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STP16CL596TTR

STMicroelectronics

STP16CL596TTR by STMicroelectronics

STP16CL596TTR from STMicroelectronics is a compact LED display driver designed for automotive applications. It operates at 3-3.6V, supports serial data input, and functions effectively in temperatures ranging from -40 °C to 125 °C. With 16 segments and a thin profile, it’s ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,125 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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7,125

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Anansix

USA . 1,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,190

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Digiode

USA . 470 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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470

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 690 parts In-Stock

1+ parts

$6.695

100+ parts

-

1k+ parts

$6.025

10k+ parts

-

690

$6.695

-

$6.025

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Microchip USA

USA . 374 parts In-Stock

1+ parts

$7.900

100+ parts

-

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374

$7.900

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MKK Technologies

India . 1,415 parts In-Stock

1+ parts

$12.589

100+ parts

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1,415

$12.589

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-

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DigiPath Technology Company

USA . 1,415 parts In-Stock

1+ parts

$12.589

100+ parts

-

1k+ parts

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10k+ parts

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1,415

$12.589

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-

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AZTECH Wire

Italy . 859 parts In-Stock

1+ parts

$12.930

100+ parts

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859

$12.930

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Corphita

USA . 4,543 parts In-Stock

1+ parts

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4,543

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Parana Technologies

USA . 42 parts In-Stock

1+ parts

-

100+ parts

$8.005

1k+ parts

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42

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$8.005

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Overview

Unlock vibrant visual experiences with the STP16CL596TTR from STMicroelectronics, a leader in innovation and quality. This graphics display driver excels in efficiency and reliability, making it perfect for automotive displays, smart home devices, and consumer electronics. With its compact design and robust performance under extreme temperatures, you can trust ST to deliver unmatched value, ensuring your projects stand out with stunning clarity and precision. Experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials offers good thermal performance and durability, making the driver reliable in various conditions.

Data Input Mode: SERIAL

Serial data input mode ensures efficient data transfer and simplifies connections, which is beneficial in compact designs.

Surface Mount: YES

Being surface mount allows for a smaller board footprint and enables more compact product designs.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage ensures compatibility with a wide range of power systems without risking damage to the device.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space on PCBs, allowing for better layout flexibility.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes it compatible with most microcontrollers and other electronic components.

No. of Terminals: 24

With 24 terminals, this driver can connect to multiple outputs, allowing for complex configurations in displays.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style facilitates high-density mounting and is ideal for compact electronic devices.

Minimum Supply Voltage: 3 V

A minimum supply voltage of 3V supports a range of power applications, increasing versatility.

Maximum Operating Temperature: 125 °C

A high operational temperature range ensures that the driver can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes this driver suitable for harsh climates and automotive applications.

Terminal Position: DUAL

Dual terminal position provides improved connection options, enhancing overall design flexibility.

Maximum Seated Height: 1.1 mm

With a low seated height, this driver can fit into thinner devices, meeting modern design requirements.

Width: 4.4 mm

A compact width allows for efficient space utilization in PCB layouts, enabling integration into smaller devices.

Maximum Time At Peak Reflow Temperature: 40 s

Optimized reflow time ensures that the device can be soldered effectively, reducing assembly defects.

Peak Reflow Temperature: 260 °C

Compatibility with high temperatures during manufacturing ensures robustness and reliability post-installation.

Length: 7.8 mm

The length is ideal for space-constrained applications, making it suitable for compact electronic designs.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this driver meets rigorous standards for reliability in vehicles.

Terminal Form: GULL WING

Gull wing terminals facilitate ease of soldering and improve mechanical stability in assembled circuits.

Nominal Supply Voltage: 3.3 V

The nominal voltage allows for stable operation, ensuring consistent performance across various applications.

No. of Segments: 16

With 16 segments, this driver can support complex display designs, enhancing versatility in visual communication.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for fine-pitched connections, enabling more flexible PCB layouts.

Minimum fmax: 25 MHz

A minimum frequency maximum of 25 MHz ensures fast data processing and responsiveness, crucial for dynamic displays.

Interface IC Type: LED DISPLAY DRIVER

As a dedicated LED display driver, it optimally manages power and control for LED outputs, ensuring high performance and efficiency.

Technical Specifications

Graphics Display Drivers STP16CL596TTR attributes and parameters. Explore more Graphics Display Drivers devices from STMicroelectronics

Specs

Data Input Mode:

SERIAL

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3/e4

Length:

7.8 mm

Multiplexed Display Capability:

NO

No. of Functions:

1

No. of Segments:

16

No. of Terminals:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Display Drivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Minimum fmax:

25 MHz

Trade Compliance

STP16CL596TTR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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