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STE140NF20D

STMicroelectronics

STE140NF20D by STMicroelectronics

STE140NF20D by STMicroelectronics is a N-CHANNEL Power FET with 200V DS Breakdown Voltage and 140A ID. Ideal for SWITCHING applications, it features a single configuration with built-in diode, 0.012 ohm Drain-Source On Resistance, and 560A Max Pulsed Drain Current.

Median Price

$39.557

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 69 parts In-Stock

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$39.557

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69

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Vyrian

USA . 6,919 parts In-Stock

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Digiode

USA . 4,148 parts In-Stock

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4,148

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Anansix

USA . 2,205 parts In-Stock

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PC Components Company LLC

USA . 6 parts In-Stock

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Bristol Electronics

USA . 1 parts In-Stock

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IDEA Electronic Components Group

UK . 293 parts In-Stock

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$1.039

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$0.935

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293

$1.039

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$0.935

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MKK Technologies

India . 1,499 parts In-Stock

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$1.953

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1,499

$1.953

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$1.953

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1,499

$1.953

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AZTECH Wire

Italy . 729 parts In-Stock

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$13.432

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729

$13.432

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Ampacity Inc.

Singapore . 1,381 parts In-Stock

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$21.050

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1,381

$21.050

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Continental Prestige Electronics

USA . 358 parts In-Stock

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$39.557

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$38.766

358

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$38.766

Lixinc

USA . 18,508 parts In-Stock

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Corphita

USA . 4,774 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,587 parts In-Stock

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Argo Parts USA

USA . 1,565 parts In-Stock

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Parana Technologies

USA . 1,039 parts In-Stock

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$1.242

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$1.242

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Netroflash

USA . 500 parts In-Stock

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$38.766

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$37.580

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$36.788

500

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$38.766

$37.580

$36.788

Perfect Parts

USA . 232 parts In-Stock

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Authorized Procurement Solutions

USA . 35 parts In-Stock

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Overview

Unlock the power of efficient switching with the STE140NF20D by STMicroelectronics. Manufactured with precision and expertise, this N-CHANNEL Power FET offers superior performance and reliability for a range of applications. With a maximum drain current of 140A and a low on-resistance of 0.012 ohm, this transistor is designed to deliver optimal results in various scenarios. Whether you're looking to enhance your circuit design or improve energy efficiency, the STE140NF20D provides the value, benefits, and advantages you need to take your project to the next level. Experience the difference with STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient flyback and energy recovery in switching applications, improving overall system efficiency.

Transistor Application: SWITCHING

Designed specifically for high-frequency switching applications, making it ideal for power electronics and motor control systems.

Minimum DS Breakdown Voltage: 200 V

Can handle high voltage levels, suitable for a wide range of industrial and automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting on circuit boards and provides efficient heat dissipation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily turned ON and OFF, offering precise control in switching applications.

Maximum Pulsed Drain Current (IDM): 560 A

Capable of handling high peak currents, suitable for high-power applications with transient loads.

Avalanche Energy Rating (EAS): 800 mJ

High avalanche energy rating ensures reliable operation in applications where high-energy spikes are expected.

Maximum Drain Current (Abs) (ID): 140 A

Can sustain continuous high current levels, making it suitable for power electronics and motor control applications.

No. of Terminals: 4

Simple 4-terminal design for easy connection and integration into circuit boards.

Maximum Power Dissipation (Abs): 500 W

High power dissipation capability ensures reliable operation under high load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure mounting on heatsinks or other surfaces for efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low ON-resistance and high switching speeds, making it ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

Can withstand high operating temperatures, suitable for industrial and automotive environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance and reliability in a wide range of applications.

Terminal Finish: NICKEL

Nickel finish provides good conductivity and corrosion resistance, ensuring reliable connections.

Maximum Drain-Source On Resistance: 0.012 ohm

Low ON-resistance reduces power losses and improves efficiency in switching applications.

Terminal Position: UPPER

Upper terminal position for easy mounting and connection in circuit designs.

Case Connection: ISOLATED

Isolated case connection improves safety and helps prevent electrical interference in the system.

Technical Specifications

Power Field Effect Transistors (FET) STE140NF20D attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Additional Features:

AVALANCHE ENERGY RATED

Avalanche Energy Rating (EAS):

800 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

140 A

Maximum Drain Current (ID):

140 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PUFM-X4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

560 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

NICKEL

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STE140NF20D Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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