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STD17NF03L-1

STMicroelectronics

STD17NF03L-1 by STMicroelectronics

STD17NF03L-1 by STMicroelectronics is a N-channel Power FET with 30V DS Breakdown Voltage and 68A IDM. Ideal for switching applications, it features a built-in diode, 0.06 ohm RDS(on), and 20W Pdiss. Suitable for enhancement mode operation in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 9,450 parts In-Stock

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9,450

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ComSIT USA

USA . 9,450 parts In-Stock

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9,450

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Vyrian

USA . 4,489 parts In-Stock

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4,489

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Cyclops Electronics Ltd

UK . 661 parts In-Stock

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661

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Digiode

USA . 336 parts In-Stock

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336

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Anansix

USA . 206 parts In-Stock

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206

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LWI Electronics Inc

India . 10 parts In-Stock

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10

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 800 parts In-Stock

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$1.696

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$1.527

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800

$1.696

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$1.527

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MKK Technologies

India . 356 parts In-Stock

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$3.190

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356

$3.190

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DigiPath Technology Company

USA . 356 parts In-Stock

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$3.190

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356

$3.190

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AZTECH Wire

Italy . 1,046 parts In-Stock

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$9.460

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$9.460

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Perfect Parts

USA . 24,696 parts In-Stock

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24,696

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Kepictronics

USA . 13,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,940 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,946 parts In-Stock

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Parana Technologies

USA . 2,217 parts In-Stock

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$2.028

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$2.028

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Corphita

USA . 598 parts In-Stock

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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Overview

Upgrade your power management system with the STD17NF03L-1 from STMicroelectronics, a leading manufacturer known for top-quality electronic components. This N-channel Power FET is perfect for switching applications, offering high performance and reliability. With a maximum drain current of 17A and low on-resistance, this transistor delivers exceptional efficiency and power handling capabilities. Whether you're looking to enhance your circuit design or improve overall system performance, the STD17NF03L-1 is the ideal choice for your power control needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, ensuring its longevity and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer lower ON-resistance and higher current carrying capability compared to P-Channel FETs, making them suitable for high power applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast switching speeds and efficient power management.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and higher efficiency in switching applications compared to depletion mode FETs.

Maximum Pulsed Drain Current (IDM): 68 A

High maximum pulsed drain current allows for handling of high transient currents and improves the overall robustness of the transistor.

Maximum Power Dissipation (Abs): 20 W

With a high maximum power dissipation rating, this transistor can handle power loads efficiently without overheating.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for reliable operation in a wide range of environmental conditions without compromising performance.

Maximum Drain-Source On Resistance: 0.06 ohm

Low ON-resistance results in reduced power losses and improved efficiency, making this FET ideal for high power applications.

Technical Specifications

Power Field Effect Transistors (FET) STD17NF03L-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

17 A

Maximum Drain Current (ID):

17 A

Maximum Drain-Source On Resistance:

.06 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

68 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD17NF03L-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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