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STD100N10LF7AG

STMicroelectronics

STD100N10LF7AG by STMicroelectronics

STD100N10LF7AG from STMicroelectronics is a robust N-channel MOSFET designed for efficient switching applications. It features a max drain current of 80 A, a breakdown voltage of 100 V, and operates in an enhancement mode at temperatures up to 175 °C. Ideal for power management in automotive and industrial systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,704 parts In-Stock

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Anansix

USA . 1,305 parts In-Stock

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Digiode

USA . 1,189 parts In-Stock

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1,189

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IDEA Electronic Components Group

UK . 613 parts In-Stock

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$0.916

100+ parts

-

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$0.825

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613

$0.916

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$0.825

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MKK Technologies

India . 1,612 parts In-Stock

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$1.723

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$1.723

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DigiPath Technology Company

USA . 1,612 parts In-Stock

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$1.723

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$1.723

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AZTECH Wire

Italy . 903 parts In-Stock

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$14.340

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903

$14.340

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A-Z Elektronik GmbH

Germany . 3,389 parts In-Stock

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3,389

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Corphita

USA . 2,148 parts In-Stock

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Parana Technologies

USA . 1,443 parts In-Stock

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$1.096

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$1.096

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Alle Elektronik GmbH

Germany . 1,007 parts In-Stock

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1,007

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Overview

Unlock the power of efficiency with the STD100N10LF7AG from STMicroelectronics, a leader in semiconductor innovation. This high-performance N-channel FET excels in switching applications, delivering exceptional reliability and thermal performance. With its robust design, it effortlessly handles demanding conditions, making it ideal for automotive and industrial uses. Experience superior quality and unmatched value as you elevate your projects with this versatile component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance in terms of faster switching speeds and higher efficiency, ideal for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the design and increases reliability by reducing the need for additional components.

Transistor Application: SWITCHING

Optimized for switching applications, this FET can handle rapid on/off cycles efficiently, making it suitable for power management.

Surface Mount: YES

Surface mount capability allows for compact designs and automated assembly processes, enhancing production efficiency.

Minimum DS Breakdown Voltage: 100 V

A breakdown voltage of 100 V provides robust performance in high-voltage applications, ensuring reliability under extreme conditions.

Package Shape: RECTANGULAR

The rectangular shape helps in efficient board layout and allows for better thermal management.

Terminal Form: GULL WING

Gull wing terminals facilitate better solder joint reliability and ease of assembly, which enhances the manufacturing process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower gate-source voltage requirements, improving overall efficiency.

Maximum Pulsed Drain Current (IDM): 320 A

A high pulsed drain current capability supports demanding applications such as motor drives and power supplies.

Avalanche Energy Rating (EAS): 200 mJ

This device can withstand high energy spikes, enhancing reliability in various load conditions and reducing the risk of damage.

No. of Terminals: 2

Having two terminals allows for a simplified connection, reducing the complexity in circuit design.

Maximum Power Dissipation (Abs): 125 W

A high power dissipation rating makes this FET suitable for applications that require handling significant power levels.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for space-efficient designs, making it a great choice for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high speed and low power consumption, which makes this FET viable for modern electronic applications.

Maximum Operating Temperature: 175 °C

A high maximum operating temperature ensures stable performance even in harsh environments, expanding application potential.

Transistor Element Material: SILICON

Silicon as a material provides good thermal and electrical properties, ensuring reliable operation and performance.

Minimum Operating Temperature: -55 °C

The ability to operate at very low temperatures enhances application flexibility, particularly in extreme environments.

Maximum Drain Current (ID): 80 A

A maximum drain current of 80 A makes this FET suitable for substantial load currents, ideal for high-performance circuits.

Maximum Drain-Source On Resistance: 0.011 ohm

Low on-resistance contributes to high efficiency and minimal power loss during operation, enhancing overall circuit performance.

Terminal Position: SINGLE

A single terminal position simplifies layout considerations and helps in maintaining a clean circuit design.

Case Connection: DRAIN

A drain connection configuration can reduce the stray inductance, contributing to faster switching speeds.

Reference Standard: AEC-Q101

Compliance with AEC-Q101 indicates a high level of reliability and performance in automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) STD100N10LF7AG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

200 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

80 A

Maximum Drain-Source On Resistance:

.011 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

320 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STD100N10LF7AG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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