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ST7FOXF1M6

STMicroelectronics

ST7FOXF1M6 by STMicroelectronics

ST7FOXF1M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 16 MHz, operating b/w -40 °C to 85°C. It supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient surface mounting in various devices.

Median Price

$0.994

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,934 parts In-Stock

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Anansix

USA . 2,789 parts In-Stock

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2,789

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Digiode

USA . 739 parts In-Stock

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739

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Bristol Electronics

USA . 120 parts In-Stock

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$0.994

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120

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$0.994

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Microfarads

USA . 116 parts In-Stock

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116

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Distributors (Availability)

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Microchip USA

USA . 489 parts In-Stock

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$10.931

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489

$10.931

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AZTECH Wire

Italy . 844 parts In-Stock

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$15.010

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844

$15.010

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IDEA Electronic Components Group

UK . 1,489 parts In-Stock

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$55.047

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$49.543

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1,489

$55.047

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$49.543

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Component Stockers USA

USA . 286 parts In-Stock

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$99.990

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286

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MKK Technologies

India . 1,588 parts In-Stock

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$103.513

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1,588

$103.513

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DigiPath Technology Company

USA . 1,588 parts In-Stock

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$103.513

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1,588

$103.513

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A-Z Elektronik GmbH

Germany . 5,111 parts In-Stock

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Corphita

USA . 4,866 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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Kepictronics

USA . 1,170 parts In-Stock

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Parana Technologies

USA . 624 parts In-Stock

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$65.817

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$65.817

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Overview

Unlock new possibilities with the ST7FOXF1M6 microcontroller from STMicroelectronics, a leader in innovative technology! This compact and durable device is perfect for a wide range of applications, from industrial automation to consumer electronics. With its robust performance and reliable quality, the ST7FOXF1M6 ensures seamless integration into your projects, offering exceptional value and efficiency that elevate your designs while minimizing power consumption. Experience unmatched versatility and superior support from a trusted manufacturer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures a lightweight and durable design, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient assembly and reduced footprint on PCBs, facilitating compact design.

Maximum Supply Voltage: 5.5 V

Operates at a safe maximum voltage, ensuring compatibility with standard power supplies and low power operation.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient space utilization on the circuit board.

Bit Size: 8

An 8-bit architecture is ideal for simple control applications, providing an economical solution for low-end computing tasks.

Power Supplies (V): 5

Compatible with common 5V power supplies, simplifying design and reducing the need for voltage regulation.

No. of Terminals: 20

The 20 terminals provide ample connectivity options for peripherals and components in a variety of applications.

Package Style (Meter): SMALL OUTLINE

Small outline package enables space-efficient designs, allowing for more compact electronic devices.

Minimum Supply Voltage: 4.5 V

Wide input voltage range ensures reliable operation in various environmental and operational conditions.

Maximum Operating Temperature: 85 °C

High maximum temperature rating makes it suitable for industrial applications where heat management is crucial.

CPU Family: ST72

Part of the reliable STMicroelectronics family, known for stability and performance in embedded applications.

Minimum Operating Temperature: -40 °C

Designed to function in extreme cold conditions, suitable for outdoor and industrial environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent corrosion resistance and electrical performance, enhancing longevity.

ADC Channels: YES

The inclusion of ADC channels allows for analog data processing, useful for sensor integration.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and facilitates efficient connection to other components.

ROM Words: 4096

4096 ROM words provide ample space for program storage, enabling complex applications to be developed.

Maximum Seated Height: 2.65 mm

Low seated height facilitates integration into slim designs and helps with compact assembly.

Width: 7.5 mm

The slender width makes this microcontroller a good option for tight spaces in electronic designs.

Maximum Clock Frequency: 16 MHz

16 MHz clock frequency is suitable for performance-demanding applications while balancing power consumption.

Length: 12.8 mm

Compact length allows this microcontroller to fit into a variety of packaging and application layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade enhances reliability and performance in harsh operating conditions.

Peripheral IC Type: MICROCONTROLLER

A versatile microcontroller suited for a wide range of control applications in embedded systems.

RAM Bytes: 384

384 bytes of RAM provides sufficient space for temporary data processing, enhancing efficiency in applications.

Technology: CMOS

CMOS technology ensures lower power consumption and higher integration, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals ensure ease of soldering and reliable electrical connections during assembly.

Maximum Supply Current: 9 mA

Low current consumption helps in optimizing energy usage, extending battery life in portable applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage is ideal for compatibility with a wide array of devices, simplifying design considerations.

PWM Channels: YES

Support for PWM channels is essential for applications requiring motor control and light dimming capabilities.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and modifications, adding flexibility to design processes.

Terminal Pitch: 1.27 mm

Standard terminal pitch aids in compatibility with various mounting technologies and improves assembly efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates the product's ability to withstand certain levels of humidity, important for long-term storage and reliability.

Speed: 8 rpm

Speed performance is suitable for many industrial and automation applications where precise control is required.

No. of I/O Lines: 17

17 I/O lines offer significant flexibility for interfacing with multiple sensors and actuators in your design.

Technical Specifications

Microcontrollers ST7FOXF1M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

384

ROM Words:

4096

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

ST7FOXF1M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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