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STA2051ETR

STMicroelectronics

STA2051ETR by STMicroelectronics

STA2051ETR by STMicroelectronics is a 32-bit microcontroller with a max supply voltage of 3.6V and operates in extreme temps from -40 °C to 85°C. It features 64 terminals, supports PWM channels, and is ideal for industrial applications requiring robust performance. Its compact design ensures efficient integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,336 parts In-Stock

1+ parts

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3,336

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Vyrian

USA . 1,926 parts In-Stock

1+ parts

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1,926

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ComSIT Distribution GmbH

Germany . 869 parts In-Stock

1+ parts

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869

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Anansix

USA . 390 parts In-Stock

1+ parts

-

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390

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,568 parts In-Stock

1+ parts

$53.975

100+ parts

-

1k+ parts

$48.578

10k+ parts

-

1,568

$53.975

-

$48.578

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MKK Technologies

India . 566 parts In-Stock

1+ parts

$101.497

100+ parts

-

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566

$101.497

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DigiPath Technology Company

USA . 566 parts In-Stock

1+ parts

$101.497

100+ parts

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566

$101.497

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Kepictronics

USA . 12,500 parts In-Stock

1+ parts

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12,500

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Corphita

USA . 2,273 parts In-Stock

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2,273

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Parana Technologies

USA . 1,778 parts In-Stock

1+ parts

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100+ parts

$64.536

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1,778

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$64.536

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Overview

Unlock the potential of your innovative projects with the STA2051ETR microcontroller from STMicroelectronics. Designed for robustness and precision, this high-performance 32-bit solution thrives in diverse demanding environments, ensuring reliability even in extreme conditions. Benefit from its energy efficiency and advanced features that streamline your applications—from industrial automation to consumer electronics. Trust in STMicroelectronics' reputation for excellence and elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for diverse applications.

Surface Mount: YES

Surface mount technology allows for compact assemblies and improved circuit density, making it ideal for space-constrained designs.

Maximum Supply Voltage: 3.6 V

This low maximum supply voltage helps in energy-efficient designs, contributing to longer battery life in portable applications.

Address Bus Width: 20

A wider address bus width allows access to more memory and integrated peripherals, enhancing the performance of complex applications.

Package Shape: SQUARE

The square package shape ensures equal distribution of thermal and electrical properties, optimizing performance.

Bit Size: 32

A 32-bit architecture supports complex computations and larger data processing, suitable for modern applications.

No. of Terminals: 64

A higher number of terminals allows for greater connectivity options, enabling interfacing with multiple peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile design is ideal for applications where height is a constraint, ensuring compatibility with various PCBs.

Minimum Supply Voltage: 2.7 V

A lower minimum supply voltage ensures operation across a wider range of voltage levels, enhancing flexibility.

Maximum Operating Temperature: 85 °C

The high operating temperature ensures reliability and functionality in demanding environments.

Minimum Operating Temperature: -40 °C

Guaranteed functionality at low temperatures expands the product's usability in extreme conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides excellent solderability and corrosion resistance, ensuring longevity of connections.

Terminal Position: QUAD

Quad terminal positioning aids in better signal integrity and ease of integration into various circuit designs.

Maximum Seated Height: 1.6 mm

The low seated height reduces the footprint of the component, beneficial for compact electronic devices.

Width: 20 mm

Standard width allows for easy integration into existing designs and compatibility with common PCBs.

External Data Bus Width: 16

A 16-bit external data bus enhances data transfer capabilities, catering to applications requiring high data throughput.

Maximum Clock Frequency: 66 MHz

The high clock frequency enables fast processing speeds, improving system responsiveness and efficiency.

Maximum Time At Peak Reflow Temperature (s): 40

This ensures compatibility with various assembly processes, enhancing manufacturing flexibility.

Peak Reflow Temperature °C: 260

A higher peak reflow temperature indicates compatibility with advanced soldering techniques, important for modern electronics.

Length: 20 mm

Standard length facilitates easy handling and integration into designs without requiring special adjustments.

Temperature Grade: INDUSTRIAL

Industrial temperature grade confirms reliability in robust applications, making it suitable for industrial automation.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient instruction execution, contributing to higher performance and lower power consumption.

Technology: CMOS

CMOS technology allows for lower power consumption and reduced heat generation, enhancing the efficiency of electronic devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and mechanical stability, ensuring strong connections on the PCB.

PWM Channels: YES

The inclusion of PWM channels enables sophisticated control mechanisms, ideal for motor control and signal modulation.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the firmware, enhancing flexibility in application development.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch supports compact layouts without compromising on performance, essential for modern designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring appropriate handling and storage for reliability.

Speed: 66 rpm

This speed indicates the microcontroller's ability to operate effectively under certain conditions, improving overall application performance.

No. of I/O Lines: 48

With 48 I/O lines, it offers extensive interfacing capabilities, supporting a wide range of sensors and actuators.

Technical Specifications

Microcontrollers STA2051ETR attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

20

Bit Size:

32

Maximum Clock Frequency:

66 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

48

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

STA2051ETR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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