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STM6777SFWB6F

STMicroelectronics

STM6777SFWB6F by STMicroelectronics

STM6777SFWB6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V, operating from 0.8V to 5.5V. It features a low profile design and operates in extreme temperatures from -40 °C to 85°C, ideal for industrial applications. With adjustable thresholds and minimal supply current of 35µA, it ensures efficient power support in various devices.

Median Price

$0.734

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,000 parts In-Stock

1+ parts

-

100+ parts

$0.953

1k+ parts

$0.791

10k+ parts

$0.706

9,000

-

$0.953

$0.791

$0.706

Future Electronics

Canada . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.515

3,000

-

-

-

$0.515

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

3,077

-

-

-

-

Vyrian

USA . 2,698 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,698

-

-

-

-

Anansix

USA . 1,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,927

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 3,150 parts In-Stock

1+ parts

$0.474

100+ parts

-

1k+ parts

-

10k+ parts

-

3,150

$0.474

-

-

-

Ampacity Inc.

Singapore . 2,665 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

-

10k+ parts

-

2,665

$0.476

-

-

-

Component Stockers USA

USA . 24 parts In-Stock

1+ parts

$1.690

100+ parts

-

1k+ parts

-

10k+ parts

-

24

$1.690

-

-

-

Microchip USA

USA . 5,703 parts In-Stock

1+ parts

$5.349

100+ parts

-

1k+ parts

-

10k+ parts

-

5,703

$5.349

-

-

-

IDEA Electronic Components Group

UK . 1,680 parts In-Stock

1+ parts

$10.398

100+ parts

-

1k+ parts

$9.358

10k+ parts

-

1,680

$10.398

-

$9.358

-

AZTECH Wire

Italy . 391 parts In-Stock

1+ parts

$16.780

100+ parts

-

1k+ parts

-

10k+ parts

-

391

$16.780

-

-

-

MKK Technologies

India . 174 parts In-Stock

1+ parts

$19.552

100+ parts

-

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-

10k+ parts

-

174

$19.552

-

-

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DigiPath Technology Company

USA . 174 parts In-Stock

1+ parts

$19.552

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$19.552

-

-

-

RC Electronics

USA . 11,500 parts In-Stock

1+ parts

-

100+ parts

$5.670

1k+ parts

$5.150

10k+ parts

$4.970

11,500

-

$5.670

$5.150

$4.970

Kepictronics

USA . 9,000 parts In-Stock

1+ parts

-

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9,000

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Corphita

USA . 3,842 parts In-Stock

1+ parts

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3,842

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

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Eastek

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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3,000

-

-

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GreenTree Electronics

Israel . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,000

-

-

-

-

Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

-

100+ parts

$12.432

1k+ parts

-

10k+ parts

-

2,174

-

$12.432

-

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Perfect Parts

USA . 170 parts In-Stock

1+ parts

-

100+ parts

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170

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Overview

Elevate your power management solutions with the STM6777SFWB6F from STMicroelectronics—where quality meets innovation. Designed for versatility in demanding applications, this compact IC excels in efficiency and reliability, ensuring optimal performance in various environments. With ST's renowned commitment to excellence and cutting-edge technology, experience reduced energy consumption and enhanced system longevity, empowering your projects with unmatched value and dependable results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable solution, enhancing the reliability of the product in various applications.

Surface Mount: YES

Surface mount technology allows for smaller PCB footprints and easier assembly, making this IC suitable for compact designs.

Package Shape: RECTANGULAR

The rectangular shape enables efficient use of space on the PCB, allowing for a better layout and integration with other components.

Nominal Supply Voltage (Vsup): 3.3 V

3.3 V is a common voltage level used in many digital and analog circuits, ensuring compatibility with a wide range of applications.

Power Supplies (V): 0.8/5.5

The wide range of supported supply voltages allows for flexibility in design, accommodating various system requirements.

No. of Terminals: 6

Six terminals provide sufficient connectivity for essential functions while maintaining a compact size suitable for space-constrained applications.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

The low-profile, shrink pitch design ensures an ultra-compact footprint, ideal for modern, space-efficient electronic devices.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C allows this IC to be used in industrial and high-temperature environments, enhancing its versatility.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for use in harsh environments, including automotive and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The robust terminal finish ensures excellent solderability and corrosion resistance, contributing to the longevity and reliability of the component.

Terminal Position: DUAL

Dual terminal positioning enhances connectivity and stability on the PCB, making installation and integration easier.

Maximum Seated Height: 1.45 mm

A low seated height enables a flat profile for surface mounting, perfect for slim and compact device designs.

Width: 1.6 mm

A narrow width helps fit this IC into tight spaces, providing design flexibility for engineers.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it is essential for maintaining stable voltages in a variety of electronic systems.

Minimum Supply Voltage (Vsup): 0.8 V

Supports lower supply voltages starting at 0.8 V, making it suitable for battery-operated devices and low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds ensures stability during assembly processes.

Peak Reflow Temperature (°C): 260

Withstand peak temperatures of 260 °C allows for compatibility with standard soldering processes, enhancing manufacturing efficiency.

Length: 2.9 mm

A short length aids in achieving a compact design without sacrificing performance, an essential facet for modern electronics.

Nominal Threshold Voltage (V): +2.925, 1.050 V

Dual nominal threshold voltages provide versatile operation modes, making the IC adaptable to various logic levels.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability and performance in demanding environments, suitable across various industries.

Maximum Supply Current (Isup): 0.035 mA

Low supply current consumption (0.035 mA) ensures energy efficiency, making it ideal for battery-powered and low-power applications.

Terminal Form: GULL WING

Gull wing terminals provide ease of handling and excellent solder joint integrity, contributing to a robust and reliable connection.

Terminal Pitch: 0.95 mm

A terminal pitch of 0.95 mm facilitates tighter packing on PCBs, enabling more functionality in less space.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum of 5.5 V expands its compatibility across a broader range of devices and applications.

Adjustable Threshold: YES

This feature allows for precise tuning of the threshold voltage, providing flexibility to accommodate different operational needs.

Technical Specifications

Power Management ICs STM6777SFWB6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGES ARE 2.925V AND 1.050V; MANUAL RESET INPUT

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.8/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.45 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.035 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925,1.050V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

STM6777SFWB6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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