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STD12NF06-1

STMicroelectronics

STD12NF06-1 by STMicroelectronics

STD12NF06-1 from STMicroelectronics is an N-channel FET designed for efficient switching applications. It features a max drain current of 12 A, a breakdown voltage of 60 V, and operates at up to 175 °C. Ideal for power management in various electronic devices.

Median Price

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Lifecycle Status

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4

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1k+

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Digiode

USA . 4,926 parts In-Stock

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Vyrian

USA . 3,733 parts In-Stock

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Anansix

USA . 297 parts In-Stock

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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IDEA Electronic Components Group

UK . 609 parts In-Stock

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$0.634

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$0.570

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609

$0.634

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$0.570

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MKK Technologies

India . 1,777 parts In-Stock

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$1.192

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DigiPath Technology Company

USA . 1,777 parts In-Stock

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$1.192

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AZTECH Wire

Italy . 1,060 parts In-Stock

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$9.090

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Component Stockers USA

USA . 763 parts In-Stock

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$99.990

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Kepictronics

USA . 10,080 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,611 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,512 parts In-Stock

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Corphita

USA . 896 parts In-Stock

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Parana Technologies

USA . 855 parts In-Stock

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$0.758

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Overview

Elevate your projects with the STD12NF06-1 N-channel Power FET from STMicroelectronics, a leader in semiconductor innovation. Designed for optimal performance, this robust transistor excels in switching applications, delivering high efficiency and reliability. With its compact, plastic-epoxy package and built-in diode, it’s perfect for demanding environments where space and durability matter. Trust STMicroelectronics to power your success today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and reliability, making the FET suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better efficiency and lower on-resistance, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances protection against back EMF, making it safer for use in inductive loads.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle rapid on and off states efficiently.

Minimum DS Breakdown Voltage: 60 V

A minimum breakdown voltage of 60V makes this FET suitable for high-voltage applications, providing design flexibility.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCBs and enhances thermal performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mounting and excellent electrical contact, increasing device reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode allows for lower gate drive voltages, reducing power consumption and improving efficiency.

Maximum Pulsed Drain Current (IDM): 48 A

With a maximum pulsed drain current of 48A, this FET can handle significant load currents, making it versatile for various applications.

Avalanche Energy Rating (EAS): 140 mJ

A high avalanche energy rating allows this FET to withstand transient voltage spikes, enhancing reliability in dynamic environments.

Maximum Drain Current (Abs) (ID): 12 A

The maximum continuous drain current of 12A ensures this FET is capable of handling substantial power levels.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit design and allows for versatile layout options.

Maximum Power Dissipation (Abs): 30 W

A maximum power dissipation of 30W provides good thermal performance, enabling higher efficiency and reliability.

Package Style (Meter): IN-LINE

The in-line package style allows for efficient PCB layout and easier assembly.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology offers high input impedance and low gate drive power, making it suitable for high-speed applications.

Maximum Operating Temperature: 175 °C

The high operating temperature rating ensures the FET can function reliably in demanding environments.

Transistor Element Material: SILICON

Silicon is a standard in FET technology, providing good performance and stability for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin finish offers good solderability and corrosion resistance, ensuring reliable connections.

Maximum Drain Current (ID): 12 A

With a rated maximum drain current of 12A, it’s suitable for various power applications ensuring dependable operation.

Maximum Drain-Source On Resistance: 0.1 ohm

A low on-resistance of 0.1 ohm reduces power loss and improves efficiency, making it a great choice for power management.

Terminal Position: SINGLE

The single terminal position enhances simplicity in circuit design and layout.

Case Connection: DRAIN

The drain case connection enhances thermal management and provides flexibility in circuit design.

Technical Specifications

Power Field Effect Transistors (FET) STD12NF06-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

140 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD12NF06-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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