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STM32L052T6Y7TR

STMicroelectronics

STM32L052T6Y7TR by STMicroelectronics

STM32L052T6Y7TR by STMicroelectronics is a 32-bit microcontroller with 36 terminals, operating at up to 32 MHz. It features 10-Ch 12-Bit ADC, 1-Ch DAC, and connectivity options like I2C, SPI, UART. Ideal for industrial applications requiring low power consumption and high performance in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,375 parts In-Stock

1+ parts

-

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7,375

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Digiode

USA . 4,285 parts In-Stock

1+ parts

-

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-

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4,285

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Anansix

USA . 2,186 parts In-Stock

1+ parts

-

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2,186

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 410 parts In-Stock

1+ parts

$9.100

100+ parts

-

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-

10k+ parts

-

410

$9.100

-

-

-

IDEA Electronic Components Group

UK . 1,211 parts In-Stock

1+ parts

$13.952

100+ parts

-

1k+ parts

$12.557

10k+ parts

-

1,211

$13.952

-

$12.557

-

Microchip USA

USA . 5,959 parts In-Stock

1+ parts

$18.814

100+ parts

-

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-

10k+ parts

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5,959

$18.814

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MKK Technologies

India . 933 parts In-Stock

1+ parts

$26.235

100+ parts

-

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10k+ parts

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933

$26.235

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-

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DigiPath Technology Company

USA . 933 parts In-Stock

1+ parts

$26.235

100+ parts

-

1k+ parts

-

10k+ parts

-

933

$26.235

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Vigor

Singapore . 8,405 parts In-Stock

1+ parts

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8,405

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Corphita

USA . 4,101 parts In-Stock

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4,101

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Parana Technologies

USA . 2,163 parts In-Stock

1+ parts

-

100+ parts

$16.682

1k+ parts

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2,163

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$16.682

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Overview

Unleash the power of innovation with the STM32L052T6Y7TR by STMicroelectronics, a high-quality microcontroller designed for a wide range of applications. With STMicroelectronics' reputation for excellence in manufacturing, this product offers unparalleled value and benefits to customers. From its compact design to its advanced features like DAC and ADC channels, this microcontroller delivers superior performance and reliability. Whether you're working on IoT devices, industrial automation, or consumer electronics, the STM32L052T6Y7TR is the perfect choice for your next project. Elevate your designs with this cutting-edge microcontroller and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material for package body makes the product lightweight and durable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 3.6 V

Supports a maximum supply voltage of 3.6 V, providing flexibility in power requirements.

Package Shape: RECTANGULAR

Rectangular package shape enables efficient use of space on the PCB.

Bit Size: 32

32-bit architecture offers high performance and processing capabilities.

DAC Channels: YES

Digital to Analog Converter channels support analog output functionalities.

No. of Terminals: 36

High number of terminals allow for versatile connectivity options.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enhances the product's compactness and reliability.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage requirement enables operation in various power scenarios.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in harsh environments.

CPU Family: CORTEX-M0

Utilizes Cortex-M0 CPU family for efficient and optimized processing capabilities.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for usage in extreme cold conditions.

ADC Channels: YES

Analog to Digital Converter channels facilitate accurate digital conversion of analog signals.

DMA Channels: YES

Direct Memory Access channels enhance data transfer speeds and efficiency.

Terminal Position: BOTTOM

Bottom terminal position provides ease of connection and layout on the PCB.

ROM Words: 32768

Ample ROM capacity of 32,768 words for program storage and execution.

Package Material: PLASTIC/EPOXY

Utilizes plastic/epoxy material for durability and lightweight design.

Maximum Clock Frequency: 32 MHz

High maximum clock frequency of 32 MHz enables fast processing speed and performance.

Length: 2.868 mm

Compact length of 2.868 mm enables space-efficient PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability in industrial applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and streamlined microcontroller operations.

No. of Timers: 6

Multiple timers allow for precise timing and control in various applications.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and connection stability.

Analog to Digital Convertors: 10-Ch 12-Bit

Multiple 10-channel 12-bit ADCs enable accurate analog-to-digital conversions for sensor interfacing.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3 V ensures consistent performance and compatibility with various systems.

PWM Channels: YES

Support for PWM channels allows for precise control of analog outputs.

Connectivity: I2C(2); SPI(3); UART; USART(2); USB

Multiple connectivity options including I2C, SPI, UART, USART, and USB for flexible communication interfaces.

ROM Programmability: FLASH

Flash ROM programmability enables easy and quick firmware updates and modifications.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4 mm enables high-density PCB design and layout.

Speed: 32 rpm

Operates at a speed of 32 rotations per minute, suitable for various motor control applications.

No. of I/O Lines: 29

Abundance of I/O lines allows for versatile input and output configurations for interfacing with external devices.

Technical Specifications

Microcontrollers STM32L052T6Y7TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M0

Maximum Clock Frequency:

32 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

R-PBGA-B36

Length:

2.868 mm

No. of DMA Channels:

7

No. of I/O Lines:

29

No. of Terminals:

36

No. of Timers:

6

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

.585 mm

Speed:

32 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.596 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

I2C(2); SPI(3); UART; USART(2); USB

Peripherals:

BOR, COMPARATOR(2), DMA(7), POR, RTC, TIMER(6), WDT(2)

Analog To Digital Convertors:

10-Ch 12-Bit

Digital To Analog Convertors:

1-Ch 12-Bit

Trade Compliance

STM32L052T6Y7TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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