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STD10NM65N

STMicroelectronics

STD10NM65N by STMicroelectronics

STD10NM65N by STMicroelectronics is an N-channel MOSFET designed for efficient switching applications. It features a 650V breakdown voltage, 36A max pulsed drain current, and operates at up to 150 °C. Ideal for power management in compact electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,782 parts In-Stock

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7,782

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Digiode

USA . 4,597 parts In-Stock

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4,597

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Anansix

USA . 2,742 parts In-Stock

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2,742

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,885 parts In-Stock

1+ parts

$1.106

100+ parts

-

1k+ parts

$0.995

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1,885

$1.106

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$0.995

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MKK Technologies

India . 2,164 parts In-Stock

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$2.079

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2,164

$2.079

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DigiPath Technology Company

USA . 2,164 parts In-Stock

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$2.079

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2,164

$2.079

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AZTECH Wire

Italy . 626 parts In-Stock

1+ parts

$10.640

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626

$10.640

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Component Stockers USA

USA . 299 parts In-Stock

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$99.990

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299

$99.990

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Perfect Parts

USA . 21,239 parts In-Stock

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21,239

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A-Z Elektronik GmbH

Germany . 4,973 parts In-Stock

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Kepictronics

USA . 4,927 parts In-Stock

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Corphita

USA . 4,376 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,854 parts In-Stock

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3,854

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 770 parts In-Stock

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$1.322

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770

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$1.322

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Overview

Unlock unparalleled performance with the STD10NM65N N-channel Power FET from STMicroelectronics, renowned for its commitment to quality and innovation. Designed for efficient switching applications, this robust transistor ensures reliability under extreme conditions while providing excellent power management. Ideal for energy-efficient systems, it delivers significant operational benefits—enhancing your designs while reducing costs. Elevate your projects with STMicroelectronics' trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good thermal performance and reliability, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are efficient for switching applications, allowing for faster operation and lower on-resistance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances performance by providing additional protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficiency and responsiveness in circuit design.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly processes, making it ideal for modern electronics.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET is suitable for high-voltage applications, providing robust performance under extreme conditions.

Package Shape: RECTANGULAR

The rectangular shape offers efficient use of space on printed circuit boards (PCBs), maximizing design flexibility.

Terminal Form: GULL WING

Gull wing terminals provide stable mechanical connections and are compatible with various mounting techniques.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption in idle states, boosting overall energy efficiency.

Maximum Pulsed Drain Current (IDM): 36 A

The high pulsed drain current capability supports demanding applications, enabling reliable performance under load.

Avalanche Energy Rating (EAS): 300 mJ

A significant avalanche energy rating provides enhanced reliability against voltage spikes, ensuring circuit safety.

Maximum Drain Current (Abs) (ID): 9 A

The maximum drain current rating of 9 A ensures this FET can handle substantial loads, making it suitable for various applications.

No. of Terminals: 2

The simple two-terminal configuration simplifies circuit design and integration into existing systems.

Maximum Power Dissipation (Abs): 90 W

A high power dissipation rating indicates robustness under heavy loads, improving overall product longevity.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, allowing for efficient PCB layout.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high-speed switching and low power consumption, enhancing overall performance.

Maximum Operating Temperature: 150 °C

A high operating temperature rating provides versatility for use in demanding environments.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties and thermal conductivity, ensuring reliable performance.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish improves solderability, facilitating easier assembly and enhancing reliability.

Maximum Drain Current (ID): 9 A

With a consistent maximum drain current rating, this FET is reliable for power applications requiring steady performance.

Maximum Drain-Source On Resistance: 0.48 ohm

Low on-resistance minimizes power loss and heat generation, improving overall efficiency of the device.

Terminal Position: SINGLE

Single terminal position simplifies design and assembly processes, making it user-friendly in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The reflow time specification allows for proper soldering without damaging the component, ensuring durability and longevity.

Peak Reflow Temperature °C: 260

A high peak reflow temperature ensures compatibility with standard soldering processes, facilitating integration into various production lines.

Technical Specifications

Power Field Effect Transistors (FET) STD10NM65N attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.48 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD10NM65N Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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