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STID135

STMicroelectronics

STID135 by STMicroelectronics

STID135 by STMicroelectronics is a telecom interface IC with surface mount capability. It operates in industrial temperature range (-40 to 85°C) and has a square chip carrier package style. This telecom circuit is suitable for various applications requiring a single function telecom interface.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,711 parts In-Stock

1+ parts

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1,711

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Vyrian

USA . 983 parts In-Stock

1+ parts

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983

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Anansix

USA . 309 parts In-Stock

1+ parts

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309

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Nova Conductors

Japan . 20 parts In-Stock

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20

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,428 parts In-Stock

1+ parts

$13.224

100+ parts

-

1k+ parts

$11.902

10k+ parts

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1,428

$13.224

-

$11.902

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AZTECH Wire

Italy . 621 parts In-Stock

1+ parts

$14.192

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621

$14.192

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MKK Technologies

India . 1,770 parts In-Stock

1+ parts

$24.867

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1,770

$24.867

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DigiPath Technology Company

USA . 1,770 parts In-Stock

1+ parts

$24.867

100+ parts

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10k+ parts

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1,770

$24.867

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Ampacity Inc.

Singapore . 1,459 parts In-Stock

1+ parts

$405.000

100+ parts

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1,459

$405.000

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Corphita

USA . 3,630 parts In-Stock

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3,630

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Parana Technologies

USA . 1,935 parts In-Stock

1+ parts

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100+ parts

$15.811

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1,935

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$15.811

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

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1,000

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Overview

Experience the pinnacle of quality and innovation with the STID135 by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers unmatched advantages through their cutting-edge technology and expertise. The STID135 is part of the category of Other Function Telecom Interface ICs, making it a versatile solution for various applications. With its surface mount capability and quad terminal position, this product offers seamless integration and reliable performance. Designed to withstand extreme temperatures from -40°C to 85°C, the STID135 is perfect for industrial environments. Say goodbye to traditional lead terminals as this product features a no lead terminal form, ensuring ease of use and convenience. Discover the value, benefits, and advantages that the STID135 brings to your projects today.

Feature Benefit Bullets

Surface Mount: YES

This product is surface mountable, allowing for easy installation and integration into various telecom systems.

No. of Functions: 1

With a single function, this product offers a specific and focused solution for telecom interface requirements.

Package Shape: SQUARE

The square package shape of this product facilitates efficient PCB layout designs, optimizing space utilization in telecom applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style enhances thermal performance and protects the integrated circuit, making it ideal for telecom interfaces.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high heat environments commonly encountered in telecom applications, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

Operating down to -40°C, this product is suitable for telecom systems functioning in extreme temperature conditions, providing reliability and durability.

Terminal Position: QUAD

The quad terminal position allows for efficient and secure connection to the telecom system, ensuring stable and reliable signal transmission.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this product ensures robust performance in demanding telecom environments, meeting stringent operational requirements.

Terminal Form: NO LEAD

The no-lead terminal form enhances the product's reliability by eliminating the risk of lead-related issues, making it a safe and reliable choice for telecom interface ICs.

Telecom IC Type: TELECOM CIRCUIT

This product is specifically designed as a telecom circuit IC, guaranteeing compatibility and optimized performance in telecommunication systems, making it an excellent choice for telecom interface applications.

Technical Specifications

Other Function Telecom Interface ICs STID135 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N

No. of Functions:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STID135 Telecommunications trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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