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STA2051GO

STMicroelectronics

STA2051GO by STMicroelectronics

STA2051GO by STMicroelectronics is a 32-bit microcontroller with a max clock frequency of 66 MHz, ideal for industrial applications. It features 64 terminals and operates in extreme temperatures from -40 °C to 85°C. Its low-profile design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,133 parts In-Stock

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4,133

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Anansix

USA . 2,133 parts In-Stock

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2,133

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Vyrian

USA . 349 parts In-Stock

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349

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Flip Electronics

USA . 170 parts In-Stock

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170

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 98 parts In-Stock

1+ parts

$38.519

100+ parts

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$34.667

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-

98

$38.519

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$34.667

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MKK Technologies

India . 415 parts In-Stock

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$72.432

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415

$72.432

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DigiPath Technology Company

USA . 415 parts In-Stock

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$72.432

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415

$72.432

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A-Z Elektronik GmbH

Germany . 5,177 parts In-Stock

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5,177

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Corphita

USA . 3,694 parts In-Stock

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Authorized Procurement Solutions

USA . 2,050 parts In-Stock

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2,050

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Parana Technologies

USA . 808 parts In-Stock

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$46.055

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808

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$46.055

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Perfect Parts

USA . 374 parts In-Stock

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374

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GreenTree Electronics

Israel . 167 parts In-Stock

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167

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Overview

Unlock limitless possibilities with the STA2051GO from STMicroelectronics, a leader in cutting-edge microcontroller technology. Designed for industrial applications, this robust 32-bit microcontroller excels in performance and reliability, ensuring seamless operation even in extreme conditions. Its compact low-profile design and advanced features empower innovations across automation, IoT, and consumer electronics, delivering exceptional value that drives your projects forward. Choose STA2051GO for quality you can trust!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of PCB space, reducing the overall size of electronic devices.

Package Shape: SQUARE

The square package shape provides a compact footprint, optimizing layout design and enhancing performance.

Bit Size: 32

A 32-bit architecture enables more complex computations and higher processing power, suitable for demanding applications.

No. of Terminals: 64

64 terminals provide ample connectivity options, accommodating more peripherals and functionalities in designs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design makes it ideal for space-constrained applications, such as portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is reliable in a variety of industrial environments.

Minimum Operating Temperature: -40 °C

Able to function at -40 °C, it is suitable for demanding applications operating in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish ensures excellent solderability and enhances the longevity of the connections.

Terminal Position: QUAD

Quad terminal positioning provides a well-balanced physical design that aids in efficient circuit layout.

Maximum Seated Height: 1.6 mm

A low seated height allows for optimal space utilization on PCBs, ideal for sleek and compact designs.

Width: 10 mm

A narrow width enhances flexibility in design layout, allowing integration in tight spaces.

Maximum Clock Frequency: 66 MHz

A maximum clock frequency of 66 MHz offers sufficient speed for processing tasks, enhancing application responsiveness.

Maximum Time At Peak Reflow Temperature (s): 30

The optimized reflow time ensures minimal thermal stress during manufacturing, preserving component integrity.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates compatibility with modern soldering processes, enhancing manufacturability.

Length: 10 mm

With a compact length of 10 mm, it supports designs requiring minimal board space.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability and stability under harsh operational conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture leads to efficient instruction execution, optimizing performance in embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, which is critical for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easy handling and effective soldering, supporting reliable assembly.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V ensures low power operation, ideal for energy-sensitive applications.

PWM Channels: YES

The presence of PWM channels enables effective control for various applications, such as motor speed or LED dimming.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and modifications, enhancing the flexibility of design.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for higher density of connections, beneficial for compact design requirements.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that proper handling and storage are manageable, supporting reliable production.

Speed: 66 rpm

A speed of 66 rpm allows for adequate performance in various automation tasks, making it versatile in applications.

No. of I/O Lines: 32

With 32 I/O lines, it provides a robust interface for connecting to multiple peripherals, enhancing functionality.

Technical Specifications

Microcontrollers STA2051GO attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Additional Features:

IT ALSO OPERATES AT 3.3 V I/O SUPPLY

Address Bus Width:

0

Bit Size:

32

Maximum Clock Frequency:

66 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

32

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

66 rpm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

STA2051GO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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