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STH10NC60FI

STMicroelectronics

STH10NC60FI by STMicroelectronics

STH10NC60FI by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 600V breakdown voltage and a max drain current of 10A. It offers a low on-resistance of 0.75Ω and operates at up to 150 °C. Ideal for high-efficiency power management solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,731 parts In-Stock

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4,731

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Vyrian

USA . 3,595 parts In-Stock

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3,595

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Anansix

USA . 563 parts In-Stock

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563

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ACDS - Activité Composants Distribution Service

France . 74 parts In-Stock

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74

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,005 parts In-Stock

1+ parts

$0.331

100+ parts

-

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$0.298

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1,005

$0.331

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$0.298

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MKK Technologies

India . 200 parts In-Stock

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$0.623

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200

$0.623

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DigiPath Technology Company

USA . 200 parts In-Stock

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$0.623

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200

$0.623

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Corphita

USA . 3,657 parts In-Stock

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3,657

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Parana Technologies

USA . 1,285 parts In-Stock

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$0.396

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1,285

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$0.396

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Overview

Elevate your projects with the STH10NC60FI from STMicroelectronics, a trusted name in innovation. This N-channel Power FET delivers unmatched reliability for your switching applications, combining robust performance with a built-in diode feature. Designed for efficiency and durability, it ensures optimal power management while handling high voltages with ease. Trust in STMicroelectronics to provide quality components that drive your success, from industrial automation to consumer electronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and resistance to moisture and chemicals, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance and efficiency in switching applications, making this product ideal for various high-performance circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simplified circuit designs and improves efficiency, making it a perfect choice for applications requiring flyback protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor excels in efficiency and speed, suitable for a wide array of electronic devices.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage of 600 V enables the transistor to handle demanding high-voltage applications safely, enhancing its versatility.

Package Shape: RECTANGULAR

The rectangular shape allows for optimal space utilization on boards, making it convenient for various electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole mounting provides excellent mechanical stability and thermal performance, ensuring reliable connections in challenging environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation improves efficiency, allowing for lower power consumption and better performance in applications.

Maximum Pulsed Drain Current (IDM): 40 A

With a high maximum pulsed drain current, this FET can effectively handle surges, which is critical in emergency and transient conditions.

Avalanche Energy Rating (EAS): 820 mJ

A high avalanche energy rating indicates robustness against voltage spikes, making this transistor reliable for various applications.

Maximum Drain Current (Abs) (ID): 10 A

The ability to handle 10 A of maximum drain current makes this FET suitable for a wide range of power applications.

No. of Terminals: 3

With three terminals, this FET simplifies connections, allowing for more straightforward integration into circuits.

Maximum Power Dissipation (Abs): 60 W

High power dissipation capability enables this FET to operate efficiently under significant loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount provides a secure attachment and improves heat dissipation, ensuring stable operation in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables faster switching speeds and lower on-state resistance, making this FET ideal for modern electronic systems.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature enhances reliability, allowing this component to function in extreme conditions.

Transistor Element Material: SILICON

Silicon as the element material provides good thermal performance and reliability, which are critical for long-term applications.

Maximum Drain Current (ID): 10 A

Again, the ability to handle a maximum drain current of 10 A ensures versatility across a variety of applications.

Maximum Drain-Source On Resistance: 0.75 ohm

Low on-resistance minimizes power loss during operation, improving efficiency and thermal performance.

Terminal Position: SINGLE

The single terminal position aids in compact designs, making it easier to integrate into smaller circuit layouts.

Case Connection: ISOLATED

An isolated case connection ensures that the device operates safely, reducing the risk of short circuits in multi-component environments.

Technical Specifications

Power Field Effect Transistors (FET) STH10NC60FI attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

820 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-218

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

40 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STH10NC60FI Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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