts

$0.473

100+ parts

-

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$0.426

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-

314

$0.473

-

$0.426

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MKK Technologies

India . 376 parts In-Stock

1+ parts

$0.889

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-

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376

$0.889

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DigiPath Technology Company

USA . 376 parts In-Stock

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$0.889

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376

$0.889

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Microchip USA

USA . 8,516 parts In-Stock

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$7.508

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8,516

$7.508

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Component Stockers USA

USA . 8,455 parts In-Stock

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$12.680

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8,455

$12.680

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AZTECH Wire

Italy . 402 parts In-Stock

1+ parts

$20.670

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402

$20.670

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Ampacity Inc.

Singapore . 441 parts In-Stock

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$54.050

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441

$54.050

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Kepictronics

USA . 7,900 parts In-Stock

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7,900

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Corphita

USA . 4,387 parts In-Stock

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4,387

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Epart123

USA . 3,450 parts In-Stock

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$0.580

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$0.580

3,450

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$0.580

$0.580

GreenTree Electronics

Israel . 3,450 parts In-Stock

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3,450

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Alle Elektronik GmbH

Germany . 3,249 parts In-Stock

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3,249

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Parana Technologies

USA . 140 parts In-Stock

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$0.565

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140

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$0.565

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Overview

Unlock the potential of your designs with the STP20N60M2-EP from STMicroelectronics, a trusted leader in semiconductor innovation. This high-quality N-channel power FET boasts exceptional efficiency and reliability, making it ideal for demanding switching applications. With its robust performance under extreme conditions, you can count on this transistor to enhance your systems while reducing energy consumption—delivering exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and cost-effectiveness, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel types, making them desirable for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against inductive loads, providing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET excels in managing power efficiently, which is crucial for modern electronic devices.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage of 600 V allows this transistor to be used in high-voltage applications, making it ideal for industrial and automotive environments.

Package Shape: RECTANGULAR

The rectangular shape of the package facilitates easier circuit board layout and assembly, optimizing the design process.

Terminal Form: THROUGH-HOLE

Through-hole terminal design provides secure mechanical connection and excellent thermal performance, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for better control of current flow, providing greater efficiency in power management.

Maximum Pulsed Drain Current (IDM): 52 A

A high pulsed drain current capability makes this FET suitable for applications that require short bursts of high power, such as motor control.

Avalanche Energy Rating (EAS): 138 mJ

The avalanche energy rating indicates robustness against transient conditions, enhancing device longevity and reliability.

Maximum Drain Current (Abs) (ID): 13 A

Supporting up to 13 A of continuous drain current enables this FET to handle significant loads in various electronic applications.

No. of Terminals: 3

Having 3 terminals simplifies the circuit design and allows for straightforward integration into existing designs.

Maximum Power Dissipation (Abs): 110 W

With a high power dissipation capability, this FET can operate under heavy loads without overheating, ensuring reliable performance.

Package Style (Meter): FLANGE MOUNT

The flange mount design provides stability and ease of installation, making it an excellent choice for fixed installations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high switching speed and efficiency, making this FET suitable for modern power electronics.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to function in extreme environments, broadening its application range.

Transistor Element Material: SILICON

Silicon is a standard material for FETs, providing a balance of performance, reliability, and availability.

Minimum Operating Temperature: -55 °C

A wide operating temperature range from -55 °C to 150 °C makes this FET suitable for applications in diverse environmental conditions.

Maximum Drain Current (ID): 13 A

Reiteration of the maximum drain current capability emphasizes its strong performance for various load requirements.

Maximum Drain-Source On Resistance: 0.278 ohm

Low on-resistance reduces power loss during operation, enhancing efficiency in electronic circuits.

Terminal Position: SINGLE

Single terminal position simplifies the design and enhances the layout flexibility for engineers.

Case Connection: DRAIN

DRAIN case connection allows for straightforward integration into circuits, improving design efficiency and reducing complexity.

Technical Specifications

Power Field Effect Transistors (FET) STP20N60M2-EP attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

138 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.278 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

52 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP20N60M2-EP Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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