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STB12NM50FDT4

STMicroelectronics

STB12NM50FDT4 by STMicroelectronics

STB12NM50FDT4 from STMicroelectronics is a powerful N-channel MOSFET designed for efficient switching applications. It features a 500V breakdown voltage, 12A max drain current, and operates at up to 150 °C. Ideal for high-performance power management in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,646 parts In-Stock

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5,646

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Digiode

USA . 2,911 parts In-Stock

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Anansix

USA . 2,659 parts In-Stock

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2,659

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,788 parts In-Stock

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$0.964

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$0.868

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1,788

$0.964

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$0.868

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MKK Technologies

India . 2,084 parts In-Stock

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$1.813

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2,084

$1.813

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DigiPath Technology Company

USA . 2,084 parts In-Stock

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$1.813

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2,084

$1.813

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AZTECH Wire

Italy . 1,040 parts In-Stock

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$12.630

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1,040

$12.630

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Alle Elektronik GmbH

Germany . 3,526 parts In-Stock

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3,526

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 3,260 parts In-Stock

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3,260

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Parana Technologies

USA . 240 parts In-Stock

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$1.153

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$1.153

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Perfect Parts

USA . 25 parts In-Stock

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Overview

Elevate your designs with the STB12NM50FDT4 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance N-channel Power FET offers superior efficiency and reliability for all your switching applications. Its compact surface-mount design ensures seamless integration, while built-in diode support enhances durability. Trust in ST's commitment to quality to empower your projects with unmatched performance and longevity—your ideal choice for robust power management!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides good protection against environmental factors and enhances durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer lower on-resistance and higher efficiency, making them suitable for many high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

A built-in diode simplifies circuit design and enhances reliability by protecting against reverse polarity.

Transistor Application: SWITCHING

This FET is ideal for switching applications, providing fast operation and energy efficiency.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, reducing overall production costs.

Minimum DS Breakdown Voltage: 500 V

A high breakdown voltage allows this FET to be used in high-voltage applications, ensuring robustness.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCBs, facilitating more compact system designs.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide reliable connections, enhancing manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode enables the FET to be off at zero gate voltage, allowing for more efficient power management.

Maximum Pulsed Drain Current (IDM): 48 A

A high pulsed drain current capability makes this FET suitable for demanding applications that require high peak currents.

Avalanche Energy Rating (EAS): 400 mJ

This energy rating indicates strong protection against avalanche breakdown, enhancing reliability under high-stress conditions.

Maximum Drain Current (Abs) (ID): 12 A

This maximum current rating ensures the FET can handle substantial loads, making it versatile for various applications.

No. of Terminals: 2

A two-terminal design simplifies the circuit, making the FET easy to integrate into different configurations.

Maximum Power Dissipation (Abs): 160 W

High power dissipation capability ensures effective thermal management, allowing it to operate under high load conditions.

Package Style (Meter): SMALL OUTLINE

The small outline package style is advantageous for space-constrained applications, allowing for more efficient board layouts.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and fast switching capabilities, making this FET ideal for modern applications.

Maximum Operating Temperature: 150 °C

A high operating temperature rating allows this FET to function reliably in harsh environments.

Transistor Element Material: SILICON

Silicon material ensures good thermal stability and performance, widely validated for power applications.

Terminal Finish: MATTE TIN

Matte tin finish on terminals prevents oxidation, ensuring reliable electrical connections over time.

Maximum Drain Current (ID): 12 A

This rating reinforces the device's ability to handle substantial loads in diverse applications.

Maximum Drain-Source On Resistance: 0.4 ohm

Low on-resistance minimizes power losses and improves overall efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position facilitates easy layout on PCBs, simplifying design and assembly.

Technical Specifications

Power Field Effect Transistors (FET) STB12NM50FDT4 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

400 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

48 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB12NM50FDT4 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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