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STL285N4F7AG

STMicroelectronics

STL285N4F7AG by STMicroelectronics

STL285N4F7AG by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 120 A, a breakdown voltage of 40 V, and operates at temperatures from -55 °C to 175 °C. Ideal for high-power circuits, it ensures reliable performance with low on-resistance.

Median Price

$2.580

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 3,000 parts In-Stock

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Mobius Materials

USA . 105,000 parts In-Stock

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$2.580

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$2.070

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105,000

$2.580

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

USA . 3,462 parts In-Stock

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Anansix

USA . 337 parts In-Stock

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337

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Digiode

USA . 176 parts In-Stock

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IDEA Electronic Components Group

UK . 2,083 parts In-Stock

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$0.808

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$0.727

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2,083

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$0.727

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MKK Technologies

India . 698 parts In-Stock

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$1.519

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698

$1.519

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DigiPath Technology Company

USA . 698 parts In-Stock

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$1.519

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Microchip USA

USA . 7,361 parts In-Stock

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$9.835

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$9.835

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AZTECH Wire

Italy . 395 parts In-Stock

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$14.910

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A-Z Elektronik GmbH

Germany . 15,929 parts In-Stock

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Corphita

USA . 4,222 parts In-Stock

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Authorized Procurement Solutions

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Parana Technologies

USA . 1,745 parts In-Stock

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$0.966

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Alle Elektronik GmbH

Germany . 1,711 parts In-Stock

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Overview

Unlock superior performance with the STL285N4F7AG from STMicroelectronics, a leader in innovation and quality. This N-channel Power FET delivers exceptional switching efficiency and robustness, ideal for high-demand applications like automotive and industrial power management. Designed for reliability with AEC-Q101 certification, it ensures longevity and stability even in extreme conditions. Experience unmatched power handling and minimal resistance, making your designs more efficient and cost-effective!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, leading to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves system reliability by providing protection against unexpected voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, this FET can handle high-speed switching, making it versatile for power management and control.

Surface Mount: YES

Surface mount technology allows for compact design and easier integration into automated manufacturing processes.

Minimum DS Breakdown Voltage: 40 V

A breakdown voltage of 40V ensures robustness in high-voltage applications, safeguarding against voltage surges.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient layout and design flexibility in circuit boards.

Terminal Form: FLAT

Flat terminals ensure efficient thermal conduction and stable mounting, contributing to better performance and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation enables better control of conductivity, leading to higher efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 480 A

With a maximum pulsed drain current of 480A, this FET can support high-current applications, enhancing performance in demanding environments.

Avalanche Energy Rating (EAS): 280 mJ

A high avalanche energy rating provides assurance of reliability under fault conditions and allows for a safer operation in various environments.

No. of Terminals: 8

Eight terminals offer greater flexibility in circuit design and allow for additional connectivity options.

Maximum Power Dissipation (Abs): 188 W

A power dissipation capability of 188W ensures that the device can handle substantial power loads without overheating.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces space requirements on PCBs, enabling more compact and efficient designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and excellent switching characteristics, making it ideal for efficient power control.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C expands the range of applications in harsh environments where high temperatures are common.

Transistor Element Material: SILICON

Silicon as the transistor material ensures proven performance and reliability in electronic applications.

Minimum Operating Temperature: -55 °C

A minimum operating temperature of -55 °C allows the product to function in extreme conditions, making it suitable for a variety of applications.

Maximum Drain Current (ID): 120 A

The capability of delivering up to 120A of drain current makes this FET ideal for high-demand applications requiring substantial power.

Maximum Drain-Source On Resistance: 0.0011 ohm

A low on-resistance of 0.0011 ohm translates to enhanced efficiency and reduced power loss, crucial for high-efficiency designs.

Terminal Position: DUAL

Dual terminal position facilitates easier connections and improved signal integrity in complex circuits.

Case Connection: DRAIN

Direct case connection to drain enhances thermal performance and ensures efficient power delivery.

Maximum Feedback Capacitance (Crss): 35 pF

A low feedback capacitance allows for faster switching speeds, improving the overall responsiveness of the circuit.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 indicates reliability and performance suited for automotive applications, ensuring quality in demanding environments.

Technical Specifications

Power Field Effect Transistors (FET) STL285N4F7AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

BULK: 3000

Avalanche Energy Rating (EAS):

280 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

35 pF

JESD-30 Code:

R-PDSO-F8

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

480 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL285N4F7AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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