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STP12NK60Z

STMicroelectronics

STP12NK60Z by STMicroelectronics

STP12NK60Z by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a 600V breakdown voltage, 10A max drain current, and 150W power dissipation. Ideal for high-efficiency circuits in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,414 parts In-Stock

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4,414

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Vyrian

USA . 3,049 parts In-Stock

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3,049

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Anansix

USA . 880 parts In-Stock

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880

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$0.695

100+ parts

-

1k+ parts

$0.625

10k+ parts

-

445

$0.695

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$0.625

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MKK Technologies

India . 1,713 parts In-Stock

1+ parts

$1.306

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1,713

$1.306

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DigiPath Technology Company

USA . 1,713 parts In-Stock

1+ parts

$1.306

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1,713

$1.306

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AZTECH Wire

Italy . 547 parts In-Stock

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$17.280

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547

$17.280

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Component Stockers USA

USA . 281 parts In-Stock

1+ parts

$99.990

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281

$99.990

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Kepictronics

USA . 7,000 parts In-Stock

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7,000

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Alle Elektronik GmbH

Germany . 3,336 parts In-Stock

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3,336

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Corphita

USA . 1,210 parts In-Stock

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1,210

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 57 parts In-Stock

1+ parts

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100+ parts

$0.830

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57

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$0.830

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Overview

Unlock the power of innovation with the STP12NK60Z from STMicroelectronics, a leader in semiconductor technology. This high-performance N-channel power FET is engineered for efficiency and reliability in demanding applications, making it an ideal choice for switching tasks in industrial and consumer electronics. Enjoy enhanced durability, superior thermal management, and the backing of a trusted brand that prioritizes quality and performance—empowering your projects to soar to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and protection against environmental factors, making it suitable for diverse applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide higher efficiency and better performance in switching applications, making this product ideal for power management.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode simplifies circuit design, reducing the number of components required and enhancing reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET operates efficiently in high-speed electronic switches, making it a preferred choice in power circuits.

Minimum DS Breakdown Voltage: 600 V

With a breakdown voltage of 600 V, this FET can handle high voltage applications safely, ensuring robust performance under load.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space usage on circuit boards and facilitates easier mounting and integration.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide enhanced mechanical stability and are easier to solder, ensuring dependable performance in various environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and improved efficiency, especially in on/off applications.

Maximum Pulsed Drain Current (IDM): 40 A

The capability to handle pulsed currents up to 40 A makes this FET suitable for demanding power switching applications.

Avalanche Energy Rating (EAS): 260 mJ

A high avalanche energy rating indicates robust performance and reliability in the presence of voltage spikes, contributing to circuit protection.

Maximum Drain Current (Abs) (ID): 10 A

This specification ensures sufficient current handling capability for typical applications, balancing performance and thermal management.

No. of Terminals: 3

Three terminals simplify circuit design and connection, making it easier to integrate into existing designs.

Maximum Power Dissipation (Abs): 150 W

A high maximum power dissipation rate allows this FET to operate effectively in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style provides additional mechanical stability, making installation in equipment easier and more secure.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high switching speeds and excellent energy efficiency, which is ideal for modern electronic applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature implies reliability and longevity, even in demanding thermal environments.

Transistor Element Material: SILICON

Silicon as the element material ensures compatibility and widespread use in electronics, coupled with proven performance characteristics.

Terminal Finish: TIN

Tin terminal finish improves solderability and enhances corrosion resistance, contributing to longer product life and reliability.

Maximum Drain Current (ID): 10 A

This specification allows for efficient operation in power-intensive applications while maintaining safe operating conditions.

Maximum Drain-Source On Resistance: 0.64 ohm

A low on-resistance value minimizes power loss during operation, which improves overall efficiency in power applications.

Terminal Position: SINGLE

Single terminal position simplifies layout and installation, making it user-friendly for various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) STP12NK60Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE RATED, HIGH RELIABILITY

Avalanche Energy Rating (EAS):

260 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.64 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP12NK60Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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