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ST7FOXK1T6

STMicroelectronics

ST7FOXK1T6 by STMicroelectronics

ST7FOXK1T6 microcontroller from STMicroelectronics features a 5V supply, 32 terminals, and operates in -40 °C to 85°C. With 10 ADC channels and a max clock frequency of 16 MHz, it's ideal for industrial applications requiring reliable performance. Its compact design ensures efficient integration in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,676 parts In-Stock

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8,676

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Anansix

USA . 2,387 parts In-Stock

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2,387

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Digiode

USA . 1,315 parts In-Stock

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1,315

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Distributors (Availability)

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Vigor

Singapore . 1,203 parts In-Stock

1+ parts

$1.030

100+ parts

-

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1,203

$1.030

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Microchip USA

USA . 331 parts In-Stock

1+ parts

$2.394

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-

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331

$2.394

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AZTECH Wire

Italy . 664 parts In-Stock

1+ parts

$18.470

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664

$18.470

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IDEA Electronic Components Group

UK . 1,373 parts In-Stock

1+ parts

$59.054

100+ parts

-

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$53.148

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1,373

$59.054

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$53.148

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MKK Technologies

India . 265 parts In-Stock

1+ parts

$111.047

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265

$111.047

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DigiPath Technology Company

USA . 265 parts In-Stock

1+ parts

$111.047

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265

$111.047

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RC Electronics

USA . 17,905 parts In-Stock

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17,905

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Authorized Procurement Solutions

USA . 4,721 parts In-Stock

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4,721

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A-Z Elektronik GmbH

Germany . 2,160 parts In-Stock

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2,160

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Corphita

USA . 1,951 parts In-Stock

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1,951

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Parana Technologies

USA . 203 parts In-Stock

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$70.608

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203

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$70.608

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Elevate your projects with the ST7FOXK1T6 microcontroller from STMicroelectronics, a beacon of reliability and innovation. Engineered for excellence, this low-profile powerhouse offers unmatched performance in diverse applications, from industrial automation to consumer electronics. With its robust design and superior ADC capabilities, you can expect precision and efficiency, making it the ideal choice for your next groundbreaking development. Trust STMicroelectronics for quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body provides excellent protection against environmental factors, ensuring reliability in various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and automated assembly, making it ideal for modern electronics.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V allows the microcontroller to be used in a wide range of circuits powered by standard voltages.

Package Shape: SQUARE

The square package shape contributes to efficient PCB space utilization, making it easier to integrate into different designs.

Bit Size: 8

The 8-bit architecture is suitable for many simple applications, providing sufficient processing power while simplifying programming.

Power Supplies (V): 5

Operating at 5V simplifies design by allowing compatibility with common power supplies.

No. of Terminals: 32

With 32 terminals, this microcontroller provides ample connectivity options for peripherals and I/O lines.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design is ideal for space-constrained applications, ensuring a sleek integration into designs.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5 V makes this microcontroller versatile for low-power applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures the microcontroller can function reliably in moderate to high-temperature environments.

CPU Family: ST72

Part of the ST72 family, this microcontroller benefits from robust support and development resources.

Minimum Operating Temperature: -40 °C

Capable of operating at -40 °C makes it suitable for use in extreme environments, such as outdoor and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The高-quality terminal finish provides excellent corrosion resistance, enhancing the longevity of the connection.

ADC Channels: YES

Integrated ADC channels allow for direct analog signal processing, enhancing the versatility of applications.

Terminal Position: QUAD

Quad terminal position enables easier placement on PCBs while providing enhanced connectivity.

ROM Words: 4096

With 4096 ROM words, this microcontroller can store sufficient firmware or application code for various projects.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm is advantageous in applications where height limitations are critical.

Width: 7 mm

Compact width of 7 mm makes it suitable for devices with limited space, ensuring design flexibility.

Peripherals: TIMER(5)

Having 5 timers enables precise time control for versatile timing and counting applications.

Maximum Clock Frequency: 16 MHz

A clock frequency of 16 MHz ensures that the microcontroller can handle specialized tasks efficiently.

Maximum Time At Peak Reflow Temperature (s): 30

Supports soldering processes without damaging the microcontroller, ensuring reliable assembly.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C provides compatibility with modern soldering methods, ensuring robust manufacturing.

Length: 7 mm

A compact length of 7 mm allows for tight layout designs, optimizing PCB space usage.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability in harsh operational environments, enhancing product longevity.

Peripheral IC Type: MICROCONTROLLER

As a microcontroller, it integrates multiple functions in a single chip, reducing component count and assembly complexity.

RAM Bytes: 384

384 bytes of RAM provide sufficient memory for handling basic tasks and temporary data storage.

Technology: CMOS

Using CMOS technology ensures low power consumption while maintaining performance, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections during assembly.

Analog To Digital Convertors: 10-Ch 10-Bit

The presence of a 10-channel 10-bit ADC allows for versatile analog signal handling and precise data acquisition.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA ensures efficient power usage, making it ideal for battery-powered applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V aligns with mainstream electronic systems for ease of integration.

PWM Channels: YES

The inclusion of PWM channels is advantageous for motor control and other applications requiring precise signal modulation.

Connectivity: I2C

I2C connectivity provides an efficient means of communication between multiple devices, enhancing system design flexibility.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to firmware, ensuring long-term usability.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch is ideal for modern PCB designs, providing compact layout options without sacrificing performance.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate humidity sensitivity, facilitating effective storage and handling procedures.

Speed: 8 rpm

A speed specification of 8 rpm may indicate suitability for specific low-speed applications, reinforcing design relevance.

On Chip Program ROM Width: 8

The 8-bit program ROM width allows for efficient data handling and simple programming for users.

No. of I/O Lines: 24

With 24 I/O lines, this microcontroller offers significant flexibility for interfacing with various devices and sensors.

Technical Specifications

Microcontrollers ST7FOXK1T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

24

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C

Peripherals:

TIMER(5)

Analog To Digital Convertors:

10-Ch 10-Bit

Trade Compliance

ST7FOXK1T6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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