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STI60N55F3

STMicroelectronics

STI60N55F3 by STMicroelectronics

STI60N55F3 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 55 V, and operates at up to 175 °C. Ideal for high-power circuits with low on-resistance (0.0085 Ω).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,367 parts In-Stock

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Anansix

USA . 1,187 parts In-Stock

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Digiode

USA . 290 parts In-Stock

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290

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,941 parts In-Stock

1+ parts

$0.758

100+ parts

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$0.682

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1,941

$0.758

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$0.682

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MKK Technologies

India . 434 parts In-Stock

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$1.426

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DigiPath Technology Company

USA . 434 parts In-Stock

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$1.426

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434

$1.426

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Corphita

USA . 2,366 parts In-Stock

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Parana Technologies

USA . 1,608 parts In-Stock

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$0.906

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1,608

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$0.906

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Overview

Unlock unparalleled efficiency and reliability with the STI60N55F3 from STMicroelectronics, a leader in innovative semiconductor solutions. This robust N-channel power FET is designed for seamless switching applications, delivering exceptional performance even under extreme conditions. With its built-in diode and high current handling capability, it’s ideal for automotive, industrial, and consumer electronics. Choose STI60N55F3 to elevate your designs with superior quality and unmatched value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency in switching applications, making this product ideal for high-speed and high-performance circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier integration in applications requiring back EMF protection, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET exhibits fast switching capabilities, ideal for power regulation and control.

Minimum DS Breakdown Voltage: 55 V

With a minimum breakdown voltage of 55V, this FET can handle significant voltage levels without failure, providing safety and stability in designs.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space and allows for efficient layout in both prototyping and bulk assembly processes.

Terminal Form: THROUGH-HOLE

Through-hole mounting offers robust mechanical support and is easy to solder, increasing reliability in demanding applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs allow for lower power loss and improved performance in digital logic applications.

Maximum Pulsed Drain Current (IDM): 320 A

The high pulsed drain current capability allows this FET to handle transient conditions effectively, making it suitable for high-demand applications.

Avalanche Energy Rating (EAS): 390 mJ

A high avalanche energy rating enhances reliability under fault conditions by providing protection against voltage spikes.

Maximum Drain Current (Abs) (ID): 80 A

With a maximum absolute drain current of 80 A, this FET can handle substantial loads, providing versatility for power management.

No. of Terminals: 3

Three terminals simplify circuit design and layout, making it easier to integrate into various applications.

Maximum Power Dissipation (Abs): 110 W

High power dissipation capability allows this FET to operate efficiently under heavy loads without overheating, ensuring reliability.

Package Style (Meter): IN-LINE

In-line packaging facilitates ease of installation and is compatible with standard PCB layouts, simplifying design processes.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high speed and efficiency, making it a preferred choice for modern power electronics.

Maximum Operating Temperature: 175 °C

A high operating temperature allows for use in extreme environments, expanding application possibilities.

Transistor Element Material: SILICON

Silicon provides excellent electrical characteristics and reliability, making it a trusted choice in the semiconductor industry.

Maximum Drain Current (ID): 80 A

The dual specification with a maximum drain current of 80 A indicates consistent performance, reinforcing the device's capability for heavy-duty applications.

Maximum Drain-Source On Resistance: 0.0085 ohm

Low on-resistance ensures minimal power loss and higher efficiency during operation, making it an excellent choice for power conversion applications.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit design and enhances layout flexibility, suited for various applications.

Case Connection: DRAIN

With the case connected to the drain, it allows for efficient thermal management, essential for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) STI60N55F3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

390 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

55 V

Maximum Drain Current (Abs) (ID):

80 A

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STI60N55F3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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