Loading...

STD30NF06

STMicroelectronics

STD30NF06 by STMicroelectronics

STD30NF06 by STMicroelectronics is a powerful N-channel FET designed for switching applications. It features a max drain current of 28 A, a breakdown voltage of 60 V, and low on-resistance of 0.028 Ω. Ideal for efficient power management in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,451 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,451

-

-

-

-

Digiode

USA . 1,336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,336

-

-

-

-

Anansix

USA . 1,238 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,238

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,552 parts In-Stock

1+ parts

$1.782

100+ parts

-

1k+ parts

$1.604

10k+ parts

-

1,552

$1.782

-

$1.604

-

MKK Technologies

India . 2,335 parts In-Stock

1+ parts

$3.351

100+ parts

-

1k+ parts

-

10k+ parts

-

2,335

$3.351

-

-

-

DigiPath Technology Company

USA . 2,335 parts In-Stock

1+ parts

$3.351

100+ parts

-

1k+ parts

-

10k+ parts

-

2,335

$3.351

-

-

-

AZTECH Wire

Italy . 1,092 parts In-Stock

1+ parts

$15.910

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$15.910

-

-

-

Metaverse IC Inc.

Canada . 50,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

50,000

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,897 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,897

-

-

-

-

Kepictronics

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,000

-

-

-

-

Alle Elektronik GmbH

Germany . 4,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,457

-

-

-

-

Corphita

USA . 3,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,608

-

-

-

-

Parana Technologies

USA . 1,118 parts In-Stock

1+ parts

-

100+ parts

$2.131

1k+ parts

-

10k+ parts

-

1,118

-

$2.131

-

-

RC Electronics

USA . 403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

403

-

-

-

-

Overview

Unlock exceptional performance with the STD30NF06 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficient switching applications, this N-channel power FET delivers superior reliability and minimal energy loss, making it ideal for power management systems in consumer electronics and industrial automation. Enjoy peace of mind with ST's commitment to quality and excellence, ensuring your projects run smoothly and efficiently. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package material ensures durability and protection against environmental factors, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally offer lower on-resistance and higher efficiency compared to P-channel transistors, which enhances performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and improves performance by providing intrinsic freewheeling capability for inductive loads.

Transistor Application: SWITCHING

Designed for switching applications, it allows for high-speed operation, essential for modern electronic circuits.

Surface Mount: YES

Surface mount technology (SMT) enables compact PCB designs and automated assembly, improving manufacturing efficiency.

Minimum DS Breakdown Voltage: 60 V

With a minimum DS breakdown voltage of 60 V, this FET can handle a wide range of high voltage applications with reliability.

Package Shape: RECTANGULAR

The rectangular package shape is standard for efficient use of space on PCBs and provides ease of handling during assembly.

Terminal Form: GULL WING

Gull wing terminals enhance soldering quality and reliability, making it easier to integrate into various PCB layouts.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation contributes to low power consumption in the off state, improving energy efficiency overall.

Maximum Pulsed Drain Current (IDM): 112 A

A high maximum pulsed drain current indicates superior performance under transient conditions, suitable for high-power applications.

Avalanche Energy Rating (EAS): 230 mJ

A high EAS rating allows the device to withstand energy spikes, ensuring reliability in dynamic environments.

No. of Terminals: 2

The simple two-terminal configuration makes it easy to integrate into circuits, reducing complexity.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, allowing for more compact designs and integration of multiple components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high switching speeds and low power consumption, making it ideal for modern electronic applications.

Transistor Element Material: SILICON

Silicon is widely used in FET design due to its favorable electrical properties, contributing to overall performance and reliability.

Maximum Drain Current (ID): 28 A

With a maximum drain current rating of 28 A, this FET is capable of handling substantial loads, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.028 ohm

Low on-resistance translates to higher efficiency and reduced power losses during operation, enhancing overall system performance.

Terminal Position: SINGLE

A single terminal position simplifies the design and layout process, making it easier for engineers to incorporate into their circuits.

Case Connection: DRAIN

Connecting the case to the drain allows for effective thermal management, essential for high-power devices to avoid overheating.

Technical Specifications

Power Field Effect Transistors (FET) STD30NF06 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

28 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

112 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD30NF06 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20