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STF12NM50N

STMicroelectronics

STF12NM50N by STMicroelectronics

STF12NM50N by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a 500V breakdown voltage, 44A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,258 parts In-Stock

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Anansix

USA . 1,738 parts In-Stock

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Digiode

USA . 1,076 parts In-Stock

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ComSIT Distribution GmbH

Germany . 28 parts In-Stock

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IDEA Electronic Components Group

UK . 1,952 parts In-Stock

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$0.431

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$0.388

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$0.431

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$0.388

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MKK Technologies

India . 1,966 parts In-Stock

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$0.810

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$0.810

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DigiPath Technology Company

USA . 1,966 parts In-Stock

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$0.810

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$0.810

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Component Stockers USA

USA . 9 parts In-Stock

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$5.920

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9

$5.920

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AZTECH Wire

Italy . 573 parts In-Stock

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$13.210

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Kepictronics

USA . 10,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,132 parts In-Stock

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Corphita

USA . 1,473 parts In-Stock

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Parana Technologies

USA . 1,016 parts In-Stock

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$0.515

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$0.515

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Overview

Unlock exceptional performance with the STF12NM50N, a premium N-Channel Power FET from STMicroelectronics. Renowned for reliability and innovation, STMicroelectronics ensures this transistor meets your toughest demands in switching applications. With its robust design, built-in diode, and high breakdown voltage, you benefit from enhanced efficiency and durability. Elevate your projects and drive success with a trusted component that delivers quality you can count on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the transistor reliable in various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient electron flow, resulting in better performance and higher switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies circuit design and reduces component count, enhancing reliability and ease of integration.

Transistor Application: SWITCHING

Designed for switching applications, this FET ensures fast response times and high efficiency in power management circuits.

Minimum DS Breakdown Voltage: 500 V

A high minimum breakdown voltage makes this FET suitable for high-voltage applications, providing safety and durability.

Package Shape: RECTANGULAR

The rectangular shape facilitates uniform heat dissipation and ease of mounting in various applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing the reliability of the FET in demanding environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for a normally-off design, providing efficient operation in a variety of switching applications.

Maximum Pulsed Drain Current (IDM): 44 A

A high pulsed drain current rating supports demanding applications, enabling powerful transient performance.

Avalanche Energy Rating (EAS): 350 mJ

This energy rating indicates the capability to handle high-energy transients, protecting against voltage spikes and improving reliability.

Maximum Drain Current (Abs) (ID): 11 A

A maximum drain current of 11 A offers solid performance in moderate to high-current applications, ensuring reliable operation under typical load conditions.

No. of Terminals: 3

Three terminals simplify the circuit design, making it compact while still allowing for versatility in applications.

Maximum Power Dissipation (Abs): 25 W

A power dissipation capability of 25 W ensures the FET can operate efficiently without overheating, suitable for high-power applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure installation, which is ideal for higher mechanical stress applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching speed and low power consumption, making this FET efficient for modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature increases the range of applications where this FET can function, ensuring performance in harsh environments.

Transistor Element Material: SILICON

Silicon as the base material offers established performance and reliability, benefiting from extensive industry support and development.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring long-term reliability in connections.

Maximum Drain Current (ID): 11 A

This reiteration of the current rating underlines design flexibility, allowing the FET to operate safely within specified parameters.

Maximum Drain-Source On Resistance: 0.38 ohm

A low on-resistance minimizes power losses, enhancing efficiency while reducing heat generation in applications.

Terminal Position: SINGLE

Single terminal position helps in straightforward PCB design, facilitating easier assembly and layout.

Case Connection: ISOLATED

An isolated case connection improves safety and performance by reducing the risk of undesirable circuit interactions.

Technical Specifications

Power Field Effect Transistors (FET) STF12NM50N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

350 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

44 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF12NM50N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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