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STI6N62K3

STMicroelectronics

STI6N62K3 by STMicroelectronics

STI6N62K3 by STMicroelectronics is a N-CHANNEL FET with 620V DS Breakdown Voltage, 22A IDM, and 1.2ohm RDS(on). Ideal for SWITCHING applications due to its 90W Power Dissipation, ENHANCEMENT MODE operation, and built-in DIODE configuration.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,381 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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Bristol Electronics

USA . 2,000 parts In-Stock

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Dan-Mar Components

USA . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,507 parts In-Stock

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Flip Electronics

USA . 1,100 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1,000 parts In-Stock

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Digiode

USA . 636 parts In-Stock

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IDEA Electronic Components Group

UK . 2,033 parts In-Stock

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$0.692

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$0.623

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2,033

$0.692

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$0.623

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MKK Technologies

India . 725 parts In-Stock

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$1.301

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725

$1.301

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DigiPath Technology Company

USA . 725 parts In-Stock

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$1.301

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725

$1.301

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AZTECH Wire

Italy . 220 parts In-Stock

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$19.510

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$19.510

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Semicontronic

India . 1,525 parts In-Stock

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$50.050

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$48.799

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$48.548

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Component Stockers USA

USA . 545 parts In-Stock

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$99.990

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,260 parts In-Stock

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Kepictronics

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,882 parts In-Stock

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Perfect Parts

USA . 2,442 parts In-Stock

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Authorized Procurement Solutions

USA . 1,500 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Parana Technologies

USA . 948 parts In-Stock

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$0.827

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Corphita

USA . 699 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 90 parts In-Stock

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Overview

Unleash the power of innovation with the STI6N62K3 by STMicroelectronics. As a leading manufacturer in the field of Power Field Effect Transistors, STMicroelectronics delivers unmatched quality and reliability. This N-CHANNEL transistor with a built-in diode is perfect for switching applications, offering a breakthrough in performance and efficiency. With a high DS Breakdown Voltage of 620V and a Maximum Power Dissipation of 90W, this transistor ensures optimal functionality under demanding conditions. Transform your projects with the STI6N62K3 and experience the superior benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the power FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current-handling capabilities compared to P-channel FETs, making them a good choice for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection and can simplify circuit design by eliminating the need for an external diode.

Transistor Application: SWITCHING

Designed specifically for switching applications, this power FET offers fast switching speeds and efficient power management.

Minimum DS Breakdown Voltage: 620 V

With a high breakdown voltage, this power FET can handle higher voltages without breakdown, ensuring reliable performance in high voltage applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic systems.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure connection and ease of soldering during PCB assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn on, providing better control over the switching operation.

Maximum Pulsed Drain Current (IDM): 22 A

The high pulsed drain current rating allows for handling sudden current spikes without compromising the performance of the power FET.

Avalanche Energy Rating (EAS): 140 mJ

The high avalanche energy rating indicates the ability of the FET to withstand short-duration high-energy pulses, ensuring robust performance in tough conditions.

Maximum Drain Current (Abs) (ID): 5.5 A

The maximum drain current rating of 5.5 A ensures the power FET can handle high continuous currents without overheating or failing.

No. of Terminals: 3

The three terminals provide connections for the gate, source, and drain, allowing for easy integration into various circuit configurations.

Maximum Power Dissipation (Abs): 90 W

With a high power dissipation rating of 90 W, this power FET can handle high power levels without thermal overload, ensuring reliable operation.

Package Style (Meter): IN-LINE

The in-line package style allows for compact and streamlined design, saving space in tight electronic layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low ON resistance, making this power FET a reliable choice for power management applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this power FET can operate reliably in high-temperature environments without degradation.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material that provides good performance and durability for power FET applications.

Terminal Finish: Matte Tin (Sn)

The matte tin finish on the terminals provides corrosion resistance and ensures good electrical conductivity for reliable connections.

Maximum Drain Current (ID): 5.5 A

The maximum drain current rating of 5.5 A ensures the power FET can handle high continuous currents without overheating or failing.

Maximum Drain-Source On Resistance: 1.2 ohm

The low drain-source on resistance of 1.2 ohms minimizes power loss and heat generation, making this power FET efficient for power management applications.

Terminal Position: SINGLE

The single terminal position simplifies the connection and integration of the power FET into various circuit layouts, reducing complexity and facilitating installation.

Technical Specifications

Power Field Effect Transistors (FET) STI6N62K3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

ULTRA LOW-ON RESISTANCE

Avalanche Energy Rating (EAS):

140 mJ

Minimum DS Breakdown Voltage:

620 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI6N62K3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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