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STP16CP596XTTR

STMicroelectronics

STP16CP596XTTR by STMicroelectronics

STP16CP596XTTR from STMicroelectronics is a versatile LED display driver designed for automotive applications. It operates within a supply voltage range of 3-5.5V, supports serial data input, and features 16 segments for efficient graphics display. With a compact design and high-temperature tolerance (-40 °C to 125 °C), it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,351 parts In-Stock

1+ parts

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5,351

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Anansix

USA . 1,958 parts In-Stock

1+ parts

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-

1k+ parts

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1,958

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Digiode

USA . 741 parts In-Stock

1+ parts

-

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741

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 336 parts In-Stock

1+ parts

$2.245

100+ parts

-

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-

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-

336

$2.245

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-

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IDEA Electronic Components Group

UK . 1,153 parts In-Stock

1+ parts

$11.114

100+ parts

-

1k+ parts

$10.002

10k+ parts

-

1,153

$11.114

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$10.002

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MKK Technologies

India . 117 parts In-Stock

1+ parts

$20.898

100+ parts

-

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117

$20.898

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DigiPath Technology Company

USA . 117 parts In-Stock

1+ parts

$20.898

100+ parts

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117

$20.898

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AZTECH Wire

Italy . 609 parts In-Stock

1+ parts

$21.670

100+ parts

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609

$21.670

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-

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Component Stockers USA

USA . 449 parts In-Stock

1+ parts

$99.990

100+ parts

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449

$99.990

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Corphita

USA . 4,321 parts In-Stock

1+ parts

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4,321

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Parana Technologies

USA . 1,026 parts In-Stock

1+ parts

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100+ parts

$13.288

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1,026

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$13.288

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Overview

Elevate your display projects with the STP16CP596XTTR from STMicroelectronics, a trusted leader in innovative solutions. This robust graphics display driver excels in delivering sharp, dynamic visuals while ensuring reliability across automotive applications. With its compact design and efficient power management, it simplifies integration into your systems, enhancing performance without compromising on quality. Choose STMicroelectronics for superior support and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances the durability and reliability of the product, ensuring resistance to environmental factors.

Display Mode: SEGMENT

Segment display mode allows for clear visual representation and is ideal for devices that require straightforward numeric or graphical output.

Data Input Mode: SERIAL

Serial data input mode simplifies connections and communication with microcontrollers, making integration seamless.

Surface Mount: YES

Surface mount technology saves space on the PCB and supports high-density assembly.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this driver can operate effectively in a wide range of electronic systems.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of board space and facilitates easier layout designs.

Power Supplies (V): 3.5/5

Versatile power supply range enhances compatibility with various systems, providing flexibility in design choices.

No. of Terminals: 24

Having 24 terminals allows for sufficient connections for complex displays and additional features.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

This package style is designed for use in compact spaces while facilitating efficient heat dissipation.

Minimum Supply Voltage: 3 V

Operating down to a minimum supply voltage of 3 V accommodates low-power applications, making it energy-efficient.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature rating ensures reliability in demanding environments, such as automotive applications.

Minimum Operating Temperature: -40 °C

This driver performs well in extreme cold, ensuring reliable functionality in outdoor and harsh conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides excellent solderability and long-term corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility, which is beneficial for complex PCB designs.

Maximum Seated Height: 1.2 mm

A low seated height allows for compact designs that save space in electronic systems.

Width: 4.4 mm

A compact width supports space-constrained applications, making this driver ideal for portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for safe soldering without damage during assembly, ensuring product quality and reliability.

Peak Reflow Temperature °C: 260

The high peak reflow temperature indicates robustness against soldering processes, ensuring reliable assembly.

Length: 7.8 mm

The short length contributes to a space-efficient design, suitable for small form factor devices.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive temperature standards, ensuring reliability in vehicle applications under varying conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and better alignment during manufacturing, improving assembly efficiency.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V supports modern low-power designs, optimizing energy consumption.

No. of Segments: 16

With 16 segments, this driver allows for detailed display capabilities for various applications.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch is standard for many applications, ensuring compatibility with existing PCB designs.

Minimum fmax: 25 MHz

A minimum frequency of 25 MHz supports fast processing speeds, ensuring responsive display performance.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates suitability for standard floor life, easing handling and storage.

Interface IC Type: LED DISPLAY DRIVER

Designed specifically for LED displays, this driver ensures optimal performance and energy efficiency for lighting applications.

Technical Specifications

Graphics Display Drivers STP16CP596XTTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Display Mode:

SEGMENT

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Length:

7.8 mm

Moisture Sensitivity Level (MSL):

3

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.5/5

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16CP596XTTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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