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STF10NK50Z

STMicroelectronics

STF10NK50Z by STMicroelectronics

STF10NK50Z by STMicroelectronics is an N-channel FET designed for switching applications, featuring a 500V breakdown voltage and 9A max drain current. It operates in enhancement mode with a low on-resistance of 0.7Ω. Ideal for high-efficiency power management solutions.

Median Price

$0.703

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,663 parts In-Stock

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5,663

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Digiode

USA . 1,594 parts In-Stock

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1,594

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Bristol Electronics

USA . 343 parts In-Stock

1+ parts

-

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$0.703

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$0.525

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343

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$0.703

$0.525

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Dan-Mar Components

USA . 343 parts In-Stock

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343

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Anansix

USA . 315 parts In-Stock

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315

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.972

100+ parts

$0.885

1k+ parts

$0.797

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-

500

$0.972

$0.885

$0.797

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IDEA Electronic Components Group

UK . 1,574 parts In-Stock

1+ parts

$1.832

100+ parts

-

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$1.649

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1,574

$1.832

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$1.649

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MKK Technologies

India . 495 parts In-Stock

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$3.444

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495

$3.444

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DigiPath Technology Company

USA . 495 parts In-Stock

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$3.444

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495

$3.444

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AZTECH Wire

Italy . 76 parts In-Stock

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$11.030

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76

$11.030

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,766 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,374 parts In-Stock

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3,374

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Parana Technologies

USA . 1,065 parts In-Stock

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$2.190

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Perfect Parts

USA . 312 parts In-Stock

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312

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Overview

Unlock the potential of your designs with the STF10NK50Z N-channel Power FET from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile transistor excels in switching applications, ensuring reliable performance and robust efficiency for your projects. With its built-in diode and impressive breakdown voltage, you can harness exceptional power capabilities while benefiting from ST's commitment to quality and reliability. Upgrade your systems with confidence and experience unparalleled value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material offers durability and protection against environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their efficiency and are commonly preferred in switching applications, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the design and improves reliability by providing inherent protection against reverse polarity.

Transistor Application: SWITCHING

Designed specifically for switching, this FET provides fast operation, making it ideal for power management applications.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage ensures that the transistor can withstand substantial voltage spikes, enhancing the robustness of circuits.

Package Shape: RECTANGULAR

The rectangular package design facilitates efficient use of space on PCBs and eases thermal management.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, which is advantageous for high-stress environments.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for better control of the device’s conductivity, leading to improved efficiency in power applications.

Maximum Pulsed Drain Current (IDM): 36 A

The ability to handle high pulsed currents makes this transistor suitable for applications such as motor control and signal amplification.

Avalanche Energy Rating (EAS): 230 mJ

A significant avalanche energy rating indicates good performance under transient conditions, increasing reliability during operation.

Maximum Drain Current (Abs): 9 A

With a high maximum drain current, this FET can drive substantial loads, making it versatile for a variety of applications.

No. of Terminals: 3

A three-terminal design simplifies the circuit assembly while maintaining effective performance and enabling compact layouts.

Maximum Power Dissipation (Abs): 30 W

Having a high power dissipation capability allows for efficient heat management, ensuring the device operates reliably under load.

Package Style (Meter): FLANGE MOUNT

Flange mount packages provide excellent thermal performance and mechanical stability, ideal for industrial applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low power consumption, making it suitable for low-power applications.

Maximum Operating Temperature: 150 °C

A high operating temperature limits the potential for thermal failure, allowing this FET to perform well in demanding environments.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material known for its reliability and mature technology, contributing to the device’s longevity.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, enhancing the reliability of electrical connections.

Maximum Drain Current (ID): 9 A

Again, the maximum drain current rating allows for robust performance in power applications, capable of handling considerable loads.

Maximum Drain-Source On Resistance: 0.7 ohm

A low on-resistance leads to decreased power losses during operation, resulting in improved efficiency and thermal performance.

Terminal Position: SINGLE

The single terminal position allows for straightforward integration into circuits, simplifying design and assembly.

Case Connection: ISOLATED

Isolated case connections enhance safety by reducing the risk of short circuits, ideal for high-voltage applications.

Technical Specifications

Power Field Effect Transistors (FET) STF10NK50Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STF10NK50Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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