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STD22NM20NT4

STMicroelectronics

STD22NM20NT4 by STMicroelectronics

STD22NM20NT4 from STMicroelectronics is a robust N-channel FET designed for efficient switching applications. It features a max drain current of 22 A, breakdown voltage of 200 V, and operates at up to 150 °C. Ideal for power management in compact devices.

Median Price

$0.819

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 150 parts In-Stock

1+ parts

$0.819

100+ parts

$0.860

1k+ parts

$0.811

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-

150

$0.819

$0.860

$0.811

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Digiode

USA . 3,579 parts In-Stock

1+ parts

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3,579

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Vyrian

USA . 3,553 parts In-Stock

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3,553

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Anansix

USA . 835 parts In-Stock

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835

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Inland Empire Components Inc.

USA . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 204 parts In-Stock

1+ parts

$1.338

100+ parts

-

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$1.204

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204

$1.338

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$1.204

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MKK Technologies

India . 446 parts In-Stock

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$2.515

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446

$2.515

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DigiPath Technology Company

USA . 446 parts In-Stock

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$2.515

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446

$2.515

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AZTECH Wire

Italy . 482 parts In-Stock

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$10.420

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482

$10.420

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Alle Elektronik GmbH

Germany . 4,165 parts In-Stock

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4,165

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Parana Technologies

USA . 2,028 parts In-Stock

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$1.599

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2,028

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$1.599

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Corphita

USA . 1,496 parts In-Stock

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1,496

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Overview

Unlock the power of efficiency with the STD22NM20NT4 from STMicroelectronics! Renowned for its exceptional quality and reliability, this N-channel Power FET is designed for seamless switching applications in various industries. With superior performance under demanding conditions, it ensures reduced energy loss and enhanced operational stability, giving you the competitive edge you need. Upgrade your projects and experience unmatched value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body provides durability and resistance to environmental factors, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better efficiency and higher performance, making this transistor a strong choice for high-speed switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode feature allows for easier integration in circuit designs, catering to applications where flyback diodes are necessary.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle rapid on/off operations effectively, enhancing overall circuit responsiveness.

Surface Mount: YES

Being surface mount compatible facilitates higher density circuitry, enabling more compact and efficient designs.

Minimum DS Breakdown Voltage: 200 V

A minimum breakdown voltage of 200V allows it to handle high-voltage applications safely, making it reliable in harsher electrical environments.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs and provides better thermal management.

Terminal Form: GULL WING

Gull-wing terminals ensure robust mechanical connections and are easier to solder, enhancing manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs typically have lower off-state leakage currents, contributing to better energy efficiency in devices.

Maximum Pulsed Drain Current (IDM): 88 A

The capability to handle a pulsed drain current of 88A indicates excellent transient performance, making it suitable for applications with high inrush currents.

Avalanche Energy Rating (EAS): 380 mJ

A high avalanche energy rating suggests robustness against transient voltage spikes, enhancing reliability in stressful operating conditions.

Maximum Drain Current (Abs) (ID): 22 A

A maximum drain current of 22A provides versatility in a range of applications, suitable for both low and moderately high power designs.

No. of Terminals: 2

The simplicity of a 2-terminal design allows for easy integration and simplifies circuit layout.

Maximum Power Dissipation (Abs): 100 W

A maximum power dissipation of 100W permits the FET to operate efficiently in applications requiring higher power without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline design aids in space-saving, enabling smaller and more compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power requirement, making it energy efficient and effective for various electronic circuits.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature allows the FET to function reliably in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon offers excellent electrical properties and thermal stability, contributing to the longevity and performance of the transistor.

Terminal Finish: MATTE TIN

The matte tin finish enhances solderability and prevents oxidation, ensuring reliable electrical connections and durability.

Maximum Drain Current (ID): 22 A

Again confirming 22A max drain current shows that this FET is robust for application in various electronic circuits.

Maximum Drain-Source On Resistance: 0.105 ohm

A low on-resistance enhances efficiency by minimizing power loss and heat generation during operation, promoting lower thermal management requirements.

Terminal Position: SINGLE

Single terminal positioning simplifies design and layout, making it easier to implement into various board designs.

Technical Specifications

Power Field Effect Transistors (FET) STD22NM20NT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

380 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

22 A

Maximum Drain Current (ID):

22 A

Maximum Drain-Source On Resistance:

.105 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

88 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD22NM20NT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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