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STA2051TR

STMicroelectronics

STA2051TR by STMicroelectronics

STA2051TR by STMicroelectronics is a 32-bit microcontroller designed for industrial applications, operating b/w -40 °C and 85°C. It features a max supply voltage of 3.6V, operates at up to 66 MHz, and includes 32 I/O lines for versatile connectivity. Its compact flatpack design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,409 parts In-Stock

1+ parts

-

100+ parts

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6,409

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Digiode

USA . 3,683 parts In-Stock

1+ parts

-

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3,683

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Anansix

USA . 1,348 parts In-Stock

1+ parts

-

100+ parts

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1,348

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 967 parts In-Stock

1+ parts

$15.320

100+ parts

-

1k+ parts

-

10k+ parts

-

967

$15.320

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Microchip USA

USA . 192 parts In-Stock

1+ parts

$16.779

100+ parts

-

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10k+ parts

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192

$16.779

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-

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IDEA Electronic Components Group

UK . 2,196 parts In-Stock

1+ parts

$72.271

100+ parts

-

1k+ parts

$65.044

10k+ parts

-

2,196

$72.271

-

$65.044

-

MKK Technologies

India . 23 parts In-Stock

1+ parts

$135.900

100+ parts

-

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23

$135.900

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DigiPath Technology Company

USA . 23 parts In-Stock

1+ parts

$135.900

100+ parts

-

1k+ parts

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23

$135.900

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Corphita

USA . 4,451 parts In-Stock

1+ parts

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4,451

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Parana Technologies

USA . 2,041 parts In-Stock

1+ parts

-

100+ parts

$86.410

1k+ parts

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10k+ parts

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2,041

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$86.410

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Vigor

Singapore . 2,000 parts In-Stock

1+ parts

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2,000

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Overview

Unlock unparalleled performance with the STA2051TR microcontroller from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for reliability across diverse applications, this high-quality microcontroller boasts robust temperature resilience and low power consumption, making it ideal for industrial automation, consumer electronics, and IoT devices. Experience enhanced efficiency and seamless integration, empowering your projects to reach new heights with ST's unmatched expertise.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability under various environmental conditions, making it suitable for a range of applications.

Surface Mount: YES

Surface mount technology allows for smaller and more compact designs, making integration into modern electronic systems easier.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V makes this microcontroller suitable for low-power applications, enhancing energy efficiency.

Package Shape: SQUARE

The square package shape is advantageous for uniform PCB layouts and aids in better space utilization.

Bit Size: 32

With a 32-bit architecture, this microcontroller supports complex computations and broader data handling capabilities, ideal for sophisticated applications.

No. of Terminals: 64

The 64 terminals provide ample connectivity options for peripherals, making it versatile for different project requirements.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flat-pack design is perfect for space-constrained applications where height limitations are critical.

Minimum Supply Voltage: 2.7 V

Operating from a minimum supply voltage of 2.7 V ensures compatibility with various power sources and battery-operated devices.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C allows this microcontroller to function reliably in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C ensures this microcontroller is suitable for extreme temperature conditions.

Terminal Finish: TIN

The tin finish on terminals enhances solderability, making assembly and manufacturing processes easier.

Terminal Position: QUAD

Quad terminal positioning facilitates better layout options and optimized routing on PCBs.

Maximum Seated Height: 1.6 mm

A maximum seated height of 1.6 mm allows for more compact designs while maintaining performance.

Width: 14 mm

The compact width of 14 mm enables space-efficient designs, suitable for a wide range of applications.

Maximum Clock Frequency: 66 MHz

With a maximum clock frequency of 66 MHz, this microcontroller delivers fast processing speeds for time-sensitive applications.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum time at peak reflow temperature of 30 seconds suggests good thermal stability during assembly, ensuring product integrity.

Peak Reflow Temperature: 250 °C

Surviving peak reflow temperatures of 250 °C indicates this microcontroller's robustness during the soldering process.

Length: 14 mm

The uniform length of 14 mm simplifies design consistency and allows for efficient use of PCB space.

Temperature Grade: INDUSTRIAL

Designed with an industrial temperature grade, this microcontroller is suited for applications used in harsh conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture enhances performance and efficiency, making it a suitable choice for resource-constrained applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, contributing to overall system efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and handling during assembly processes.

PWM Channels: YES

Integrated PWM channels enhance control capabilities for motors and other peripherals, making this microcontroller versatile for various applications.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, enhancing the product's adaptability over time.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm provides a compact layout while maintaining manufacturability and assembly efficiency.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that appropriate handling procedures must be followed to ensure reliability, making it suitable for a range of environments.

Speed: 66 rpm

A speed of 66 rpm aids in efficient processing of tasks, enhancing the microcontroller's performance for real-time applications.

No. of I/O Lines: 32

With 32 I/O lines, this microcontroller is capable of handling multiple input and output devices, making it versatile for various applications.

Technical Specifications

Microcontrollers STA2051TR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

66 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

STA2051TR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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