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ST802RT1AFR

STMicroelectronics

ST802RT1AFR by STMicroelectronics

ST802RT1AFR by STMicroelectronics is a CMOS interface IC designed for industrial applications. It operates b/w -40 °C to 105 °C, with a nominal voltage of 3.3V and features a compact 48-terminal flatpack design. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,339 parts In-Stock

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11,339

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Digiode

USA . 3,007 parts In-Stock

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3,007

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Anansix

USA . 893 parts In-Stock

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893

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,062 parts In-Stock

1+ parts

$9.813

100+ parts

-

1k+ parts

$8.831

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1,062

$9.813

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$8.831

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MKK Technologies

India . 1,215 parts In-Stock

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$18.452

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1,215

$18.452

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DigiPath Technology Company

USA . 1,215 parts In-Stock

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$18.452

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1,215

$18.452

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AZTECH Wire

Italy . 1,170 parts In-Stock

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$18.810

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1,170

$18.810

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Microchip USA

USA . 306 parts In-Stock

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$49.066

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306

$49.066

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A-Z Elektronik GmbH

Germany . 4,500 parts In-Stock

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4,500

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Corphita

USA . 3,599 parts In-Stock

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3,599

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Vigor

Singapore . 3,436 parts In-Stock

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3,436

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 487 parts In-Stock

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$11.733

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487

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$11.733

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Overview

Unleash the power of innovation with the ST802RT1AFR from STMicroelectronics! This state-of-the-art interface IC is designed for reliability in diverse applications, offering robust performance under extreme conditions. With a commitment to quality and excellence, STMicroelectronics ensures that you receive unmatched value through superior technology and durability. Elevate your projects with a product that promises efficiency, longevity, and seamless integration into your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and reliability, making it suitable for various industrial applications.

Surface Mount: YES

Being a surface mount device allows for efficient use of space on PCB, enabling more compact designs.

Maximum Supply Voltage: 3.45 V

The maximum supply voltage of 3.45 V allows for compatibility with a wide range of low-power applications.

Package Shape: SQUARE

The square shape optimizes space on the PCB and allows for easier integration into existing designs.

No. of Terminals: 48

With 48 terminals, this IC offers extensive functionality and connection options for complex applications.

Package Style (Meter): FLATPACK

Flatpack packaging enhances heat dissipation and can help in achieving lower profiles on PCBs.

Minimum Supply Voltage: 3.15 V

The minimum supply voltage of 3.15 V ensures stable operation in varying power conditions, making it versatile.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C allows the product to operate in high-temperature environments, enhancing reliability.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures (-40 °C) makes it suitable for harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning aids in effective signal routing and reduces the chances of crosstalk.

Maximum Seated Height: 1.6 mm

With a low seated height, this IC can be easily integrated into low-profile applications.

Width: 7 mm

A width of 7 mm allows for compact integration while maintaining necessary functionalities.

Maximum Time At Peak Reflow Temperature (s): 40

The extended peak reflow time enhances solder joint reliability during assembly processes.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows for compatibility with modern soldering techniques.

Length: 7 mm

The 7 mm length, paired with its width, provides balanced dimensions for effective mounting.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this IC is built for demanding applications, ensuring performance consistency.

Technology: CMOS

Using CMOS technology enhances power efficiency and enables high-speed performance.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering methods and improve mechanical stability on the PCB.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V aligns well with many digital systems and enhances compatibility.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for a compact layout while maintaining reliable connections.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate sensitivity to moisture, ensuring appropriate handling in assembly processes.

Interface IC Type: INTERFACE CIRCUIT

Designed as an interface circuit, this IC is ideal for seamless communication between different components.

Technical Specifications

Other Function Interface ICs ST802RT1AFR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.45 V

Minimum Supply Voltage:

3.15 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

ST802RT1AFR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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