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STH175N4F6-6AG

STMicroelectronics

STH175N4F6-6AG by STMicroelectronics

STH175N4F6-6AG by STMicroelectronics is a single N-channel MOSFET ideal for high-power applications. It supports a max drain current of 120 A and power dissipation of 150 W, operating up to 175 °C. Perfect for efficient power management in various electronic devices.

Median Price

$0.923

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 591 parts In-Stock

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$0.923

10k+ parts

$0.816

591

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$0.923

$0.816

Distributors (In-Stock)

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Vyrian

USA . 8,599 parts In-Stock

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8,599

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Digiode

USA . 2,755 parts In-Stock

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Anansix

USA . 179 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 620 parts In-Stock

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$1.599

100+ parts

-

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$1.439

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620

$1.599

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$1.439

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MKK Technologies

India . 25 parts In-Stock

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$3.007

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25

$3.007

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DigiPath Technology Company

USA . 25 parts In-Stock

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$3.007

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25

$3.007

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Component Stockers USA

USA . 627 parts In-Stock

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$99.990

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627

$99.990

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RC Electronics

USA . 5,403 parts In-Stock

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5,403

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Alle Elektronik GmbH

Germany . 4,313 parts In-Stock

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Parana Technologies

USA . 2,072 parts In-Stock

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$1.912

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2,072

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$1.912

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Kepictronics

USA . 2,000 parts In-Stock

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2,000

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Corphita

USA . 395 parts In-Stock

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Overview

Unlock unparalleled performance with the STH175N4F6-6AG N-Channel Power FET by STMicroelectronics, a leader in semiconductor innovation. Designed for robust applications in power management and automotive systems, this high-efficiency transistor ensures reliable operation under extreme conditions. Experience enhanced durability, superior energy efficiency, and unmatched thermal stability that elevate your designs to the next level—transforming everyday challenges into seamless solutions.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer better performance characteristics, including lower on-resistance and higher electron mobility, making them ideal for applications requiring efficient switching.

Configuration: SINGLE

Single configuration simplifies circuit design and implementation, making it easier to integrate into various applications without the complexity of multi-chip arrangements.

Surface Mount: YES

Surface mount technology allows for space-saving designs and enables automated assembly, resulting in a more compact overall product and reduced manufacturing costs.

Maximum Drain Current (Abs) (ID): 120 A

A maximum drain current rating of 120 A provides high current handling capabilities, allowing this FET to be used in demanding applications such as power management and motor control.

Maximum Power Dissipation (Abs): 150 W

The capability to dissipate up to 150 W of power ensures reliability and efficiency, making it suitable for high-power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology contributes to high input impedance and fast switching speeds, making this FET an excellent choice for high-frequency applications and low power loss.

Maximum Operating Temperature: 175 °C

A maximum operating temperature of 175 °C allows for operation in extreme environments, enhancing durability and reliability in applications exposed to high thermal stress.

Maximum Drain Current (ID): 120 A

With a drain current capacity of 120 A, this FET is well-suited for applications that require substantial power delivery, ensuring performance stability even under heavy loads.

Technical Specifications

Power Field Effect Transistors (FET) STH175N4F6-6AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

120 A

Maximum Drain Current (ID):

120 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

STH175N4F6-6AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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