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STP17NK40Z

STMicroelectronics

STP17NK40Z by STMicroelectronics

STP17NK40Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 400V breakdown voltage, 15A max drain current, and 150W power dissipation. Ideal for high-efficiency circuits in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,506 parts In-Stock

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8,506

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Digiode

USA . 3,583 parts In-Stock

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3,583

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Anansix

USA . 1,515 parts In-Stock

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1,515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,872 parts In-Stock

1+ parts

$1.763

100+ parts

-

1k+ parts

$1.586

10k+ parts

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1,872

$1.763

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$1.586

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MKK Technologies

India . 2,243 parts In-Stock

1+ parts

$3.315

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2,243

$3.315

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DigiPath Technology Company

USA . 2,243 parts In-Stock

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$3.315

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2,243

$3.315

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AZTECH Wire

Italy . 278 parts In-Stock

1+ parts

$14.570

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278

$14.570

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Microchip USA

USA . 459 parts In-Stock

1+ parts

$20.800

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459

$20.800

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Alle Elektronik GmbH

Germany . 3,768 parts In-Stock

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3,768

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RC Electronics

USA . 1,315 parts In-Stock

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1,315

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Corphita

USA . 805 parts In-Stock

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805

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Parana Technologies

USA . 305 parts In-Stock

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$2.108

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305

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$2.108

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Perfect Parts

USA . 68 parts In-Stock

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68

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Overview

Unlock the potential of your projects with the STP17NK40Z from STMicroelectronics, a trusted name in semiconductor innovation. This high-quality N-channel Power FET excels in switching applications, delivering efficient performance and reliability for demanding tasks. With its impressive breakdown voltage and robust design, it provides superior power handling capabilities, making it an ideal choice for industrial and automotive applications. Experience enhanced efficiency, reduced energy consumption, and long-lasting durability—choose STMicroelectronics for excellence you can rely on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good thermal stability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better efficiency and higher currents, making this product suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection and simplifies circuit design, ideal for switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET delivers fast response times and efficient control, perfect for power management.

Minimum DS Breakdown Voltage: 400 V

A high breakdown voltage allows for safe operation in high-voltage applications, providing reliability in demanding environments.

Package Shape: RECTANGULAR

The rectangular shape facilitates easier mounting and space optimization in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and easy soldering, ensuring reliable connections in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control over the FET's conduction, making it efficient in switching scenarios.

Maximum Pulsed Drain Current (IDM): 60 A

A high pulsed drain current rating indicates the ability to handle transient loads, making it ideal for dynamic load applications.

Avalanche Energy Rating (EAS): 450 mJ

The avalanche energy rating signifies resilience to voltage spikes, enhancing the FET's reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 15 A

This current rating ensures that the FET can handle regular operational loads effectively in applications requiring moderate current.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and connectivity, making it easier to integrate into existing designs.

Maximum Power Dissipation (Abs): 150 W

A high power dissipation capacity allows the FET to manage heat effectively, ensuring long-term reliability under high power loads.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers stability and ease of assembly, making it suitable for applications where secure mounting is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology is known for high input impedance and low power consumption, making this FET ideal for a wide range of electronics.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures that this FET can function reliably in demanding thermal environments.

Transistor Element Material: SILICON

Silicon transistors provide a good balance of performance, cost, and availability, making them a standard choice for many applications.

Terminal Finish: MATTE TIN

The matte tin finish offers improved solderability and corrosion resistance, enhancing the longevity of the connections.

Maximum Drain Current (ID): 15 A

This ensures the FET can handle the required currents in applications, balancing efficiency and performance.

Maximum Drain-Source On Resistance: 0.25 ohm

A low on-resistance minimizes power loss and heat generation, enhancing efficiency in power applications.

Terminal Position: SINGLE

Single terminal positioning makes it easier to integrate into compact designs and simplifies layout considerations.

Technical Specifications

Power Field Effect Transistors (FET) STP17NK40Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

450 mJ

Minimum DS Breakdown Voltage:

400 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP17NK40Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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