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STP16NK65Z

STMicroelectronics

STP16NK65Z by STMicroelectronics

STP16NK65Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 650V breakdown voltage, 52A pulsed drain current, and operates at up to 150 °C. Ideal for high-efficiency power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,591 parts In-Stock

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6,591

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Digiode

USA . 2,629 parts In-Stock

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2,629

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Anansix

USA . 2,053 parts In-Stock

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2,053

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ACDS - Activité Composants Distribution Service

France . 20 parts In-Stock

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20

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,776 parts In-Stock

1+ parts

$1.741

100+ parts

-

1k+ parts

$1.567

10k+ parts

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1,776

$1.741

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$1.567

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.776

100+ parts

$1.616

1k+ parts

$1.456

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-

500

$1.776

$1.616

$1.456

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MKK Technologies

India . 1,618 parts In-Stock

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$3.273

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1,618

$3.273

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DigiPath Technology Company

USA . 1,618 parts In-Stock

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$3.273

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1,618

$3.273

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Component Stockers USA

USA . 2,756 parts In-Stock

1+ parts

$5.340

100+ parts

$6.830

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$6.620

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2,756

$5.340

$6.830

$6.620

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AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$8.920

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792

$8.920

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A-Z Elektronik GmbH

Germany . 7,248 parts In-Stock

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7,248

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Alle Elektronik GmbH

Germany . 3,459 parts In-Stock

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3,459

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Parana Technologies

USA . 1,172 parts In-Stock

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$2.081

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1,172

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$2.081

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 136 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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100

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Perfect Parts

USA . 90 parts In-Stock

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90

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Overview

Unlock the potential of your projects with the STP16NK65Z from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET is designed for efficient switching applications, offering exceptional reliability and performance. With its advanced technology and built-in diode, you’ll experience enhanced energy savings and reduced heat generation. Elevate your designs confidently, knowing you’re backed by ST’s commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent insulation properties and durability, making this FET reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs provide higher efficiency and better performance in switching applications, making them suitable for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances reliability by protecting against reverse voltage.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle fast switching speeds, increasing circuit efficiency.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage ensures safety and reliability for high-voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on printed circuit boards (PCBs).

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and are ideal for prototypes and applications requiring higher durability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the device, improving its performance in various applications.

Maximum Pulsed Drain Current (IDM): 52 A

With a high pulsed drain current rating, this FET can handle short bursts of high current, making it suitable for dynamic load conditions.

Avalanche Energy Rating (EAS): 350 mJ

A high avalanche energy rating indicates robustness against voltage spikes, enhancing reliability in demanding environments.

Maximum Drain Current (Abs) (ID): 13 A

The maximum drain current rating of 13 A makes this FET suitable for applications requiring moderate to high current handling.

No. of Terminals: 3

With 3 terminals, this FET provides a simple design for connection, thus facilitating easier circuit integration.

Maximum Power Dissipation (Abs): 190 W

A maximum power dissipation of 190 W allows the FET to handle significant power levels without overheating, ensuring performance stability.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging enhances mounting stability and heat dissipation, making it suitable for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

As a MOSFET, it offers high efficiency and low on-resistance, which reduces power loss during operation.

Maximum Operating Temperature: 150 °C

A high operating temperature rating ensures the FET functions reliably in hot environments, making it versatile for various applications.

Transistor Element Material: SILICON

Silicon as the element material ensures excellent thermal and electrical conductivity, contributing to overall performance.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good corrosion resistance and enhances solderability, making assembly easier and more reliable.

Maximum Drain Current (ID): 13 A

A repeated rating of 13 A highlights its consistency in handling current, reinforcing its utility in power applications.

Maximum Drain-Source On Resistance: 0.5 ohm

Low on-resistance results in increased efficiency during operation, minimizing power losses and heat generation.

Terminal Position: SINGLE

A single terminal position simplifies layout design and integration into various circuits, enhancing design flexibility.

Technical Specifications

Power Field Effect Transistors (FET) STP16NK65Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

350 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

13 A

Maximum Drain Current (ID):

13 A

Maximum Drain-Source On Resistance:

.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

52 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP16NK65Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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