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STP16CL596M

STMicroelectronics

STP16CL596M by STMicroelectronics

STP16CL596M from STMicroelectronics is a compact LED display driver designed for automotive applications. It operates at 3-3.6V, supports serial data input, and features 16 segments with a max temp of 125 °C. Ideal for efficient graphics displays in vehicles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,539 parts In-Stock

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7,539

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Anansix

USA . 2,642 parts In-Stock

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2,642

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Digiode

USA . 2,167 parts In-Stock

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2,167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 101 parts In-Stock

1+ parts

$4.698

100+ parts

-

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101

$4.698

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$5.416

100+ parts

$4.929

1k+ parts

$4.441

10k+ parts

-

40

$5.416

$4.929

$4.441

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IDEA Electronic Components Group

UK . 529 parts In-Stock

1+ parts

$12.668

100+ parts

-

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$11.402

10k+ parts

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529

$12.668

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$11.402

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AZTECH Wire

Italy . 910 parts In-Stock

1+ parts

$19.810

100+ parts

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910

$19.810

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MKK Technologies

India . 115 parts In-Stock

1+ parts

$23.822

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115

$23.822

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DigiPath Technology Company

USA . 115 parts In-Stock

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$23.822

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115

$23.822

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Corphita

USA . 4,862 parts In-Stock

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4,862

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Parana Technologies

USA . 614 parts In-Stock

1+ parts

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$15.147

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614

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$15.147

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Perfect Parts

USA . 255 parts In-Stock

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Overview

Elevate your display design with the STP16CL596M from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile graphics display driver ensures reliable performance across various applications, from automotive to consumer electronics. With its compact size and robust temperature range, it delivers exceptional value, enabling seamless integration into your projects while enhancing visual clarity and efficiency. Trust STMicroelectronics for innovation that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material provides robust protection against physical damage, ensuring longevity and reliability in various operating environments.

Data Input Mode: SERIAL

A serial data input mode simplifies connections and reduces pin count, making the integration with microcontrollers and other devices easier and more efficient.

Surface Mount: YES

Surface mount technology minimizes the footprint on printed circuit boards, allowing for more compact designs and efficient use of space in electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this driver ensures compatibility with a wide range of power sources, making it versatile for different applications.

Package Shape: RECTANGULAR

The rectangular package shape contributes to easier soldering and alignment during assembly, enhancing manufacturing efficiency.

Power Supplies (V): 3.3

Operating at 3.3 V is ideal for modern low-power electronics, ensuring compatibility with most digital devices while optimizing power consumption.

No. of Terminals: 24

The 24 terminals provide ample connectivity options for a variety of display configurations, promoting flexible design possibilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is compact and space-efficient, making it suitable for applications with limited board space.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3 V allows this driver to operate effectively in low-power applications, enhancing battery life in portable devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C makes this product suitable for automotive and industrial applications, ensuring reliability under extreme conditions.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this driver can function effectively in harsh cold environments, broadening its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances corrosion resistance and ensures good connectivity, which is crucial for maintaining performance over time.

Terminal Position: DUAL

Dual terminal positioning allows for better mounting flexibility and stability on the PCB, making it easier to design robust electronic circuits.

Maximum Seated Height: 2.65 mm

A maximum seated height of only 2.65 mm contributes to low-profile designs, ideal for sleek electronic enclosures.

Width: 7.5 mm

The compact width of 7.5 mm makes this driver suitable for cramped spaces and tight layouts in various electronic devices.

Length: 15.4 mm

With a length of 15.4 mm, this driver is designed for versatile applications, allowing for easy integration within various systems.

Temperature Grade: AUTOMOTIVE

Being rated for automotive-grade applications signifies high reliability and robustness, suitable for demanding automotive environments.

Terminal Form: GULL WING

Gull wing terminals allow for easy soldering and improved mounting, ensuring effective electrical connections and stability.

Nominal Supply Voltage: 3.3 V

A nominal supply voltage of 3.3 V provides a good balance between performance and energy efficiency, optimizing power usage.

No. of Segments: 16

With 16 segments, this driver is capable of controlling complex display patterns, making it a great choice for detailed graphics applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for good density in component placement, which is essential for compact PCB designs.

Minimum fmax: 25 MHz

With a minimum fmax of 25 MHz, this driver supports high-speed data transfer, ensuring responsive and smooth display performance.

Interface IC Type: LED DISPLAY DRIVER

As an LED display driver, this IC is purpose-built for controlling LED segments, providing optimized performance for visual displays.

Technical Specifications

Graphics Display Drivers STP16CL596M attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16CL596M Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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