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ST7FOXA0M6

STMicroelectronics

ST7FOXA0M6 by STMicroelectronics

ST7FOXA0M6 microcontroller from STMicroelectronics features an 8-bit CPU with a max clock frequency of 8 MHz and operates within -40 °C to 85°C. It supports ADC and PWM channels, making it ideal for industrial applications. Its compact design ensures efficient surface mounting in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,579 parts In-Stock

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Digiode

USA . 744 parts In-Stock

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744

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Anansix

USA . 233 parts In-Stock

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233

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Distributors (Availability)

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Microchip USA

USA . 144 parts In-Stock

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$5.275

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144

$5.275

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AZTECH Wire

Italy . 92 parts In-Stock

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$18.120

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92

$18.120

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IDEA Electronic Components Group

UK . 713 parts In-Stock

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$57.782

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$52.003

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713

$57.782

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$52.003

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MKK Technologies

India . 1,791 parts In-Stock

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$108.654

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$108.654

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DigiPath Technology Company

USA . 1,791 parts In-Stock

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$108.654

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1,791

$108.654

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A-Z Elektronik GmbH

Germany . 6,728 parts In-Stock

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6,728

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Corphita

USA . 3,093 parts In-Stock

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Vigor

Singapore . 1,952 parts In-Stock

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1,952

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Parana Technologies

USA . 1,353 parts In-Stock

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$69.087

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1,353

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$69.087

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Kepictronics

USA . 267 parts In-Stock

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Overview

Unlock innovation with the ST7FOXA0M6 microcontroller from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for versatility, this compact powerhouse delivers exceptional performance across various applications, from industrial controls to consumer electronics. Its robust temperature range ensures reliability in demanding environments, while its ease of integration accelerates your development process, empowering you to bring your ideas to life faster than ever. Elevate your projects with the trusted quality and innovative advantages that STMicroelectronics offers!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protects the microcontroller from environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, enabling more flexible PCB layouts and saving space in applications.

Maximum Supply Voltage: 5.5 V

The ability to handle a maximum supply voltage of 5.5 V ensures compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular package shape is efficient for fitting onto standard PCB layouts, which facilitates easier integration into designs.

Bit Size: 8

An 8-bit architecture is suitable for simple control tasks and applications requiring lower processing power, making it cost-effective.

Power Supplies (V): 5

Designed to operate at a nominal supply voltage of 5 V, this microcontroller is widely compatible with common electronic systems.

No. of Terminals: 8

Having 8 terminals allows for a straightforward connection and makes it ideal for simple applications with fewer I/O requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for efficient component placement on PCBs, contributing to smaller device designs.

Minimum Supply Voltage: 4.5 V

The ability to operate down to 4.5 V provides flexibility in power management, enhancing the suitability for battery-operated devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this microcontroller is suitable for industrial applications where environmental conditions can be challenging.

CPU Family: ST72

The ST72 CPU family is known for its robustness and efficiency, offering a reliable choice for various embedded applications.

Minimum Operating Temperature: -40 °C

The capability to function at -40 °C makes this microcontroller ideal for harsh environments, ensuring performance in extreme conditions.

ADC Channels: YES

Integrated ADC channels enhance functionality, enabling the microcontroller to process analog signals, which is valuable in sensor applications.

Terminal Position: DUAL

Dual terminal positioning improves connectivity options, making it easier to interface with other components on a PCB.

ROM Words: 2048

With 2048 ROM words, the microcontroller provides sufficient program storage for a variety of applications without compromising performance.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, which is advantageous in compact electronic devices.

Width: 3.9 mm

The compact width allows for integration into space-constrained designs while ensuring sufficient performance.

Maximum Clock Frequency: 8 MHz

Operating at a maximum clock frequency of 8 MHz is adequate for many low-power applications, balancing performance and energy efficiency.

Length: 4.9 mm

The length of 4.9 mm is optimized for space-saving in PCB designs, making it suitable for miniaturized electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability over a wide temperature range, making it suitable for rugged applications.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller means it integrates processing capability with input/output features for controlling devices efficiently.

RAM Bytes: 128

With 128 bytes of RAM, it can handle a minimal amount of data processing and temporary storage requirements, suitable for simpler applications.

Technology: CMOS

CMOS technology enhances power efficiency, which is crucial for battery-operated and low-power applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and provide solid mechanical connections for reliable operation.

Maximum Supply Current: 9 mA

A maximum supply current of 9 mA indicates low power consumption, making it very suitable for energy-sensitive applications.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V enhances compatibility with various peripheral devices and power supplies.

PWM Channels: YES

With PWM channels available, this microcontroller can efficiently control motors and other devices that require variable outputs.

ROM Programmability: FLASH

Flash programmability allows for easy updates and modifications to the program via software, improving overall design flexibility.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm ensures compatibility with many PCB design standards, making it easier to integrate with existing layouts.

Speed: 8 rpm

Operating at a speed of 8 rpm indicates suitability for low-speed applications, such as sensors and simple actuators.

No. of I/O Lines: 6

Having 6 I/O lines allows for basic interfacing with other components, sufficient for simple tasks and control applications.

Technical Specifications

Microcontrollers ST7FOXA0M6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

8 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of I/O Lines:

6

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

128

ROM Words:

2048

ROM Programmability:

FLASH

Maximum Seated Height:

1.75 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Peripheral IC Type:

Trade Compliance

ST7FOXA0M6 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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