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STA2062

STMicroelectronics

STA2062 by STMicroelectronics

STA2062 by STMicroelectronics is a microcontroller with 361 terminals, operating at 1.1-1.3V supply voltage range. It features DMA and PWM channels, suitable for applications requiring high-speed processing and precise control, such as robotics or industrial automation systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,917 parts In-Stock

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3,917

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Anansix

USA . 2,687 parts In-Stock

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2,687

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Digiode

USA . 2,083 parts In-Stock

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2,083

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Chip Stock

USA . 167 parts In-Stock

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 225 parts In-Stock

1+ parts

$17.605

100+ parts

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$15.845

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225

$17.605

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$15.845

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MKK Technologies

India . 452 parts In-Stock

1+ parts

$33.105

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452

$33.105

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DigiPath Technology Company

USA . 452 parts In-Stock

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$33.105

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452

$33.105

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Corphita

USA . 3,818 parts In-Stock

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3,818

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Parana Technologies

USA . 2,177 parts In-Stock

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$21.050

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2,177

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$21.050

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Kepictronics

USA . 106 parts In-Stock

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106

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Perfect Parts

USA . 102 parts In-Stock

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102

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Overview

Unlock the power of innovation with the STA2062 by STMicroelectronics, a cutting-edge microcontroller designed to revolutionize your projects. Crafted with precision and expertise by STMicroelectronics, this microcontroller offers unparalleled quality and reliability. Ideal for a wide range of applications, the STA2062 boasts advanced features like DMA channels and PWM channels, making it a versatile choice for all your electronic needs. Experience the value and benefits of this top-of-the-line product, and take your projects to new heights with the STA2062.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient soldering, making this microcontroller suitable for automated production processes.

Maximum Supply Voltage: 1.3 V

Low maximum supply voltage helps in reducing power consumption and heat dissipation, making the product energy efficient.

Package Shape: SQUARE

Square package shape provides a compact form factor, saving space on the printed circuit board and enabling design flexibility.

No. of Terminals: 361

High number of terminals allow for greater connectivity and integration of external components, enhancing the functionality of the microcontroller.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Grid array package style with low profile and fine pitch design results in high density mounting, optimizing board space utilization.

Minimum Supply Voltage: 1.1 V

Low minimum supply voltage ensures stable operation even under low power conditions, promoting reliability in various applications.

DMA Channels: YES

Direct Memory Access (DMA) channels enable efficient data transfer between peripherals and memory without CPU intervention, improving overall system performance.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy and secure attachment to the PCB, simplifying assembly and enhancing mechanical stability.

Width: 16 mm

Narrow width enables the microcontroller to fit in compact devices and tight spaces, making it suitable for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time at peak temperature during soldering process minimizes thermal stress on the device, ensuring its long-term reliability.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance allows for robust soldering processes, suitable for lead-free assembly requirements in modern electronics manufacturing.

Length: 16 mm

Compact length of the microcontroller helps in accommodating the device in small form factor applications, enhancing portability and integration possibilities.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, the product offers integrated peripherals and processing capabilities in a single chip, simplifying system design and reducing component count.

Terminal Form: BALL

Ball terminal form provides reliable and secure connections during soldering, ensuring high electrical performance and signal integrity.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage at an optimal level maximizes the efficiency and performance of the microcontroller in various operating conditions.

PWM Channels: YES

PWM channels enable precise control of analog signals, essential for applications like motor control, LED dimming, and power management.

Terminal Pitch: 0.8 mm

Narrow terminal pitch allows for high-density mounting of the microcontroller, enabling more functionalities to be integrated in a limited PCB space.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent any potential damage to the device.

Speed: 333 rpm

The operating speed of 333 rpm ensures responsive and efficient processing of tasks, suitable for real-time applications that demand quick data processing.

Technical Specifications

Microcontrollers STA2062 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

333 rpm

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

STA2062 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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