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STP11NM60N

STMicroelectronics

STP11NM60N by STMicroelectronics

STP11NM60N from STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 600V breakdown voltage, 10A max drain current, and 100W power dissipation. Its robust design ensures reliability in high-temperature environments up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,970 parts In-Stock

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4,970

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Digiode

USA . 4,383 parts In-Stock

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4,383

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Anansix

USA . 2,503 parts In-Stock

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2,503

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Inventory MP

USA . 18 parts In-Stock

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Bristol Electronics

USA . 18 parts In-Stock

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IDEA Electronic Components Group

UK . 1,950 parts In-Stock

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$1.317

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$1.186

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$1.317

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$1.186

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MKK Technologies

India . 1,925 parts In-Stock

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$2.477

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$2.477

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DigiPath Technology Company

USA . 1,925 parts In-Stock

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$2.477

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$2.477

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AZTECH Wire

Italy . 646 parts In-Stock

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$11.680

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Metaverse IC Inc.

Canada . 30,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 17,947 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,044 parts In-Stock

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Corphita

USA . 4,303 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,419 parts In-Stock

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RC Electronics

USA . 875 parts In-Stock

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Kepictronics

USA . 700 parts In-Stock

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700

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Parana Technologies

USA . 386 parts In-Stock

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$1.575

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Overview

Unlock exceptional performance with the STP11NM60N from STMicroelectronics, a leading name in the semiconductor industry known for reliability and innovation. This N-channel power FET excels in diverse applications like switching, ensuring efficient energy management and robust operation. With a high breakdown voltage and built-in diode, it offers peace of mind and longevity. Elevate your designs with this powerful transistor, where quality meets unmatched value for your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product reliable in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs usually provide better performance characteristics, particularly in terms of faster switching speeds and lower on-resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design by reducing the need for additional components, leading to more compact and efficient arrangements.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently manage high-frequency operations, ensuring optimal performance in power control circuits.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET is ideal for use in high-voltage applications, providing better performance in demanding environments.

Package Shape: RECTANGULAR

The rectangular package shape aids in better space utilization on circuit boards, allowing for more efficient use in designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliability in connections, making it suitable for high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high on/off switching capabilities, making them suitable for a variety of electronic applications.

Maximum Pulsed Drain Current (IDM): 40 A

A high pulsed drain current capability allows the FET to handle surges, making it suitable for applications requiring transient current handling.

Avalanche Energy Rating (EAS): 200 mJ

This parameter indicates the FET's ability to withstand energy spikes, enhancing reliability in dynamic conditions.

Maximum Drain Current (Abs) (ID): 10 A

A maximum drain current of 10 A makes this FET suitable for various medium-power applications, ensuring dependable performance.

No. of Terminals: 3

With 3 terminals, this FET facilitates straightforward connections while supporting various circuit topologies without added complexity.

Maximum Power Dissipation (Abs): 100 W

A high power dissipation rating ensures that the FET can operate effectively in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers convenient mounting options, enhancing thermal conductivity and stability in installations.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides efficient conduction and low power consumption, making these FETs ideal for modern energy-sensitive applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can work in harsher conditions, increasing its applicability in various environments.

Transistor Element Material: SILICON

Silicon as the element material provides excellent electrical properties and thermal stability, making the FET reliable and efficient.

Terminal Finish: Matte Tin (Sn)

Matte tin finish enhances solderability and corrosion resistance, ensuring long-lasting connections in electronics.

Maximum Drain Current (ID): 10 A

The maximum drain current rating is consistent, highlighting the FET's reliability in Power FET applications.

Maximum Drain-Source On Resistance: 0.45 ohm

Low on-resistance reduces power losses during operation, increasing efficiency and performance in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies the design layout, allowing for easier integration into various circuit designs.

Case Connection: ISOLATED

An isolated case connection ensures safety by minimizing the risk of short circuits, which is critical in high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STP11NM60N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.45 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STP11NM60N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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