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STE250NS10

STMicroelectronics

STE250NS10 by STMicroelectronics

STE250NS10 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 220 A, a breakdown voltage of 100 V, and operates at up to 150 °C. Ideal for high-power circuits with low on-resistance (0.0055 Ω).

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,727 parts In-Stock

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3,727

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Anansix

USA . 1,300 parts In-Stock

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Digiode

USA . 737 parts In-Stock

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737

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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70

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Bristol Electronics

USA . 10 parts In-Stock

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10

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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IDEA Electronic Components Group

UK . 1,528 parts In-Stock

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$0.360

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$0.324

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1,528

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$0.324

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MKK Technologies

India . 1,468 parts In-Stock

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$0.676

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$0.676

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DigiPath Technology Company

USA . 1,468 parts In-Stock

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$0.676

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$0.676

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AZTECH Wire

Italy . 1,184 parts In-Stock

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$18.230

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$18.230

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QUARKTWIN TECHNOLOGY LTD

USA . 10,261 parts In-Stock

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Kepictronics

USA . 9,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,485 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,662 parts In-Stock

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Perfect Parts

USA . 3,872 parts In-Stock

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Corphita

USA . 1,823 parts In-Stock

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Parana Technologies

USA . 1,673 parts In-Stock

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$0.430

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$0.430

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Overview

Unlock unparalleled performance with the STE250NS10 from STMicroelectronics, a top-tier N-channel power FET designed for efficient switching applications. Engineered for reliability and durability, this transistor excels in demanding environments, providing unmatched power dissipation and energy efficiency. With STMicroelectronics’ commitment to quality and innovation, the STE250NS10 is your go-to solution for enhancing system performance across various industries, ensuring you achieve optimal results with every project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

The N-Channel configuration allows for lower on-resistance and higher efficiency in switching applications, making this FET suitable for high-performance designs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the versatility of the FET for applications that require flyback protection, contributing to system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can handle rapid changes in electrical signals efficiently, optimizing performance in power management circuits.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100V, this FET is capable of operating safely in high-voltage environments, providing robust performance.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient heat dissipation and simplifies integration into various PCB layouts.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for normally-off behavior, providing better control in circuits and reducing unintended conduction.

Maximum Pulsed Drain Current (IDM): 880 A

This FET's capacity to handle a high pulsed drain current makes it suitable for applications with transient load conditions, enabling improved performance.

Avalanche Energy Rating (EAS): 800 mJ

With an avalanche energy rating of 800 mJ, this FET can withstand energy surges, enhancing its reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 220 A

The high maximum drain current capability allows this FET to drive significant loads, making it ideal for power-intensive applications.

No. of Terminals: 4

The four-terminal design offers flexible connection options, leading to ease of integration and reduced layout complexity.

Maximum Power Dissipation (Abs): 500 W

A maximum power dissipation of 500W allows the FET to handle high power levels while maintaining thermal stability, suitable for demanding applications.

Package Style (Meter): FLANGE MOUNT

The flange mount style provides mechanical stability and better thermal management, ideal for power devices that require secure mounting.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOS technology enhances the efficiency and speed of the transistor, making it a preferred choice in modern electronic designs.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature of 150 °C allows this FET to perform reliably in environments where heat is a concern.

Transistor Element Material: SILICON

Silicon is a widely-used semiconductor material known for its stable electrical characteristics, ensuring reliability in various applications.

Maximum Drain Current (ID): 220 A

The maximum drain current of 220A ensures the FET can handle large currents efficiently, suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0055 ohm

The low on-resistance minimizes power loss and heat generation, improving efficiency in switching applications.

Terminal Position: UPPER

With upper terminal positioning, the FET simplifies connections and improves accessibility for circuit assembly and maintenance.

Case Connection: ISOLATED

An isolated case connection enhances safety by reducing the risk of accidental short circuits, making it suitable for sensitive electronic applications.

Technical Specifications

Power Field Effect Transistors (FET) STE250NS10 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

220 A

Maximum Drain Current (ID):

220 A

Maximum Drain-Source On Resistance:

.0055 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XUFM-X4

Moisture Sensitivity Level (MSL):

NOT APPLICABLE

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

880 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE250NS10 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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