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STF19NM65N

STMicroelectronics

STF19NM65N by STMicroelectronics

STF19NM65N by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 650V breakdown voltage and 15.5A max drain current. It operates in enhancement mode with a low on-resistance of 0.27Ω. Ideal for high-efficiency power management solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,278 parts In-Stock

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8,278

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Anansix

USA . 2,600 parts In-Stock

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2,600

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Digiode

USA . 2,018 parts In-Stock

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2,018

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,110 parts In-Stock

1+ parts

$1.704

100+ parts

-

1k+ parts

$1.533

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1,110

$1.704

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$1.533

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MKK Technologies

India . 326 parts In-Stock

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$3.204

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326

$3.204

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DigiPath Technology Company

USA . 326 parts In-Stock

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$3.204

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326

$3.204

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Component Stockers USA

USA . 4,777 parts In-Stock

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$3.330

100+ parts

$3.170

1k+ parts

$3.070

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4,777

$3.330

$3.170

$3.070

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AZTECH Wire

Italy . 1,144 parts In-Stock

1+ parts

$16.550

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1,144

$16.550

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 4,649 parts In-Stock

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4,649

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Corphita

USA . 3,700 parts In-Stock

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3,700

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Parana Technologies

USA . 169 parts In-Stock

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$2.037

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169

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$2.037

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Overview

Unlock unparalleled performance with the STF19NM65N from STMicroelectronics—a leader in semiconductor innovation. This high-quality N-channel Power FET excels in switching applications, delivering exceptional energy efficiency and reliability. With its robust design and built-in diode, it ensures seamless operation even under challenging conditions. Trust STMicroelectronics for cutting-edge technology that empowers your projects, enhances productivity, and drives success across various industries.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable package, ensuring reliability in various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for lower on-resistance and higher efficiency, making them ideal for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode enhances protection against reverse currents, increasing the reliability of the circuit.

Transistor Application: SWITCHING

Specifically designed for switching applications, this FET ensures fast operation and reduced power loss during commutation.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage allows this FET to operate reliably in high-voltage applications, reducing the risk of device failure.

Package Shape: RECTANGULAR

The rectangular shape optimizes space utilization on PCBs, facilitating easy integration into various designs.

Terminal Form: THROUGH-HOLE

Through-hole packaging provides robust mechanical stability, making the FET suitable for high-current and high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive gate voltage to conduct, allowing for precise control in switching applications.

Maximum Pulsed Drain Current (IDM): 62 A

A maximum pulsed drain current of 62 A allows the device to handle brief surge currents, making it versatile for demanding applications.

Avalanche Energy Rating (EAS): 400 mJ

A high avalanche energy rating provides the capacity to handle transient energy spikes, enhancing reliability in power management.

Maximum Drain Current (Abs) (ID): 15.5 A

With a maximum absolute drain current of 15.5 A, this FET is capable of efficiently managing significant load currents.

No. of Terminals: 3

The three-terminal design simplifies circuit integration and improves layout flexibility on PCB.

Maximum Power Dissipation (Abs): 35 W

A high power dissipation rating allows this FET to operate effectively in high-power applications without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers easy installation and excellent thermal management, making it well-suited for power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology contributes to low gate drive power and high switching speeds, optimizing performance in various electronic circuits.

Maximum Operating Temperature: 150 °C

The ability to operate at high temperatures ensures reliability in extreme conditions, extending the lifespan of the component.

Transistor Element Material: SILICON

Silicon construction is standard for high-performance transistors, providing good thermal conductivity and stability.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides protection against corrosion, ensuring a secure connection in applications.

Maximum Drain Current (ID): 15.5 A

Reiterated maximum drain current signifies robust performance under load, crucial for applications requiring reliable power handling.

Maximum Drain-Source On Resistance: 0.27 ohm

Low on-resistance minimizes power losses and improves efficiency during operation, leading to lower heat generation.

Terminal Position: SINGLE

A single terminal position simplifies wiring and reduces potential assembly errors in circuit designs.

Case Connection: ISOLATED

Isolated case connection enhances safety by preventing unintended current paths, making it suitable for sensitive applications.

Technical Specifications

Power Field Effect Transistors (FET) STF19NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

15.5 A

Maximum Drain Current (ID):

15.5 A

Maximum Drain-Source On Resistance:

.27 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

62 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF19NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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