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ST7FMC1K4T6

STMicroelectronics

ST7FMC1K4T6 by STMicroelectronics

ST7FMC1K4T6 microcontroller from STMicroelectronics features an 8-bit CPU, operates at a max voltage of 5.5V, and includes 8 ADC channels. With a temp range of -40 °C to 85 °C, it's ideal for industrial applications requiring reliable performance. Its compact design supports various connectivity options like LIN and SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,641 parts In-Stock

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Digiode

USA . 1,440 parts In-Stock

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1,440

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Chip Stock

USA . 1,036 parts In-Stock

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Anansix

USA . 160 parts In-Stock

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160

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Distributors (Availability)

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Microchip USA

USA . 367 parts In-Stock

1+ parts

$8.613

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367

$8.613

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AZTECH Wire

Italy . 57 parts In-Stock

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$20.870

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57

$20.870

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IDEA Electronic Components Group

UK . 1,050 parts In-Stock

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$52.149

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$46.934

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1,050

$52.149

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$46.934

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MKK Technologies

India . 700 parts In-Stock

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$98.063

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700

$98.063

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DigiPath Technology Company

USA . 700 parts In-Stock

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$98.063

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700

$98.063

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QUARKTWIN TECHNOLOGY LTD

USA . 26,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,109 parts In-Stock

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Corphita

USA . 4,533 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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Vigor

Singapore . 3,271 parts In-Stock

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Metaverse IC Inc.

Canada . 2,482 parts In-Stock

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Perfect Parts

USA . 560 parts In-Stock

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Futuretech Components

Singapore . 222 parts In-Stock

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Parana Technologies

USA . 189 parts In-Stock

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$62.352

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189

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$62.352

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GreenTree Electronics

Israel . 154 parts In-Stock

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Overview

Unlock innovation with the ST7FMC1K4T6 microcontroller from STMicroelectronics. Renowned for excellence, STMicroelectronics delivers unparalleled quality and reliability, making this microcontroller ideal for diverse applications like industrial automation, consumer electronics, and automotive systems. With its compact design and robust performance in extreme conditions, the ST7FMC1K4T6 empowers engineers to create efficient, cutting-edge solutions while ensuring longevity and peace of mind. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, enhancing the longevity of the microcontroller.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, making integration into various applications simpler.

Maximum Supply Voltage: 5.5 V

The ability to operate safely up to 5.5 V allows for greater flexibility in power supply options.

Package Shape: SQUARE

The square package shape is convenient for PCB layout and design, facilitating easier integration into circuit boards.

Bit Size: 8

The 8-bit architecture suits many general-purpose applications, providing a balance of performance and resource efficiency.

Power Supplies (V): 5

Operating at a nominal supply voltage of 5 V is standard in many applications, ensuring compatibility and ease of use.

No. of Terminals: 32

Having 32 terminals allows for extensive connectivity options, making the controller versatile for various projects.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack style is suitable for space-constrained designs, allowing for more streamlined product development.

Minimum Supply Voltage: 3.8 V

With a minimum supply voltage of 3.8 V, the microcontroller is capable of operating in a wider range of voltage conditions.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes this microcontroller suitable for industrial applications where temperature extremes may occur.

CPU Family: ST72

The ST72 CPU family is well-regarded, providing robust performance and compatibility with various peripherals.

Minimum Operating Temperature: -40 °C

Operating from -40 °C makes this microcontroller ideal for harsh environments, ensuring reliable performance in extreme conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and helps prevent oxidation, ensuring reliable connections.

ADC Channels: YES

Integrated ADC channels allow for easy sensor interfacing, enhancing the application range of this microcontroller.

Terminal Position: QUAD

Quad terminal position facilitates efficient space usage on PCBs, making the design more compact and organized.

ROM Words: 16384

With 16K words of ROM, this microcontroller can store a significant amount of program code, suitable for complex applications.

Maximum Seated Height: 1.6 mm

The low seated height enhances the overall design profile and is ideal for low-profile applications.

Width: 7 mm

A compact width of 7 mm makes it suitable for tight spaces while providing sufficient connectivity.

Peripherals: TIMER(5)

Multiple timers enhance functionality in timing applications, making it a strong choice for control systems.

Maximum Clock Frequency: 16 MHz

A maximum clock frequency of 16 MHz provides adequate processing speed for most embedded applications.

Maximum Time At Peak Reflow Temperature (s): 30

Supporting a longer reflow time increases manufacturing flexibility, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 235

The microcontroller can handle higher reflow temperatures, ensuring better assembly processes.

Length: 7 mm

A length of 7 mm contributes to the compact design, enhancing versatility in various applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade assures reliability in demanding conditions, making it suitable for critical systems.

Peripheral IC Type: MICROCONTROLLER

As a dedicated microcontroller, it is optimized for processing and control applications, ensuring efficiency.

RAM Bytes: 768

With 768 bytes of RAM, it can handle moderate data requirements in embedded applications.

Technology: CMOS

CMOS technology offers low power consumption, making this microcontroller energy-efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and minimize PCB space usage.

Analog To Digital Converters: 8-Ch 10-Bit

The presence of 8-channel 10-bit ADCs allows for high-precision analog signal conversions, expanding application capabilities.

Maximum Supply Current: 18 mA

A low maximum supply current helps in reducing overall power consumption, extending battery life in portable devices.

Nominal Supply Voltage: 5 V

Standard supply voltage ensures compatibility with a wide range of existing circuits and designs.

PWM Channels: YES

Having PWM channels facilitates motor control and other signal modulation applications, broadening usage possibilities.

Connectivity: LIN, SCI, SPI

Multiple connectivity options make it versatile for communication in various embedded systems applications.

ROM Programmability: FLASH

Flash programmability allows for easy updates and reprogramming without hardware changes, improving flexibility.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch balances space and ease of soldering, ideal for high-density designs.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, it requires standard handling procedures, ensuring reliability in assembly.

Speed: 8 rpm

An operational speed of 8 rpm could be suitable for specific control applications, enhancing application versatility.

On Chip Program ROM Width: 8

The 8-bit ROM width is efficient for smaller applications, providing adequate storage for embedded programs.

No. of I/O Lines: 17

With 17 I/O lines available, it's capable of interfacing with various peripherals and devices, enhancing its utility.

Technical Specifications

Microcontrollers ST7FMC1K4T6 attributes and parameters. Explore more Microcontrollers devices from STMicroelectronics

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

ST72

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

17

No. of Terminals:

32

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

768

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

18 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

LIN, SCI, SPI

Peripherals:

TIMER(5)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

ST7FMC1K4T6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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