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STE180N05

STMicroelectronics

STE180N05 by STMicroelectronics

STE180N05 by STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 180 A, a breakdown voltage of 50 V, and a low on-resistance of 0.006 Ω. Ideal for high-power circuits, it operates up to 150 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,048 parts In-Stock

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1,048

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Vyrian

USA . 567 parts In-Stock

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567

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Anansix

USA . 140 parts In-Stock

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140

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ECAB

Sweden . 8 parts In-Stock

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8

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,163 parts In-Stock

1+ parts

$0.776

100+ parts

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1k+ parts

$0.699

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2,163

$0.776

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$0.699

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MKK Technologies

India . 1,451 parts In-Stock

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$1.460

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$1.460

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DigiPath Technology Company

USA . 1,451 parts In-Stock

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$1.460

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1,451

$1.460

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Corphita

USA . 3,428 parts In-Stock

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3,428

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Parana Technologies

USA . 325 parts In-Stock

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$0.928

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325

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$0.928

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Overview

Unlock the power of efficiency with the STE180N05 from STMicroelectronics, a leader in advanced semiconductor solutions. This robust N-channel FET excels in switching applications, delivering superior performance and reliability while minimizing energy loss. With exceptional thermal management and high current capability, it’s ideal for demanding environments in industrial and automotive systems. Experience unparalleled quality and innovation that elevate your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic epoxy enhances durability and makes the product resistant to environmental factors, ensuring longevity and reliability in various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors provide better efficiency and are often preferred for their ability to conduct current more effectively than P-channel types, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy integration in circuits, offering protection against voltage spikes and enhancing overall performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET delivers fast response times and improved efficiency, making it ideal for power management and conversion circuits.

Minimum DS Breakdown Voltage: 50 V

A minimum breakdown voltage of 50V ensures that the transistor can operate safely and reliably in high-voltage applications, reducing the risk of failure.

Package Shape: RECTANGULAR

The rectangular shape contributes to ease of installation and effective thermal management, optimizing the overall footprint in device layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower on-resistance and higher efficiency during conduction states, which is critical for reducing power losses.

Maximum Pulsed Drain Current (IDM): 540 A

With a pulsed drain current capability of 540A, this FET is fitted to handle short bursts of high current, ideal for demanding applications like motor drives and power inverters.

Maximum Drain Current (Abs) (ID): 180 A

The capacity to handle a maximum continuous drain current of 180A makes this FET suitable for applications requiring substantial current flow without overheating.

No. of Terminals: 4

Having four terminals facilitates versatile connection configurations and simplifies integration into complex circuit designs.

Maximum Power Dissipation (Abs): 360 W

A power dissipation rating of 360W signifies that this FET can effectively manage heat during operation, enhancing performance and reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount design ensures secure installation and improved thermal conductivity, critical in high-power applications where heat dissipation is vital.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology is known for its high efficiency and fast switching speeds, making it suitable for modern electronic applications requiring rapid on/off control.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures (up to 150 °C), this transistor is well-suited for environments with elevated thermal conditions, ensuring stable performance.

Transistor Element Material: SILICON

Silicon is a widely used semiconductor material that provides excellent performance characteristics, making this product reliable and efficient for various applications.

Maximum Drain Current (ID): 180 A

Again, a maximum drain current of 180A signifies robust capability for continuous operation, ensuring it can handle loads effectively in commercial power systems.

Maximum Drain-Source On Resistance: 0.006 ohm

An ultra-low on-resistance of 0.006 ohms minimizes power loss during operation, enhancing efficiency significantly, which is crucial for battery-powered and high-performance applications.

Terminal Position: UPPER

Upper terminal positioning caters to ease of access for connections and simplifies PCB layout designs, enhancing overall integration in electronic systems.

Case Connection: ISOLATED

An isolated case connection prevents unwanted interactions with other components, enhancing safety and allowing for more compact designs.

Reference Standard: UL RECOGNIZED

Being UL recognized ensures that the FET meets stringent safety standards, providing peace of mind and confidence for manufacturers and end users alike.

Technical Specifications

Power Field Effect Transistors (FET) STE180N05 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

180 A

Maximum Drain Current (ID):

180 A

Maximum Drain-Source On Resistance:

.006 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

540 A

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE180N05 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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