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STB10NK60Z-1

STMicroelectronics

STB10NK60Z-1 by STMicroelectronics

STB10NK60Z-1 from STMicroelectronics is an N-channel MOSFET ideal for switching applications. It features a 600V breakdown voltage, 10A max drain current, and 115W power dissipation. Its compact design ensures efficient performance in various electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,376 parts In-Stock

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3,376

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Vyrian

USA . 3,218 parts In-Stock

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3,218

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Elcom Components

USA . 179 parts In-Stock

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179

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Anansix

USA . 100 parts In-Stock

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100

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ComSIT Distribution GmbH

Germany . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 768 parts In-Stock

1+ parts

$1.105

100+ parts

-

1k+ parts

$0.994

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-

768

$1.105

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$0.994

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Benley Electronics

USA . 2 parts In-Stock

1+ parts

$1.750

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-

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2

$1.750

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MKK Technologies

India . 2,043 parts In-Stock

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$2.078

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2,043

$2.078

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DigiPath Technology Company

USA . 2,043 parts In-Stock

1+ parts

$2.078

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2,043

$2.078

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AZTECH Wire

Italy . 380 parts In-Stock

1+ parts

$19.320

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380

$19.320

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 5,835 parts In-Stock

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5,835

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 1,105 parts In-Stock

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$1.321

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1,105

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$1.321

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Alle Elektronik GmbH

Germany . 1,082 parts In-Stock

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1,082

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Corphita

USA . 175 parts In-Stock

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175

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Overview

Unlock the power of reliable performance with the STB10NK60Z-1 from STMicroelectronics, a leader in semiconductor technology. This robust N-channel power FET excels in switching applications, showcasing exceptional efficiency and durability. Its impressive voltage handling and built-in diode ensure seamless operation across various industries—from automotive to industrial automation. Experience unmatched quality and innovation that drive your projects forward with confidence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and longevity, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel devices typically have lower on-resistance and higher efficiency, enhancing overall performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection and improves the versatility of the FET for different applications.

Transistor Application: SWITCHING

Optimized for switching applications, allowing for efficient control in power circuits.

Minimum DS Breakdown Voltage: 600 V

A high breakdown voltage ensures safe operation in high-voltage applications, making this FET suitable for various power circuits.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, contributing to compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical support, making installation easier and more reliable.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for lower power consumption and improved efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 36 A

This high pulsed current capability allows the FET to handle spikes, making it reliable for dynamic applications.

Avalanche Energy Rating (EAS): 300 mJ

High avalanche energy rating indicates robustness against voltage transients, increasing reliability in harsh conditions.

Maximum Drain Current (Abs) (ID): 10 A

A maximum drain current of 10 A allows it to support a wide range of load conditions efficiently.

No. of Terminals: 3

The 3-terminal design simplifies circuit connections and integration into different designs.

Maximum Power Dissipation (Abs): 115 W

Ability to dissipate 115 W of power ensures adequate heat management and reliable operation in power-intensive applications.

Package Style (Meter): IN-LINE

In-line package style enhances accessibility and ease of assembly on the PCB.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology enables high-speed operation and excellent switching characteristics, making it ideal for modern applications.

Maximum Operating Temperature: 150 °C

A high operating temperature threshold allows for use in demanding environments without compromising performance.

Transistor Element Material: SILICON

Silicon is a widely used material known for its excellent electrical properties, ensuring high performance and reliability.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and reduces the risk of oxidation, ensuring reliable electrical connections.

Maximum Drain Current (ID): 10 A

The capability to support 10 A provides flexibility in various applications requiring different current levels.

Maximum Drain-Source On Resistance: 0.75 ohm

Low on-resistance results in less power loss and improved efficiency during operation, enhancing overall performance.

Terminal Position: SINGLE

Single terminal position simplifies the layout and installation process, making it user-friendly.

Technical Specifications

Power Field Effect Transistors (FET) STB10NK60Z-1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from STMicroelectronics

Specs

Avalanche Energy Rating (EAS):

300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.75 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-262AA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

STB10NK60Z-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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