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STBP120DVDK6F

STMicroelectronics

STBP120DVDK6F by STMicroelectronics

STBP120DVDK6F from STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1.2V to 28V, with a max temp of 85 °C and features a small outline package (2x2.5mm). Ideal for efficient power supply management in space-constrained environments.

Median Price

$0.911

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.894

1k+ parts

$0.742

10k+ parts

$0.662

3,000

-

$0.894

$0.742

$0.662

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.928

10k+ parts

$0.827

3,000

-

-

$0.928

$0.827

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,351 parts In-Stock

1+ parts

$0.725

100+ parts

-

1k+ parts

-

10k+ parts

-

3,351

$0.725

-

-

-

Vyrian

USA . 11,461 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,461

-

-

-

-

Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Anansix

USA . 1,567 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,567

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,685 parts In-Stock

1+ parts

$0.650

100+ parts

-

1k+ parts

-

10k+ parts

-

2,685

$0.650

-

-

-

Corphita

USA . 4,621 parts In-Stock

1+ parts

$0.687

100+ parts

-

1k+ parts

-

10k+ parts

-

4,621

$0.687

-

-

-

Microchip USA

USA . 5,341 parts In-Stock

1+ parts

$5.283

100+ parts

-

1k+ parts

-

10k+ parts

-

5,341

$5.283

-

-

-

AZTECH Wire

Italy . 344 parts In-Stock

1+ parts

$20.340

100+ parts

-

1k+ parts

-

10k+ parts

-

344

$20.340

-

-

-

IDEA Electronic Components Group

UK . 235 parts In-Stock

1+ parts

$22.626

100+ parts

-

1k+ parts

$20.363

10k+ parts

-

235

$22.626

-

$20.363

-

MKK Technologies

India . 2,186 parts In-Stock

1+ parts

$42.546

100+ parts

-

1k+ parts

-

10k+ parts

-

2,186

$42.546

-

-

-

DigiPath Technology Company

USA . 2,186 parts In-Stock

1+ parts

$42.546

100+ parts

-

1k+ parts

-

10k+ parts

-

2,186

$42.546

-

-

-

Perfect Parts

USA . 10,416 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,416

-

-

-

-

iodParts Technologies Inc.

India . 8,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,016

-

-

-

-

A-Z Elektronik GmbH

Germany . 7,077 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,077

-

-

-

-

Kepictronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Assy Fe

Spain . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Authorized Procurement Solutions

USA . 1,260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,260

-

-

-

-

Parana Technologies

USA . 472 parts In-Stock

1+ parts

-

100+ parts

$27.052

1k+ parts

-

10k+ parts

-

472

-

$27.052

-

-

Overview

Unlock the potential of your designs with the STBP120DVDK6F from STMicroelectronics—a trusted leader in power management solutions. This compact, robust IC delivers exceptional efficiency and reliability across a wide temperature range, making it perfect for industrial applications. With its smart design, you can optimize performance while minimizing space. Experience unmatched quality and innovation that enhances your projects, ensuring you stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making the product reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern electronic circuits, which is beneficial for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board space utilization and facilitates efficient layout in PCB design.

Nominal Supply Voltage (Vsup): 2.9 V

A nominal supply voltage of 2.9 V makes this IC suitable for a wide range of electronic applications requiring low-power operation.

Power Supplies (V): 1.2/28

The versatile power supply range of 1.2 to 28 V provides flexibility for various applications, ensuring compatibility with multiple systems.

No. of Terminals: 10

With 10 terminals, this IC provides sufficient connectivity for complex circuits while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is suited for high-density applications, allowing manufacturers to save board space and reduce overall product size.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures the IC can function reliably in a variety of industrial environments, enhancing application resilience.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is ideal for use in extreme conditions, ensuring performance in harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent solderability and ensures robust electrical connection and longevity of the component.

Terminal Position: DUAL

Dual terminal positioning facilitates easy routing on printed circuit boards and enhances design flexibility.

Maximum Seated Height: 0.8 mm

A maximum seated height of 0.8 mm keeps the profile low, integrating seamlessly into miniaturized electronic designs.

Width: 2 mm

A width of only 2 mm aids in compact designs, making it a suitable choice for portable or space-limited applications.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management circuit, the IC effectively manages power distribution, improving the efficiency of the overall system.

Minimum Supply Voltage (Vsup): 1.2 V

With a minimum supply voltage requirement of 1.2 V, this IC is compatible with low-voltage systems, expanding its usability.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum reflow time of 30 seconds ensures reliable solder joint formation, crucial for maintaining component integrity during automated assembly processes.

Peak Reflow Temperature (°C): 260

The peak reflow temperature of 260 °C is aligned with standard soldering practices, ensuring compatibility with prevalent manufacturing techniques.

Length: 2.5 mm

At a length of 2.5 mm, this IC fits well into designs requiring compact solutions without compromising functionality.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades assures reliability and performance in demanding environments and applications.

Terminal Form: NO LEAD

A no-lead terminal form minimizes space while providing enhanced performance through reduced inductance and improved thermal conductivity.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density interconnections on PCBs, making the component suitable for advanced electronics.

Maximum Supply Voltage (Vsup): 28 V

With a maximum supply voltage of 28 V, this IC supports demanding power requirements, making it versatile for various applications.

Technical Specifications

Power Management ICs STBP120DVDK6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-N10

JESD-609 Code:

e4

Length:

2.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC10,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/28

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Power Management Circuits

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

2.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2 mm

Trade Compliance

STBP120DVDK6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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