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STF16NM50N

STMicroelectronics

STF16NM50N by STMicroelectronics

STF16NM50N by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 500V breakdown voltage and a max drain current of 15A. It operates in enhancement mode with a low on-resistance of 0.26Ω. Ideal for high-power circuits, it ensures efficient performance up to 150 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,526 parts In-Stock

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Digiode

USA . 2,110 parts In-Stock

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2,110

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Anansix

USA . 1,436 parts In-Stock

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1,436

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 342 parts In-Stock

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$0.776

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-

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$0.698

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342

$0.776

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$0.698

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MKK Technologies

India . 1,318 parts In-Stock

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$1.458

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1,318

$1.458

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DigiPath Technology Company

USA . 1,318 parts In-Stock

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$1.458

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1,318

$1.458

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AZTECH Wire

Italy . 616 parts In-Stock

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$18.520

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616

$18.520

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QUARKTWIN TECHNOLOGY LTD

USA . 13,785 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,892 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Corphita

USA . 2,431 parts In-Stock

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Parana Technologies

USA . 1,777 parts In-Stock

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$0.927

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$0.927

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Metaverse IC Inc.

Canada . 1,100 parts In-Stock

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Overview

Unlock unparalleled performance with the STF16NM50N from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This N-channel power FET is designed for seamless switching applications, delivering robust efficiency and reliability across diverse industries. With its built-in diode and exceptional breakdown voltage, it ensures superior durability and adaptability. Elevate your projects and experience enhanced power management—choose STF16NM50N for unmatched quality and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers a lightweight and durable housing, providing excellent protection for the internal components.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically provide better performance and efficiency, making this transistor ideal for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The single configuration with a built-in diode allows for easy integration into circuits, enhancing reliability in switching applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers rapid on/off capabilities, making it suitable for a variety of electronic systems.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage makes this FET capable of withstanding substantial voltage levels, ensuring durability and preventing failure.

Package Shape: RECTANGULAR

The rectangular shape contributes to an efficient design, improving space utilization on PCBs and facilitating better thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical connections, enhancing the solder joint reliability in high-power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for low-power consumption and high efficiency, suitable for modern applications.

Maximum Pulsed Drain Current (IDM): 60 A

A high pulsed drain current capability allows this FET to handle transients effectively, making it suitable for high-performance applications.

Avalanche Energy Rating (EAS): 470 mJ

A substantial avalanche energy rating indicates robustness against transient voltage spikes, increasing reliability in demanding environments.

Maximum Drain Current (Abs) (ID): 15 A

An absolute maximum drain current of 15 A enables the FET to perform well in various applications, from consumer electronics to industrial devices.

No. of Terminals: 3

With three terminals, this FET is easy to integrate into existing circuit designs, simplifying assembly and layout.

Maximum Power Dissipation (Abs): 30 W

With a maximum power dissipation of 30 W, this FET can effectively handle large power loads without overheating.

Package Style (Meter): FLANGE MOUNT

Flange mount configuration allows for secure mounting, enhancing thermal management and improving overall system stability.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The use of MOS technology ensures high-speed switching and low power consumption, making it ideal for energy-efficient applications.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C allows the FET to function reliably in high-temperature environments, expanding its usability.

Transistor Element Material: SILICON

Silicon as the primary material ensures good electrical properties and stability, contributing to the overall performance of the transistor.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, enhancing long-term reliability in various applications.

Maximum Drain Current (ID): 15 A

This specification highlights the transistor's ability to handle significant load without performance degradation, great for power management.

Maximum Drain-Source On Resistance: 0.26 ohm

A low on-resistance minimizes energy losses, leading to improved efficiency in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies the design and layout in applications where space and efficiency are critical.

Case Connection: ISOLATED

Isolated case connection prevents leakage and enhances safety, making this product suitable for sensitive electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STF16NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

470 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

15 A

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF16NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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