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ST8004CDR

STMicroelectronics

ST8004CDR by STMicroelectronics

ST8004CDR by STMicroelectronics is a small outline interface IC with 28 terminals. It operates b/w -25 to 85°C, with supply voltage ranging from 2.7V to 6.5V. The package material is plastic/epoxy, making it suitable for various function interface applications.

Median Price

$1.230

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 981 parts In-Stock

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$0.786

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981

$0.786

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Chip1Stop

Japan . 981 parts In-Stock

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$1.230

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981

$1.230

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DigiKey

USA . 488 parts In-Stock

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$1.650

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$0.976

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$0.918

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488

$1.650

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$0.918

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Verical

USA . 981 parts In-Stock

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981

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Digiode

USA . 4,430 parts In-Stock

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$0.736

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$0.736

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Bristol Electronics

USA . 13,867 parts In-Stock

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Vyrian

USA . 12,114 parts In-Stock

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Anansix

USA . 2,591 parts In-Stock

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J2 Sourcing AB

Sweden . 2,200 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 1,964 parts In-Stock

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Dan-Mar Components

USA . 993 parts In-Stock

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A&K Electronics

USA . 858 parts In-Stock

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Rotakorn

Sweden . 858 parts In-Stock

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858

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Cyclops Electronics Ltd

UK . 190 parts In-Stock

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190

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

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100

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ComSIT USA

USA . 100 parts In-Stock

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100

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LWI Electronics Inc

India . 87 parts In-Stock

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Microfarads

USA . 27 parts In-Stock

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Martec Srl

Italy . 18 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 453 parts In-Stock

1+ parts

$0.660

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453

$0.660

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Corphita

USA . 739 parts In-Stock

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$0.698

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739

$0.698

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Vigor

Singapore . 988 parts In-Stock

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$1.310

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988

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Microchip USA

USA . 220 parts In-Stock

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$1.978

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IDEA Electronic Components Group

UK . 6 parts In-Stock

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$11.160

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$10.044

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$10.044

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MKK Technologies

India . 92 parts In-Stock

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$20.985

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DigiPath Technology Company

USA . 92 parts In-Stock

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$20.985

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Kepictronics

USA . 54,000 parts In-Stock

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Perfect Parts

USA . 48,082 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 10,979 parts In-Stock

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Lixinc

USA . 8,193 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Parana Technologies

USA . 1,707 parts In-Stock

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$13.343

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Netroflash

USA . 1,000 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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GreenTree Electronics

Israel . 190 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the ST8004CDR by STMicroelectronics. Crafted with precision and expertise, this interface circuit offers seamless connectivity and enhanced functionality. From consumer electronics to industrial applications, this versatile product delivers unmatched performance and reliability. Experience the convenience and efficiency that only STMicroelectronics can provide. Upgrade your systems today with the ST8004CDR and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components due to its durability and resistance to heat and chemicals.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 6.5 V

Can handle higher supply voltages, providing flexibility in design and operation.

Package Shape: RECTANGULAR

Compact shape that is easy to handle and integrate into circuit layouts.

Minimum Supply Voltage: 2.7 V

Works efficiently even at lower supply voltages, conserving energy and reducing heat dissipation.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: -25 °C

Capable of operating in cold temperatures without compromising functionality.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity, corrosion resistance, and solderability for long-term reliability.

Maximum Seated Height: 2.65 mm

Low profile design for space-constrained applications.

Terminal Form: GULL WING

Allows for easy inspection and rework during assembly processes.

Nominal Supply Voltage: 3.3 V

Common voltage level for compatibility with a wide range of systems and components.

Moisture Sensitivity Level (MSL): 3

Suitable for standard moisture exposure levels during handling and storage.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing different components or systems, offering versatile connectivity options.

Technical Specifications

Other Function Interface ICs ST8004CDR attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Additional Features:

ALSO OPERATES AT 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

6.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ST8004CDR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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