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STP200NF04L

STMicroelectronics

STP200NF04L by STMicroelectronics

STP200NF04L by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 120 A, breakdown voltage of 40 V, and power dissipation up to 300 W. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,628 parts In-Stock

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Chip Stock

USA . 4,947 parts In-Stock

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Anansix

USA . 2,342 parts In-Stock

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2,342

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Digiode

USA . 1,746 parts In-Stock

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1,746

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ComSIT Distribution GmbH

Germany . 104 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 496 parts In-Stock

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$1.147

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$1.033

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496

$1.147

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$1.033

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MKK Technologies

India . 2,234 parts In-Stock

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$2.157

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$2.157

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DigiPath Technology Company

USA . 2,234 parts In-Stock

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$2.157

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$2.157

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AZTECH Wire

Italy . 112 parts In-Stock

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$10.170

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A-Z Elektronik GmbH

Germany . 5,603 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,929 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Corphita

USA . 926 parts In-Stock

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Perfect Parts

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560

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Parana Technologies

USA . 368 parts In-Stock

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$1.372

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$1.372

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Overview

Unlock exceptional performance with the STP200NF04L from STMicroelectronics, a leader in innovation and reliability. This powerful N-channel FET delivers unmatched efficiency for your switching applications, ensuring smooth operation even under demanding conditions. Designed for versatility, it’s perfect for automotive, industrial, and consumer electronics. Trust in STMicroelectronics’ commitment to quality and elevate your projects with enhanced durability and energy savings today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and protects against environmental factors.

Polarity or Channel Type: N-CHANNEL

N-channel configuration allows for better electron mobility, resulting in higher efficiency and performance.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies circuit design by integrating a diode, offering improved reliability.

Transistor Application: SWITCHING

Optimized for switching applications, making it ideal for power management in various electronic circuits.

Minimum DS Breakdown Voltage: 40 V

A solid breakdown voltage ensures that the transistor can handle high-voltage applications without failure.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of PCB space.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide a sturdy connection, making it suitable for high-power applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode enables the device to operate efficiently with minimal power loss during on-state.

Maximum Pulsed Drain Current (IDM): 480 A

Capable of handling high pulse currents, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 1400 mJ

High avalanche energy rating increases reliability in transient voltage conditions.

Maximum Drain Current (Abs) (ID): 120 A

High maximum drain current allows this FET to handle large loads without overheating.

No. of Terminals: 3

Three terminals facilitate easy integration and simpler circuit designs.

Maximum Power Dissipation (Abs): 300 W

High power dissipation capability ensures reliability in high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides enhanced thermal management and simplified mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology allows for high-speed operation and lower power consumption.

Maximum Operating Temperature: 175 °C

A high operating temperature rating ensures reliability in tough environments.

Transistor Element Material: SILICON

Silicon offers excellent thermal performance and reliability, making it suitable for various applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance.

Maximum Drain Current (ID): 120 A

The ability to handle 120 A makes this FET ideal for high-current applications.

Maximum Drain-Source On Resistance: 0.0038 ohm

Low on-resistance minimizes power loss, ensuring efficient operation and thermal performance.

Terminal Position: SINGLE

Single terminal position simplifies circuit layout and helps with uniform heat distribution.

Technical Specifications

Power Field Effect Transistors (FET) STP200NF04L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

1400 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0038 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP200NF04L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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