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ST8004CD

STMicroelectronics

ST8004CD by STMicroelectronics

ST8004CD by STMicroelectronics is a versatile interface IC with a max supply voltage of 6.5V and operates b/w -25 °C to 85 °C. It features a compact 28-terminal design in a small outline package, ideal for space-constrained applications. This device supports nominal voltages of 3.3V and 5V, making it suitable for various electronic interfaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 13,000 parts In-Stock

1+ parts

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13,000

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Digiode

USA . 3,038 parts In-Stock

1+ parts

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3,038

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Vyrian

USA . 2,039 parts In-Stock

1+ parts

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2,039

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Anansix

USA . 1,366 parts In-Stock

1+ parts

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1,366

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M&R Communications

USA . 47 parts In-Stock

1+ parts

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 937 parts In-Stock

1+ parts

$4.158

100+ parts

-

1k+ parts

$3.743

10k+ parts

-

937

$4.158

-

$3.743

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MKK Technologies

India . 1,324 parts In-Stock

1+ parts

$7.820

100+ parts

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1,324

$7.820

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DigiPath Technology Company

USA . 1,324 parts In-Stock

1+ parts

$7.820

100+ parts

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1,324

$7.820

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Corphita

USA . 1,766 parts In-Stock

1+ parts

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1,766

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Parana Technologies

USA . 110 parts In-Stock

1+ parts

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100+ parts

$4.972

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110

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$4.972

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Overview

Elevate your designs with the ST8004CD from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile interface IC combines reliability with exceptional performance, making it ideal for automotive, consumer electronics, and industrial applications. With robust temperature resilience and compact packaging, it ensures seamless integration and long-lasting durability. Choose the ST8004CD to unlock unparalleled functionality and enhance your product's value today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection against environmental factors, making this IC reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making integration into modern PCBs easier.

Maximum Supply Voltage: 6.5 V

A high maximum supply voltage enhances flexibility for use in different circuits without the risk of damage.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB and simplifies layout design, making it suitable for space-constrained applications.

No. of Terminals: 28

With 28 terminals, this IC offers multiple connectivity options, enabling complex interfacing capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for modern electronics, allowing for dense packing of components on circuit boards.

Minimum Supply Voltage: 2.7 V

A low minimum supply voltage ensures compatibility with low-power systems, making it energy-efficient.

Maximum Operating Temperature: 85 °C

Withstanding temperatures up to 85 °C ensures reliable performance in a wide range of operating conditions, suitable for both industrial and consumer applications.

Minimum Operating Temperature: -25 °C

The ability to operate at low temperatures expands its usability in environments where other components may fail.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and enhances solderability, ensuring long-lasting connections.

Terminal Position: DUAL

Dual terminal positioning facilitates versatile mounting options, optimizing space and layout on circuit boards.

Maximum Seated Height: 2.65 mm

A compact seated height allows for low-profile designs, essential for modern electronic devices that require slim form factors.

Width: 7.5 mm

A moderate width allows for compatibility with various PCB designs while maintaining a compact footprint where space is a premium.

Maximum Time At Peak Reflow Temperature: 30 s

Short reflow times reduce the risk of thermal damage to the IC, ensuring component longevity during assembly.

Peak Reflow Temperature: 250 °C

The high peak reflow temperature provides flexibility for various soldering processes, compatible with most assembly lines.

Length: 17.9 mm

The length is optimized for fitting into a range of applications, making it adaptable for different circuit designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and automated assembly processes, enhancing manufacturing efficiency.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is widely used in digital circuits, making this IC a versatile choice for many applications.

Nominal Supply Voltage-1: 5 V

Compatibility with a nominal supply voltage of 5 V allows for use in both lower and higher power applications, broadening its utility.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates the product can withstand moderate humidity levels, making it reliable for most environments.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC is ideal for communication between different components, making it essential for complex electronic systems.

Technical Specifications

Other Function Interface ICs ST8004CD attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

6.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Maximum Supply Voltage-1:

6.5 V

Minimum Supply Voltage-1:

4.5 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ST8004CD Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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