Loading...

STF11NM65N

STMicroelectronics

STF11NM65N by STMicroelectronics

STF11NM65N by STMicroelectronics is a powerful N-channel FET designed for switching applications, featuring a 650V breakdown voltage and 12A max drain current. It operates in enhancement mode with a low on-resistance of 0.38Ω. Ideal for high-efficiency power management solutions.

Median Price

$0.919

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 386 parts In-Stock

1+ parts

$0.919

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$0.919

-

-

-

Verical

USA . 386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

386

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,629 parts In-Stock

1+ parts

$0.864

100+ parts

-

1k+ parts

-

10k+ parts

-

4,629

$0.864

-

-

-

Cyclops Electronics Ltd

UK . 5,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,800

-

-

-

-

Anansix

USA . 2,890 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,890

-

-

-

-

Vyrian

USA . 2,176 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,176

-

-

-

-

ACDS - Activité Composants Distribution Service

France . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,485 parts In-Stock

1+ parts

$0.818

100+ parts

-

1k+ parts

-

10k+ parts

-

3,485

$0.818

-

-

-

IDEA Electronic Components Group

UK . 889 parts In-Stock

1+ parts

$1.187

100+ parts

-

1k+ parts

$1.068

10k+ parts

-

889

$1.187

-

$1.068

-

Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$1.492

100+ parts

$1.358

1k+ parts

$1.223

10k+ parts

-

10

$1.492

$1.358

$1.223

-

MKK Technologies

India . 1,610 parts In-Stock

1+ parts

$2.232

100+ parts

-

1k+ parts

-

10k+ parts

-

1,610

$2.232

-

-

-

DigiPath Technology Company

USA . 1,610 parts In-Stock

1+ parts

$2.232

100+ parts

-

1k+ parts

-

10k+ parts

-

1,610

$2.232

-

-

-

AZTECH Wire

Italy . 430 parts In-Stock

1+ parts

$8.960

100+ parts

-

1k+ parts

-

10k+ parts

-

430

$8.960

-

-

-

Kepictronics

USA . 10,045 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,045

-

-

-

-

Epart123

USA . 5,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.600

10k+ parts

$0.600

5,800

-

-

$0.600

$0.600

GreenTree Electronics

Israel . 5,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,800

-

-

-

-

Alle Elektronik GmbH

Germany . 4,702 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,702

-

-

-

-

Authorized Procurement Solutions

USA . 586 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

586

-

-

-

-

Parana Technologies

USA . 63 parts In-Stock

1+ parts

-

100+ parts

$1.419

1k+ parts

-

10k+ parts

-

63

-

$1.419

-

-

Perfect Parts

USA . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56

-

-

-

-

Overview

Unlock superior performance with the STF11NM65N from STMicroelectronics, a leader in innovative semiconductor solutions. This N-channel power FET excels in switching applications, delivering reliability and efficiency for your projects. With robust design features that ensure high voltage tolerance and low on-resistance, it significantly enhances energy management. Trust STMicroelectronics for quality that empowers your designs and drives success in diverse industries!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides excellent durability and protection against environmental factors, enhancing the longevity of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high electron mobility and efficiency, making them suitable for high-speed applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration simplifies the design by integrating a diode, which is beneficial for applications requiring flyback or protection features.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable operation in power management and control circuits.

Minimum DS Breakdown Voltage: 650 V

A high breakdown voltage makes this FET suitable for high-voltage applications, ensuring it can handle demanding conditions without failure.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier PCB layout and integration into various designs, optimizing space utilization.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and good thermal dissipation, making installation straightforward and reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the transistor, making it suitable for various application needs.

Maximum Pulsed Drain Current (IDM): 48 A

With a high pulsed drain current rating, this FET can handle temporary surge loads effectively, making it ideal for power applications.

Avalanche Energy Rating (EAS): 300 mJ

The high avalanche energy rating suggests robustness against voltage spikes, thus enhancing reliability in harsh operating conditions.

Maximum Drain Current (Abs) (ID): 12 A

A maximum drain current rating of 12 A shows that this FET can be used in various mid-range power applications without risk of overheating.

No. of Terminals: 3

The 3-terminal configuration is standard for FETs, facilitating easy integration into various circuits while maintaining functionality.

Maximum Power Dissipation (Abs): 30 W

Capable of dissipating 30 W, this FET can manage significant power levels, making it suitable for high-performance applications.

Package Style (Meter): FLANGE MOUNT

Flange mount packaging offers robust mounting options ensuring stable performance in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enhances speed and efficiency, making this FET ideal for modern, high-speed electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature indicates that this FET can function in extreme conditions, offering flexibility in application.

Transistor Element Material: SILICON

Silicon as the element material ensures good performance characteristics and reliability, as it is the most widely used semiconductor material.

Terminal Finish: MATTE TIN

Matte tin finish provides better solderability, reducing the risk of defects during manufacturing and assembly processes.

Maximum Drain Current (ID): 12 A

Having a consistent rating of 12 A emphasizes the reliability of the FET across its specifications, ensuring dependable performance.

Maximum Drain-Source On Resistance: 0.38 ohm

Low on-resistance ensures minimal energy loss during operation, which is critical for efficient power management.

Terminal Position: SINGLE

Single terminal position simplifies circuit designs and minimizes the risks associated with complex routing.

Case Connection: ISOLATED

An isolated case connection enhances safety and reduces interference with other components in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) STF11NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF11NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20