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STL150N3LLH6

STMicroelectronics

STL150N3LLH6 by STMicroelectronics

STL150N3LLH6 by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 150 A, a breakdown voltage of 30 V, and low on-resistance of 0.0035 Ω. Ideal for high-performance power management in compact designs.

Median Price

$1.015

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 1,579 parts In-Stock

1+ parts

$1.110

100+ parts

$0.472

1k+ parts

$0.366

10k+ parts

-

1,579

$1.110

$0.472

$0.366

-

Element14

Singapore . 1,579 parts In-Stock

1+ parts

-

100+ parts

$0.920

1k+ parts

$0.605

10k+ parts

-

1,579

-

$0.920

$0.605

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,298 parts In-Stock

1+ parts

-

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-

1k+ parts

-

10k+ parts

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6,298

-

-

-

-

Anansix

USA . 1,411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,411

-

-

-

-

Digiode

USA . 729 parts In-Stock

1+ parts

-

100+ parts

-

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-

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729

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-

-

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Prism Electronics

USA . 50 parts In-Stock

1+ parts

-

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-

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-

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50

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,682 parts In-Stock

1+ parts

$0.375

100+ parts

-

1k+ parts

$0.338

10k+ parts

-

1,682

$0.375

-

$0.338

-

MKK Technologies

India . 2,359 parts In-Stock

1+ parts

$0.706

100+ parts

-

1k+ parts

-

10k+ parts

-

2,359

$0.706

-

-

-

DigiPath Technology Company

USA . 2,359 parts In-Stock

1+ parts

$0.706

100+ parts

-

1k+ parts

-

10k+ parts

-

2,359

$0.706

-

-

-

AZTECH Wire

Italy . 939 parts In-Stock

1+ parts

$8.500

100+ parts

-

1k+ parts

-

10k+ parts

-

939

$8.500

-

-

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A-Z Elektronik GmbH

Germany . 7,263 parts In-Stock

1+ parts

-

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7,263

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-

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Perfect Parts

USA . 6,272 parts In-Stock

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6,272

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Corphita

USA . 4,196 parts In-Stock

1+ parts

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4,196

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-

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Kepictronics

USA . 3,500 parts In-Stock

1+ parts

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100+ parts

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3,500

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-

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Alle Elektronik GmbH

Germany . 3,201 parts In-Stock

1+ parts

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100+ parts

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3,201

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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2,800

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Parana Technologies

USA . 1,762 parts In-Stock

1+ parts

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100+ parts

$0.449

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1,762

-

$0.449

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Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Unlock unparalleled efficiency with the STL150N3LLH6 from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance N-channel power FET is designed for seamless switching applications, offering remarkable current handling and low on-resistance for enhanced energy savings. Ideal for diverse sectors, including automotive and industrial, it promises reliability and durability, ensuring your projects flourish with superior performance and minimized heat dissipation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, enhancing reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-resistance and higher efficiency, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection and enhances the versatility of the transistor in various circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid changes in voltage, making it suitable for modern electronics.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into automated manufacturing processes.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30 V ensures reliable operation in various environments without risk of failure.

Package Shape: RECTANGULAR

The rectangular shape is optimal for PCB layout and space efficiency, facilitating improved performance in compact designs.

Terminal Form: NO LEAD

No lead design reduces PCB space and allows for improved thermal management and performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation provides greater control over the transistor and enhances switching performance.

Maximum Pulsed Drain Current (IDM): 132 A

The ability to handle up to 132 A of pulsed drain current makes this FET suitable for high-power applications.

Maximum Drain Current (Abs) (ID): 150 A

With a maximum continuous drain current of 150 A, this FET can support demanding applications in power management.

No. of Terminals: 5

Having 5 terminals enhances connectivity options, allowing for versatile circuit configurations.

Maximum Power Dissipation (Abs): 80 W

An 80 W maximum power dissipation rating aids in managing heat effectively, ensuring stable operation under heavy loads.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving design capabilities for compact electronic assemblies.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology provides high efficiency and faster switching speeds, enabling better performance in electronic applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows for use in harsh environments, increasing versatility.

Transistor Element Material: SILICON

Silicon is a standard and reliable material for transistors, ensuring consistency and performance in a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and ensures reliable electrical connections.

Maximum Drain Current (ID): 150 A

Reiterating its high maximum drain current of 150 A ensures reliability in high-load scenarios.

Maximum Drain-Source On Resistance: 0.0035 ohm

A low on-resistance of 0.0035 ohms minimizes power loss and enhances efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position improves layout flexibility and can simplify PCB design processes.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, guiding safe handling and storage practices.

Case Connection: DRAIN

A drain connection at the case allows for efficient routing of electrical signals and improved thermal performance.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature ensures compatibility with modern soldering techniques.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates suitability for high-temperature solder processes, enhancing manufacturing flexibility.

Technical Specifications

Power Field Effect Transistors (FET) STL150N3LLH6 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

150 A

Maximum Drain Current (ID):

150 A

Maximum Drain-Source On Resistance:

.0035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

132 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STL150N3LLH6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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