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STF3HNK90Z

STMicroelectronics

STF3HNK90Z by STMicroelectronics

STF3HNK90Z by STMicroelectronics is an N-channel FET ideal for switching applications, featuring a 900V breakdown voltage and 12A pulsed drain current. It operates in enhancement mode with a max power dissipation of 25W. This robust transistor ensures reliable performance in high-temperature environments up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,471 parts In-Stock

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4,471

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Anansix

USA . 1,783 parts In-Stock

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Digiode

USA . 1,058 parts In-Stock

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Lantek

USA . 250 parts In-Stock

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IDEA Electronic Components Group

UK . 537 parts In-Stock

1+ parts

$0.880

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$0.792

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537

$0.880

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$0.792

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MKK Technologies

India . 547 parts In-Stock

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$1.654

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547

$1.654

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DigiPath Technology Company

USA . 547 parts In-Stock

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$1.654

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547

$1.654

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AZTECH Wire

Italy . 169 parts In-Stock

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$8.940

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$8.940

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 12,706 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,507 parts In-Stock

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Corphita

USA . 4,465 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,049 parts In-Stock

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Parana Technologies

USA . 1,456 parts In-Stock

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$1.052

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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Kepictronics

USA . 339 parts In-Stock

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GreenTree Electronics

Israel . 250 parts In-Stock

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Perfect Parts

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Overview

Unlock the potential of your projects with the STF3HNK90Z power FET from STMicroelectronics. Renowned for its commitment to quality and innovation, STMicroelectronics delivers unparalleled reliability through this N-channel transistor, perfect for efficient switching applications. With a robust design that withstands high voltages and temperatures, this component ensures optimal performance and longevity, empowering engineers to create cutting-edge solutions with confidence. Elevate your designs—experience the STMicroelectronics advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body offers durability and resistance to environmental factors, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are preferred for high-speed switching and efficiency, providing better performance in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances functionality by providing protection and reducing the need for additional components in the circuit design.

Transistor Application: SWITCHING

Designed for switching applications, this FET ensures fast operation and reliability, making it ideal for power management solutions.

Minimum DS Breakdown Voltage: 900 V

A high breakdown voltage allows this transistor to operate safely in high voltage applications, ensuring reliability under stress.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient use of space on the PCB, allowing for compact circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and are well-suited for high-power applications, ensuring robust connections.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate drive power, which can lead to energy savings and reduced heat generation.

Maximum Pulsed Drain Current (IDM): 12 A

A high pulsed drain current rating enables the FET to handle transient loads effectively, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 200 mJ

This rating indicates the FET's robustness in handling transient events, thus ensuring reliability and longevity in circuits.

Maximum Drain Current (Abs) (ID): 3 A

The maximum drain current capability ensures this FET can handle a moderate load, making it suitable for various applications.

No. of Terminals: 3

Having three terminals simplifies design and facilitates easy integration into standard circuit configurations.

Maximum Power Dissipation (Abs): 25 W

A high power dissipation rating allows the transistor to operate efficiently without overheating, increasing reliability in demanding applications.

Package Style (Meter): FLANGE MOUNT

Flange mount provides better thermal management and mechanical stability, making it ideal for applications where heat dissipation is a concern.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology delivers high efficiency and fast switching speeds while minimizing power loss, making it ideal for modern power applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliability in harsh environments, making it suitable for industrial applications.

Transistor Element Material: SILICON

Silicon is known for its excellent electrical characteristics and is a standard in the industry, providing reliability and performance.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and corrosion resistance, ensuring long-term reliability and stable connections.

Maximum Drain Current (ID): 3 A

Reiterating the maximum drain current capability emphasizes its suitability for moderate load applications.

Maximum Drain-Source On Resistance: 4.2 ohm

Low on-resistance translates to higher efficiency with less power loss during operation, making it a cost-effective solution in power circuits.

Terminal Position: SINGLE

Single terminal position simplifies layout and wiring, reducing complexity in PCB design.

Case Connection: ISOLATED

An isolated case connection provides enhanced safety and isolation from other circuit components, crucial for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF3HNK90Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

3 A

Maximum Drain Current (ID):

3 A

Maximum Drain-Source On Resistance:

4.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

12 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF3HNK90Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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