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ST7FSCR1R4T1

STMicroelectronics

ST7FSCR1R4T1 by STMicroelectronics

ST7FSCR1R4T1 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 8 MHz, operating b/w 4-5.5 V. It offers 16 KB ROM and 768 B RAM, ideal for low-power applications in consumer electronics. Its compact design ensures efficient space utilization in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,743 parts In-Stock

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2,743

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Digiode

USA . 1,220 parts In-Stock

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1,220

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Anansix

USA . 198 parts In-Stock

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198

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Microchip USA

USA . 452 parts In-Stock

1+ parts

$7.279

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452

$7.279

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AZTECH Wire

Italy . 1,005 parts In-Stock

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$18.620

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1,005

$18.620

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IDEA Electronic Components Group

UK . 2,083 parts In-Stock

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$53.412

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$48.070

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2,083

$53.412

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$48.070

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MKK Technologies

India . 1,611 parts In-Stock

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$100.437

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1,611

$100.437

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DigiPath Technology Company

USA . 1,611 parts In-Stock

1+ parts

$100.437

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1,611

$100.437

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A-Z Elektronik GmbH

Germany . 6,654 parts In-Stock

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6,654

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Vigor

Singapore . 6,000 parts In-Stock

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6,000

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Corphita

USA . 4,460 parts In-Stock

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4,460

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Parana Technologies

USA . 1,968 parts In-Stock

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$63.862

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1,968

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$63.862

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Kepictronics

USA . 220 parts In-Stock

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Overview

Unlock the potential of your projects with the ST7FSCR1R4T1 microcontroller from STMicroelectronics. Renowned for its outstanding quality and reliability, this low-profile chip offers seamless integration and versatility for various applications, from consumer electronics to industrial automation. With exceptional power efficiency and a robust design, it empowers developers to create innovative solutions while ensuring long-term performance and durability. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and resistance to thermal stress, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a smaller footprint on PCBs, facilitating compact designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility in integration with standard power supplies.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on circuit boards.

Bit Size: 8

An 8-bit architecture is suitable for low-power, cost-effective applications.

Power Supplies (V): 5

The 5V power supply requirement is common, simplifying design and procurement of components.

No. of Terminals: 64

With 64 terminals, this microcontroller can support a variety of peripherals and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for applications requiring space-saving solutions.

Minimum Supply Voltage: 4 V

A minimum supply voltage of 4V allows for operation in a range of power supply scenarios.

Maximum Operating Temperature: 70 °C

The maximum operating temperature of 70 °C ensures reliability in moderate environmental conditions.

CPU Family: ST72

Being part of the ST72 family indicates proven technology and support within a popular microcontroller series.

Minimum Operating Temperature: 0 °C

The operational temperature range starting from 0 °C makes this microcontroller versatile for various climates.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and prevents oxidation, ensuring reliable connections.

Terminal Position: QUAD

Quad terminal positioning allows for effective use of space and easier routing in PCB layouts.

ROM Words: 16384

With 16KB of ROM, ample space is available for code storage, suitable for complex applications.

Maximum Seated Height: 1.6 mm

A low seated height supports space-efficient designs in compact devices.

Width: 14 mm

A width of 14 mm contributes to the compact profile, fitting well in space-constrained applications.

Maximum Clock Frequency: 8 MHz

The 8 MHz clock frequency is sufficient for many control and monitoring applications, offering a balance of performance and power consumption.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum peak reflow time of 30 seconds is crucial for efficient manufacturing processes.

Peak Reflow Temperature: 250 C

The peak reflow temperature of 250 °C allows compatibility with lead-free soldering solutions.

Length: 14 mm

The compact length of 14 mm suits compact electronic designs, making it easier to fit into small enclosures.

Temperature Grade: COMMERCIAL

Commercial temperature grading ensures the device can function adequately in typical consumer environments.

Peripheral IC Type: MICROCONTROLLER

Designed as a microcontroller, this IC is versatile for controlling embedded systems and devices.

RAM Bytes: 768

The 768 bytes of RAM supports moderate data processing, sufficient for many embedded applications.

Technology: CMOS

CMOS technology offers lower power consumption, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form is preferred for easy soldering and reliable connections in surface mount applications.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA contributes to low power consumption, enhancing battery life in portable devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V aligns well with most digital circuits, offering ease of integration.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and reprogramming, increasing the device's longevity.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch is suitable for high-density PCB designs, enhancing connectivity.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates handling precautions that ensure reliability during manufacturing and assembly.

Speed: 8 rpm

At 8 rpm, this microcontroller is capable of managing gradual processes effectively.

No. of I/O Lines: 31

With 31 I/O lines, this microcontroller can interface with multiple peripherals, making it highly versatile.

Technical Specifications

Microcontrollers ST7FSCR1R4T1 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

NO

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

31

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

PWM Channels:

NO

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.6SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

250

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

15 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

ST7FSCR1R4T1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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