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STD20N20T4

STMicroelectronics

STD20N20T4 by STMicroelectronics

STD20N20T4 by STMicroelectronics is an N-channel FET designed for switching applications, featuring a max drain current of 18 A and a breakdown voltage of 200 V. It operates in enhancement mode with a low on-resistance of 0.125 Ω. Ideal for compact power management solutions, it comes in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,620 parts In-Stock

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4,620

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Vyrian

USA . 2,691 parts In-Stock

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2,691

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Anansix

USA . 1,940 parts In-Stock

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1,940

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J2 Sourcing AB

Sweden . 1,280 parts In-Stock

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1,280

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,352 parts In-Stock

1+ parts

$1.327

100+ parts

-

1k+ parts

$1.194

10k+ parts

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1,352

$1.327

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$1.194

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MKK Technologies

India . 1,539 parts In-Stock

1+ parts

$2.495

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1,539

$2.495

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$2.495

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1,539

$2.495

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AZTECH Wire

Italy . 1,044 parts In-Stock

1+ parts

$17.520

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1,044

$17.520

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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QUARKTWIN TECHNOLOGY LTD

USA . 24,940 parts In-Stock

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24,940

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Authorized Procurement Solutions

USA . 22,000 parts In-Stock

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22,000

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Kepictronics

USA . 8,026 parts In-Stock

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8,026

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A-Z Elektronik GmbH

Germany . 6,786 parts In-Stock

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6,786

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Parana Technologies

USA . 2,235 parts In-Stock

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$1.586

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2,235

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$1.586

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Alle Elektronik GmbH

Germany . 1,378 parts In-Stock

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1,378

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Corphita

USA . 229 parts In-Stock

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229

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Perfect Parts

USA . 32 parts In-Stock

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32

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Overview

Unlock superior performance with the STD20N20T4 from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for efficient switching applications, this N-channel power FET excels in reliability and durability, ensuring optimal energy management in your circuits. Its compact surface mount design allows for seamless integration in various devices, delivering outstanding value and versatility for both commercial and industrial projects. Choose STMicroelectronics for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic epoxy ensures durability and protects the internal components, making this FET suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their high efficiency and fast switching speeds, making them ideal for power management and switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

This configuration provides additional protection and functionality, useful in applications requiring flyback protection.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle rapid on/off cycles, enhancing performance in various electronic circuits.

Surface Mount: YES

Surface mount design allows for easier integration into compact PCB layouts, reducing space requirements and improving assembly efficiency.

Minimum DS Breakdown Voltage: 200 V

A high breakdown voltage rating increases the versatility of the FET, allowing it to be used in high-voltage applications without risk of failure.

Package Shape: RECTANGULAR

Rectangular package shapes contribute to improved thermal management and can facilitate better layout designs on printed circuit boards.

Terminal Form: GULL WING

Gull wing terminals provide straightforward soldering and mounting, ensuring reliable connections and improved assembly characteristics.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer increased control and performance efficiency, enabling effective modulation in power applications.

Maximum Pulsed Drain Current (IDM): 72 A

The high pulsed drain current capability allows this FET to handle large surges in current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 110 mJ

This avalanche energy rating indicates robust performance against transient events, further securing the integrity of the circuit during operation.

Maximum Drain Current (Abs) (ID): 18 A

With a solid maximum drain current, this FET can handle significant loads in a variety of power applications without risking damage.

No. of Terminals: 2

The simplicity of having only two terminals makes it easy to incorporate into basic circuits without excessive complexity.

Maximum Power Dissipation (Abs): 90 W

A high power dissipation rating enables effective thermal management and assures reliable operation under significant load conditions.

Package Style (Meter): SMALL OUTLINE

Small outline packages are advantageous for space-constrained designs, allowing for a compact, efficient prototyping and production process.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides excellent switching characteristics and low on-resistance, facilitating efficient operation in power applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature makes this FET suitable for use in demanding environments, enhancing reliability across different applications.

Transistor Element Material: SILICON

Silicon is a standard semiconductor material, providing reliable performance and easily obtainable parts for various applications.

Terminal Finish: Matte Tin (Sn)

Matte tin coating enhances solderability and reduces the risk of solder defects, contributing to a more effective assembly process.

Maximum Drain Current (ID): 18 A

Having two listings of maximum drain current emphasizes its ability to support consistent operation in high-performance scenarios.

Maximum Drain-Source On Resistance: 0.125 ohm

Low on-resistance contributes to better efficiency and lower heat generation during operation, perfect for energy-sensitive applications.

Terminal Position: SINGLE

Single terminal positioning optimizes layout convenience and simplifies integration into existing designs.

Technical Specifications

Power Field Effect Transistors (FET) STD20N20T4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

110 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

18 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.125 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD20N20T4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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